CN110244278A - A kind of laser radar radiator - Google Patents
A kind of laser radar radiator Download PDFInfo
- Publication number
- CN110244278A CN110244278A CN201910436157.1A CN201910436157A CN110244278A CN 110244278 A CN110244278 A CN 110244278A CN 201910436157 A CN201910436157 A CN 201910436157A CN 110244278 A CN110244278 A CN 110244278A
- Authority
- CN
- China
- Prior art keywords
- radar
- laser
- heat dissipation
- laser radar
- dissipation base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 4
- 230000009970 fire resistant effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application involves laser radar heat dissipation technology more particularly to a kind of laser radar radiators.Laser radar radiator includes radar element, heat dissipation base, PCB circuit board, and the radar element, PCB circuit board are arranged in heat dissipation base one side, and the radar element is connect by metal wire with PCB circuit board.Radar element is directly connect with heat dissipation base by the application, the heat that radar element generates is conducted by heat dissipation base, it does not need to conduct using pcb board, it can be in the case where existing power and constant radiator structure, meet temperature rise situation of the key components relative to environment temperature, strong operability, strong applicability.
Description
Technical field
The present application relates to laser radar heat dissipation technology more particularly to a kind of laser radar radiators.
Background technique
Currently, laser radar is by active light source, beam shaping system, receives camera lens, photosensitive element, signal control sum number
It is constituted according to processing unit.Signal light is emitted by active light source, sensor devices open calculating simultaneously and detect barrier return signal
The time difference (or mode indirectly by test phase modulation) of light, so that it may calculate the range information of barrier.For reality
Existing larger distance detection, and the detection of big field angle (horizontal field of view angle and vertical field of view angle), the active light source needed
Performance number is multiplied, and bring heat dissipation problem largely influences to emit the performance of light source and photosensitive element.
Existing heat dissipating method laser radar is will to emit the elements such as light source, photosensitive element to be arranged on pcb board, pcb board
It is connect again with thermal component, the elements such as transmitting light source, photosensitive element are individually encapsulated, the heat that transmitting light source, photosensitive element generate
It is distributed through pcb board, thermal component.To improve radiating efficiency, generally requires raising pcb board and cover copper rate, increase pcb board to radiating part
Part heat transfer efficiency.Under this radiating mode, each elements heat carries out temperature conduction by pcb board, and radiating efficiency is lower.
Summary of the invention
The embodiment of the present application is to propose a kind of laser radar radiator, solves that prior art radiating efficiency is lower to ask
Topic, for this purpose, the present patent application embodiment uses following technical scheme:
On the one hand, a kind of laser radar radiator, including radar element, heat dissipation base, PCB circuit board, the radar element,
PCB circuit board is arranged in heat dissipation base one side, and the radar element is connect by metal wire with PCB circuit board.
In one possible implementation, the radar element is laser or photosensitive element or diffused component or two
When first optical device, an encapsulated layer is provided with outside radar element.
In one possible implementation, the encapsulated layer is the indifferent gas of fire resistant resin layer or glass capsulation
Body.
In one possible implementation, by way of the radar element is fixed welding or directly and heat dissipation bottom
Seat connection.
In one possible implementation, described to be directly fixed as being clamped or be spirally connected.
In one possible implementation, the laser is VCSEL laser or LD or solid state laser or gas
Body laser.
In one possible implementation, the heat dissipation base is aluminum substrate or cooling fin.
In one possible implementation, when the heat dissipation base is aluminum substrate, the aluminum substrate is with pcb board
One.
In one possible implementation, the cross sectional shape of the radiating fin is fan-shaped, rectangle or triangle.
In one possible implementation, the radiating fin is arranged side by side setting.
The embodiment of the present application is by the way that radar element directly to be connect with heat dissipation base, and the heat that radar element generates is by dissipating
Hot pedestal conducts, and does not need to conduct using pcb board, can be full in the case where existing power and constant radiator structure
Temperature rise situation of the sufficient key components relative to environment temperature, strong operability, strong applicability.
Detailed description of the invention
Fig. 1 is the main view of the embodiment of the present application.
Fig. 2 is that the embodiment of the present application adds the top view after encapsulated layer.
