JP2782717B2 - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JP2782717B2 JP2782717B2 JP63101484A JP10148488A JP2782717B2 JP 2782717 B2 JP2782717 B2 JP 2782717B2 JP 63101484 A JP63101484 A JP 63101484A JP 10148488 A JP10148488 A JP 10148488A JP 2782717 B2 JP2782717 B2 JP 2782717B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- lead member
- light emitting
- emitting element
- side lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、発光素子に電圧を加えて発光させる発光ダ
イオードの改良に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a light emitting diode that emits light by applying a voltage to a light emitting element.
従来より、発光ダイオードの発光素子が発する光を有
効に前面方向に放射するため、種々の構造の発光ダイオ
ードが案出されている。第10図は従来の反射型発光ダイ
オードの概略断面図である。第10図において51は発光素
子、52はカソード側のリードフレーム、53はアノード側
のリードフレーム、54はワイヤ、55は光透過性樹脂、55
aは光透過性樹脂55の下端面（反射面）である。発光素
子51はカソード側のリードフレーム52上にマウントされ
ており、アノード側のリードフレーム53とはワイヤ54に
より電気的に接続されている。また、発光素子51とワイ
ヤ54とリードフレーム52・53の先端部分とは光透過性樹
脂55により一体的にモールドされている。そして、光透
過性樹脂55の下端面55aは発光素子51を焦点とする放物
面状に形成され、また反射面は下端面55aの表面に鍍金
又は金属蒸着等を施すことにより形成されている。2. Description of the Related Art Conventionally, light-emitting diodes having various structures have been devised in order to effectively emit light emitted from a light-emitting element of a light-emitting diode toward a front surface. FIG. 10 is a schematic sectional view of a conventional reflection type light emitting diode. In FIG. 10, 51 is a light emitting element, 52 is a cathode side lead frame, 53 is an anode side lead frame, 54 is a wire, 55 is a light transmitting resin, 55
a is the lower end surface (reflection surface) of the light transmitting resin 55. The light emitting element 51 is mounted on a lead frame 52 on the cathode side, and is electrically connected to the lead frame 53 on the anode side by wires 54. Further, the light emitting element 51, the wire 54, and the end portions of the lead frames 52 and 53 are integrally molded with a light transmitting resin 55. The lower end surface 55a of the light transmitting resin 55 is formed in a parabolic shape with the light emitting element 51 as a focal point, and the reflecting surface is formed by plating or metal depositing the surface of the lower end surface 55a. .
上記のように構成した発光ダイオードでは、たとえば
発光素子51が発する光は反射面55aにより反射面55aの中
心軸に対して平行な方向に反射された後、発光ダイオー
ドの前面方向に放射される。In the light emitting diode configured as described above, for example, light emitted by the light emitting element 51 is reflected by the reflecting surface 55a in a direction parallel to the central axis of the reflecting surface 55a, and then emitted toward the front of the light emitting diode.
しかしながら、従来の発光ダイオードでは、発光素子
51が発する光のうち一部は光路の進路に配置したリード
フレームに衝突して乱反射する。このような光は発光ダ
イオードの前面方向の光度に寄与せず無駄な光となる。
このように、従来の発光ダイオードでは発光素子51から
一直線状に伸びた左右のリードフレーム52・53によって
前面方向に対する光の損失が生じるという欠点があっ
た。However, in the conventional light emitting diode, the light emitting element
A part of the light emitted by 51 collides with a lead frame arranged on the optical path and is irregularly reflected. Such light does not contribute to the luminous intensity in the front direction of the light emitting diode and is wasted light.
As described above, the conventional light emitting diode has a drawback that light is lost in the front direction due to the left and right lead frames 52 and 53 extending linearly from the light emitting element 51.
また、複数個の発光素子が取り付けられた発光ダイオ
ード、たとえば多色機能を持たせた発光ダイオードで
は、発光素子の数に対応してリードフレームの数を増や
す必要があるため、リードフレームによる光の損失がさ
らに大きくなるという欠点があった。In a light-emitting diode having a plurality of light-emitting elements attached thereto, for example, a light-emitting diode having a multicolor function, it is necessary to increase the number of lead frames in accordance with the number of light-emitting elements. There is a disadvantage that the loss is further increased.