Fig. 3 is that the embodiment of the present application adds the cross-sectional view after encapsulated layer.
In figure: 1, radar element；2, heat dissipation base；3, PCB circuit board；4, metal wire；5, encapsulated layer；6, radiating fin.
Specific embodiment
Further illustrate the technical solution of the application below with reference to the accompanying drawings and specific embodiments.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
In order to make those skilled in the art more fully understand application scheme, below in conjunction in the embodiment of the present application
Attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is only
The embodiment of the application a part, instead of all the embodiments.Based on the embodiment in the application, ordinary skill people
Member's every other embodiment obtained without making creative work, all should belong to the model of the application protection
It encloses.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so as to embodiments herein described herein.In addition, term " includes " and " tool
Have " and their any deformation, it is intended that cover it is non-exclusive include, for example, containing a series of steps or units
Process, method, device, product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include without clear
Other step or units listing to Chu or intrinsic for these process, methods, product or equipment.
The embodiment of the present application
As shown in Figure 1, a kind of laser radar radiator, including radar element 1, heat dissipation base 2, PCB circuit board 3, the thunder
It is arranged in 2 one side of heat dissipation base up to element 1, PCB circuit board 3, the radar element 1 passes through metal wire 4 and PCB circuit board 3
Connection.
Radar element 1 in the present embodiment is directly installed on heat dissipation base 2, and radar element 1 is connected to by metal wire 4
On pcb board 3.4 material of metal wire is preferably golden, also can choose copper or aluminium, and radar element 1 passes through metal wire 4 and PCB
Plate 3 connects, the preferred ball-shaped welded of connection type.The heat power consumption that radar element 1 generates at this time, it is direct by 1 bottom of radar element
It is transmitted on the heat dissipation base 2 of periphery, in the case where complete machine power is certain, needs not move through pcb board 3 and radiate, reduce
The influence of the heat transfer of pcb board 3, reaches raising radiating efficiency, reduces the effect of the temperature of key element, to improve whole
The use temperature of machine, extends the service life of radar element.
In the prior art, each radar element 1 can introduce thermal resistance when being individually encapsulated when each device is connected.
The technical program is then that each radar element 1 is directly installed on heat dissipation base 2, it is no longer necessary to introduce thermal resistance, simplify structure, drop
Low cost.
The radar element is divided into the device sensitive to conventional environment, the device insensitive to conventional environment.
The device insensitive for conventional environment does not need to add encapsulated layer on device.
As shown in Figure 2 and Figure 3, the radar and case are laser or photosensitive element or diffused component or binary optical
Device is provided with an encapsulated layer 5 because these radar elements are more sensitive to conventional environment outside radar element.
The encapsulated layer 5 is the inert gas of fire resistant resin layer or glass capsulation.
Using encapsulated layer 5, influence of the air to radar element can be completely cut off, guarantee that radar element works normally.
It is connect by way of the radar element 1 is fixed welding or directly with heat dissipation base 2.
Described is directly fixed as being clamped or be spirally connected.
The laser is VCSEL laser or LD or LED or solid state laser or gas laser.
The laser is fixed on heat dissipation base 2 by welding or being clamped or be spirally connected.Under screw connection manner, laser can
Disassembly.
The heat dissipation base 2 is aluminum substrate or cooling fin.
Aluminum substrate is a kind of PCB circuit board of aluminium substrate, and what is mainly undertaken is the high environment of cooling requirements.
When the heat dissipation base 2 is aluminum substrate, the aluminum substrate is integrated with pcb board.It can directly be printed on aluminum substrate
Brush circuit, plays the role of pcb board.
The cooling fin includes multiple radiating fins 6, the cross sectional shape of the radiating fin 6 be fan-shaped, rectangle or
Triangle.
The radiating fin 6 is arranged side by side setting.
Describe the technical principle of the application in conjunction with specific embodiments above.These descriptions are intended merely to explain the application's
Principle, and it cannot be construed to the limitation to the application protection scope in any way.Based on the explanation herein, the technology of this field
Personnel do not need to pay for creative labor the other specific embodiments that can associate the application, these modes are fallen within
Within the protection scope of the application.
Claims (10)
1. a kind of laser radar radiator, which is characterized in that including radar element, heat dissipation base, PCB circuit board, the thunder
It is arranged in heat dissipation base one side up to element, PCB circuit board, the radar element is connect by metal wire with PCB circuit board.
2. laser radar radiator according to claim 1, which is characterized in that the radar element be laser or
When photosensitive element or diffused component or binary optical device, an encapsulated layer is provided with outside radar element.
3. laser radar radiator according to claim 2, which is characterized in that the encapsulated layer is fire resistant resin
The inert gas of layer or glass capsulation.
4. laser radar radiator according to claim 2 or 3, which is characterized in that the radar element passes through weldering
It connects or directly fixed mode is connect with heat dissipation base.
5. laser radar radiator according to claim 4, which is characterized in that it is described be directly fixed as clamping or
It is spirally connected.
6. laser radar radiator according to claim 5, which is characterized in that the laser is VCSEL laser
Device or LD or solid state laser or gas laser.
7. laser radar radiator according to claim 1, which is characterized in that the heat dissipation base be aluminum substrate or
Cooling fin.
8. laser radar radiator according to claim 7, which is characterized in that the heat dissipation base is aluminum substrate
When, the aluminum substrate is integrated with pcb board.
9. laser radar radiator according to claim 8, which is characterized in that the cross sectional shape of the radiating fin
For fan-shaped, rectangle or triangle.
10. laser radar radiator according to claim 9, which is characterized in that the radiating fin is arranged side by side
Setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910436157.1A CN110244278A (en) | 2019-05-23 | 2019-05-23 | A kind of laser radar radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910436157.1A CN110244278A (en) | 2019-05-23 | 2019-05-23 | A kind of laser radar radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110244278A true CN110244278A (en) | 2019-09-17 |
Family
ID=67884861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910436157.1A Pending CN110244278A (en) | 2019-05-23 | 2019-05-23 | A kind of laser radar radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110244278A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110736975A (en) * | 2019-11-07 | 2020-01-31 | 上海禾赛光电科技有限公司 | Receiving module and laser radar comprising same |
| CN110736973A (en) * | 2019-11-15 | 2020-01-31 | 上海禾赛光电科技有限公司 | Laser radar's heat abstractor and laser radar |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208239607U (en) * | 2018-04-03 | 2018-12-14 | 上海禾赛光电科技有限公司 | A kind of laser radar radiator structure |
| CN109959913A (en) * | 2019-04-25 | 2019-07-02 | 北醒（北京）光子科技有限公司 | A kind of laser radar radiator |
| CN210109315U (en) * | 2019-04-25 | 2020-02-21 | 北醒（北京）光子科技有限公司 | Laser radar heat abstractor |
| CN211123252U (en) * | 2019-05-23 | 2020-07-28 | 北醒（北京）光子科技有限公司 | Laser radar heat abstractor |
-
2019
- 2019-05-23 CN CN201910436157.1A patent/CN110244278A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208239607U (en) * | 2018-04-03 | 2018-12-14 | 上海禾赛光电科技有限公司 | A kind of laser radar radiator structure |
| CN109959913A (en) * | 2019-04-25 | 2019-07-02 | 北醒（北京）光子科技有限公司 | A kind of laser radar radiator |
| CN210109315U (en) * | 2019-04-25 | 2020-02-21 | 北醒（北京）光子科技有限公司 | Laser radar heat abstractor |
| CN211123252U (en) * | 2019-05-23 | 2020-07-28 | 北醒（北京）光子科技有限公司 | Laser radar heat abstractor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110736975A (en) * | 2019-11-07 | 2020-01-31 | 上海禾赛光电科技有限公司 | Receiving module and laser radar comprising same |
| CN110736975B (en) * | 2019-11-07 | 2020-11-27 | 上海禾赛光电科技有限公司 | Receiving module and laser radar comprising same |
| WO2021088648A1 (en) * | 2019-11-07 | 2021-05-14 | 上海禾赛科技股份有限公司 | Receiving module and laser radar comprising same |
| CN110736973A (en) * | 2019-11-15 | 2020-01-31 | 上海禾赛光电科技有限公司 | Laser radar's heat abstractor and laser radar |
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