更に、従来のリードフレームでは、両方のリードフレ
ームを個々にしっかりと固定しないと、ワイヤボンディ
ングや光透過性樹脂55でモールドする際に、ワイヤが断
線するおそれがあり、製造が容易でないという欠点があ
った。Further, in the conventional lead frame, if both the lead frames are not fixed firmly individually, there is a possibility that the wire may be broken at the time of wire bonding or molding with the light transmitting resin 55, and the manufacturing is not easy. there were.
なお、第10図に示す従来の反射型発光ダイオードに関
連する反射鏡付き発光ダイオードが特開昭55−118681号
公報に開示されている。A light-emitting diode with a reflecting mirror related to the conventional reflection-type light-emitting diode shown in FIG. 10 is disclosed in JP-A-55-118681.
該発光ダイオードのリード船はPN接合半導体の軸方向
に沿って長手方向に引き出されているので、発光素子か
ら発した光は前面に形成した放射面に放射される前に遮
られることとなる。このことは、発光素子に対するリー
ド部材の立体角が大きくなるほど光の損失は大きくなる
ことがわかる。そして、反射型発光ダイオードにおいて
は、リード部材の引き出し方向により、リード部材によ
る影の影響が大きくなり放射される光の損失も大きくな
るという問題がある。Since the lead ship of the light emitting diode is drawn out in the longitudinal direction along the axial direction of the PN junction semiconductor, light emitted from the light emitting element is blocked before being emitted to the radiation surface formed on the front surface. This means that the larger the solid angle of the lead member with respect to the light emitting element, the greater the light loss. In the reflection type light emitting diode, there is a problem that the influence of the shadow by the lead member increases and the loss of emitted light increases depending on the lead-out direction of the lead member.
一般に、反射型発光ダイオードは光制御効率が高いと
いう利点があるが、その反面リード部材の影による光放
射の損失があるという問題がある。しかも、実用上、発
光素子をマウントするスペースやボンディングを行なう
スペースあるいは発光素子が発する熱の放熱経路を確保
するというリード部材に特有の制約がある。又、この種
発光ダイオードは数ミリ程度の大きさでありリード部材
の大きさを考慮すると、直径５ミリ程度の反射型発光ダ
イオードでは、リード部材の影響による光の損失は10％
を越えることとなる。In general, a reflection type light emitting diode has an advantage of high light control efficiency, but has a problem of loss of light emission due to a shadow of a lead member. In addition, practically, there is a specific restriction on the lead member that a space for mounting the light emitting element, a space for bonding, or a heat radiation path for heat generated by the light emitting element is secured. In addition, this kind of light emitting diode is about several millimeters in size, and considering the size of the lead member, the light loss due to the influence of the lead member is 10% in the reflection type light emitting diode having a diameter of about 5 mm.
Will be exceeded.
本発明は上記事情に基づいてなされたものであり、前
面方向の光の損失を少なくすることができると共に、製
造が容易な発光ダイオードを提供することを目的とする
ものである。The present invention has been made based on the above circumstances, and an object of the present invention is to provide a light emitting diode which can reduce light loss in the front direction and can be easily manufactured.
上記の目的を達成するための本発明は、発光素子と、
該発光素子のカソード側に接続されたカソード側リード
部材と、前記発光素子のアノード側に接続されたアノー
ド側リード部材と、前記発光素子の発光面に対向する側
に配置された反射面と該反射面より反射された光を前面
方向に放射する放射面とを有し、前記カソード側リード
部材と前記アノード側リード部材とにより前記発光素子
に電力を供給する発光ダイオードにおいて、前記カソー
ド側リード部材と前記アノード側リード部材とを絶縁物
を介して一体的に形成し、前記各リード部材は前記発光
素子の背面側から一方向にかつ該発光素子の放射中心方
向に対してほぼ90度の方向に引き出され、前記カソード
側リード部材と前記アノード側リード部材とは、前記発
光素子が発し、前記反射面で反射される光の進行方向に
対して重なり合うように配置されたものである。The present invention for achieving the above object, a light-emitting element,
A cathode-side lead member connected to the cathode side of the light-emitting element; an anode-side lead member connected to the anode side of the light-emitting element; a reflecting surface disposed on a side of the light-emitting element facing the light-emitting surface; A light emitting diode having a radiation surface for radiating light reflected from a reflection surface in a front direction, and supplying power to the light emitting element by the cathode side lead member and the anode side lead member; And the anode-side lead member are integrally formed with an insulator interposed therebetween, and each of the lead members is arranged in one direction from the back side of the light-emitting element and in a direction substantially at 90 degrees to the radiation center direction of the light-emitting element. And the cathode-side lead member and the anode-side lead member overlap with each other in the traveling direction of light emitted from the light emitting element and reflected by the reflection surface. Those which are sea urchin arranged.
本発明は前記の構成により、カソード側リード部材と
アノード側リード部材とが一体的に形成され、カソード
側リード部材とアノード側リード部材とは、発光素子が
発し反射面で反射される光の進行方向に対して重なり合
うように配置されており、かつ発光素子の放射方向に対
してほぼ90度の方向に引き出されているので、従来のも
のに比べて、リード部材による影の総面積が少なくな
り、リード部材による光の損失を減少することができ
る。According to the present invention, the cathode-side lead member and the anode-side lead member are integrally formed by the above-described structure, and the cathode-side lead member and the anode-side lead member are connected to each other so that the light emitted from the light emitting element is reflected by the reflection surface. Since they are arranged so as to overlap with each other in the direction, and are drawn out in a direction substantially at 90 degrees to the radiation direction of the light emitting element, the total area of shadow by the lead member is smaller than that of the conventional one. In addition, light loss due to the lead member can be reduced.
また、両方のリード部材が一体的に形成されているの
で、発光素子とリード部材とのワイヤボンディング等が
容易となる。Further, since both lead members are formed integrally, wire bonding and the like between the light emitting element and the lead member become easy.
以下に本発明の第１の実施例を第１図乃至第３図を参
照して説明する。第１図は本発明の第１の実施例である
発光ダイオードに用いるリード部の概略斜視図、第２図
はそのリード部に発光素子がマウントされワイヤボンデ
ィングされた状態の概略斜視図、第３図は発光ダイオー
ドの概略断面図である。第１図乃至第３図において１は
発光ダイオードに電力を供給するリード部、11は発光素
子、12はワイヤ、13は光透過性樹脂、13aは光透過性樹
脂13の下端面（反射面）である。Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic perspective view of a lead portion used for a light emitting diode according to a first embodiment of the present invention, FIG. 2 is a schematic perspective view of a state where a light emitting element is mounted on the lead portion and wire-bonded, and FIG. The figure is a schematic sectional view of a light emitting diode. 1 to 3, reference numeral 1 denotes a lead for supplying power to a light emitting diode, 11 denotes a light emitting element, 12 denotes a wire, 13 denotes a light transmitting resin, and 13a denotes a lower end surface (reflection surface) of the light transmitting resin 13. It is.
本実施例である発光ダイオードに用いるリード部１
は、第１図に示すように絶縁物４と該絶縁物４を挟んで
上下に銅等の金属箔により形成されたカソード側リード
部材２とアノード側リード部材３とからなる。カソード
側リード部材２は絶縁物４の先端部を包み込むように絶
縁物の下面から上面に折曲している。一方、アノード側
リード部材３は絶縁物４端部の少し手前まで形成し、そ
の銅箔の表面には、良好なワイヤボンディングができる
ように、金や銀等による鍍金処理又は箔処理が施してあ
る。また、発光素子11は第２図に示すようにカソード側
リード部材２の折曲部上にマウントされ、該発光素子11
とアノード側リード部材３とはワイヤ12により電気的に
接続されている。又、第２図及び第３図に示すように、
カソード側リード部材２とアノード側リード部材３は一
方向（第３図中、右方向）に発光素子11の放射中心方向
に対してほぼ90度の方向に引き出されている。先端部分
と発光素子11とワイヤ12とは一体的に光透過性樹脂13で
モールドされている。なお、反射面は発光素子の発光面
に対向する側に配置される。すなわち第３図に示すよう
に、光透過性樹脂13の下端面13aは発光素子11を焦点と
する放物面状、たとえば回転放物面状に形成され、また
反射面はこの下端面13aの表面を鍍金又は金属蒸着等に
よって処理することにより形成されている。Lead portion 1 used in light emitting diode of this embodiment
As shown in FIG. 1, the cathode lead member 2 and the anode lead member 3 are formed of an insulator 4 and metal foils such as copper vertically sandwiching the insulator 4. The cathode-side lead member 2 is bent from the lower surface of the insulator to the upper surface so as to surround the tip of the insulator 4. On the other hand, the anode-side lead member 3 is formed a little before the end of the insulator 4, and the surface of the copper foil is subjected to plating or foil treatment with gold, silver, or the like so that good wire bonding can be performed. is there. The light emitting element 11 is mounted on the bent portion of the cathode-side lead member 2 as shown in FIG.
And the anode-side lead member 3 are electrically connected by a wire 12. Also, as shown in FIGS. 2 and 3,
The cathode-side lead member 2 and the anode-side lead member 3 are pulled out in one direction (rightward in FIG. 3) in a direction substantially 90 degrees with respect to the radiation center direction of the light emitting element 11. The tip portion, the light emitting element 11 and the wire 12 are integrally molded with the light transmitting resin 13. Note that the reflection surface is disposed on the side of the light emitting element that faces the light emission surface. That is, as shown in FIG. 3, the lower end surface 13a of the light-transmitting resin 13 is formed in a paraboloidal shape having the light emitting element 11 as a focus, for example, a rotating paraboloidal shape, and the reflection surface is formed on the lower end surface 13a. It is formed by treating the surface by plating or metal deposition.
このように形成された発光ダイオードは、リード部１
とワイヤ12とにより発光素子11に電力が供給され、発光
素子11が発光する。そして、発光素子11が発する光は回
転放物面状に形成した反射面13aにより反射面13aの中心
軸に対して平行な方向に反射された後、リード部１によ
って乱反射されたものを除き前面方向に放射される。The light emitting diode thus formed is connected to the lead 1
The power is supplied to the light emitting element 11 through the wire 12 and the light emitting element 11 emits light. The light emitted from the light emitting element 11 is reflected by a reflecting surface 13a formed in a paraboloid of revolution in a direction parallel to the central axis of the reflecting surface 13a, and then is reflected on the front surface except for those irregularly reflected by the lead portion 1. Radiated in the direction.
上記第１の実施例によれば、…カソード側リード部材
２とアノード側リード部材３は光の進行方向に対して一
方向に重なり合うように配置されている。したがって、
リード部材が一直線状に配置されている従来のものに比
べて、リード部材２・３による影の総面積が少なくなる
ので、リード部材２・３による光の損失を略半減するこ
とができる。このように、本実施例である発光ダイオー
ドによればリード部材２・３の影によって生じる光の損
失を低減することができるので、発光素子が発する光を
有効に利用することができる。According to the first embodiment, the cathode-side lead member 2 and the anode-side lead member 3 are arranged so as to overlap in one direction with respect to the traveling direction of light. Therefore,
Since the total area of the shadow by the lead members 2 and 3 is smaller than that of the conventional one in which the lead members are arranged in a straight line, the loss of light by the lead members 2 and 3 can be reduced to almost half. As described above, according to the light emitting diode of the present embodiment, the light loss caused by the shadow of the lead members 2 and 3 can be reduced, so that the light emitted from the light emitting element can be used effectively.
第４図は上記第１の実施例の変形例を示す図である。
本変形例は、光透過性樹脂13の代わりに反射面14aが形
成された反射基板14と光透過性板15で形成された光放射
面とを設けたものである。本変形例では、光透過性樹脂
はないが、カソード側リード部材２とアノード側リード
部材３とが絶縁物４を介して一体的に形成されているの
で、リード部１を安定した状態で固定することができ、
発光素子11やワイヤ12を容易に取り付けることができ
る。また、発光素子11を取り付けた後も発光素子11及び
ワイヤ12はリード部１により安定した状態が維持される
ので、振動等によるワイヤ12等の断線を防止することが
できる。このことは、以下に説明する他の実施例につい
ても同様である。尚、発光素子11内で発する光の取り出
し効率を向上するため、反射面14aと光透過性板15との
間の中空部には液状あるいはゲル状の光透過性物質を充
填してもよい。FIG. 4 is a view showing a modification of the first embodiment.
In this modification, instead of the light-transmitting resin 13, a reflection substrate 14 having a reflection surface 14a formed thereon and a light-emitting surface formed by a light-transmitting plate 15 are provided. In this modification, there is no light-transmitting resin, but since the cathode-side lead member 2 and the anode-side lead member 3 are integrally formed with the insulator 4 interposed therebetween, the lead portion 1 is fixed in a stable state. Can be
The light emitting element 11 and the wire 12 can be easily attached. Further, even after the light emitting element 11 is attached, the light emitting element 11 and the wire 12 are maintained in a stable state by the lead portion 1, so that disconnection of the wire 12 or the like due to vibration or the like can be prevented. This is the same for the other embodiments described below. In addition, in order to improve the efficiency of extracting light emitted in the light emitting element 11, the hollow portion between the reflecting surface 14a and the light transmitting plate 15 may be filled with a liquid or gel light transmitting material.
また、上記第１の実施例によれば、カソード側リード
部材２とアノード側リード部材３は絶縁物４を介して一
体的に形成されているので、リード部１の製造が容易に
なる。第５図は本実施例で用いるリード部の製造方法を
示す図である。第５図に示すように四角形の薄い平板状
の絶縁物21に金属箔22を貼り付け、第５図（ａ）の点線
で示す不必要な部分（カソード側リード部材２とアノー
ド側リード部材３とを隔絶するための隙間）をエッチン
グ等により直線状に除去して溝部22aを形成し、残った
金属箔の上に鍍金処理を施す。そして、このように形成
された薄板を適当な幅で、溝部22aと垂直になる方向
（第５図（ｂ）の点線）にカットすることにより、容易
にリード部１を量産することができる。Further, according to the first embodiment, since the cathode-side lead member 2 and the anode-side lead member 3 are integrally formed with the insulator 4 interposed therebetween, the manufacture of the lead portion 1 is facilitated. FIG. 5 is a diagram showing a method of manufacturing a lead portion used in this embodiment. As shown in FIG. 5, a metal foil 22 is adhered to a rectangular thin plate-shaped insulator 21, and unnecessary portions (a cathode lead member 2 and an anode lead member 3 shown by dotted lines in FIG. Is removed linearly by etching or the like to form a groove 22a, and plating is performed on the remaining metal foil. Then, by cutting the thin plate formed as described above with an appropriate width in a direction perpendicular to the groove 22a (dotted line in FIG. 5B), the lead portion 1 can be easily mass-produced.
更に、ワイヤボンディングや光透過性樹脂でモールド
するときには、従来、カソード側リード部材とアノード
側リード部材とを別々に固定しなければならなかったの
に対して、上記の実施例によれば、カソード側リード部
材２とアノード側リード部材３とが一体的に形成されて
いるので、リード部の固定が容易となり、しかも両方の
リード部材２・３を確りと固定することができるので、
ワイヤボンディングの作業が容易になる。Further, in the past, when molding with wire bonding or light-transmitting resin, the cathode side lead member and the anode side lead member had to be separately fixed. Since the side lead member 2 and the anode side lead member 3 are integrally formed, the fixing of the lead portion is facilitated, and the both lead members 2 and 3 can be securely fixed.
The work of wire bonding becomes easy.
第６図は本発明の第２の実施例である発光ダイオード
のリード部を示す概略斜視図である。また、第７図はそ
のリード部に各発光素子を取り付け各々ワイヤボンディ
ングした状態の概略斜視図である。第６図及び第７図に
おいて、3a及び3bはアノード側リード部材、11a及び11b
は発光素子、12a及び12bはワイヤである。尚、本実施例
は第１の実施例とは発光色の異なる２個の発光素子を備
える点で相違するが、その他は第１の実施例と同様であ
るので、本実施例の発光ダイオードの概略断面図は省略
する、以下、第３の実施例においても同様であるので、
発光ダイオードの概略断面図は省略する。また、第６図
及び第７図に示す第２の実施例及び以下に説明する第３
の実施例において上記第１図乃至第３図に示す第１の実
施例と同一の機能を有するものは同一の符号を付すこと
によりその詳細な説明を省略する。FIG. 6 is a schematic perspective view showing a lead portion of a light emitting diode according to a second embodiment of the present invention. FIG. 7 is a schematic perspective view showing a state in which each light emitting element is attached to the lead portion and wire bonding is performed. 6 and 7, reference numerals 3a and 3b denote anode-side lead members, 11a and 11b.
Is a light emitting element, and 12a and 12b are wires. This embodiment is different from the first embodiment in that two light emitting elements having different emission colors are provided, but the other is the same as the first embodiment. A schematic cross-sectional view is omitted. Hereinafter, the same applies to the third embodiment.
A schematic sectional view of the light emitting diode is omitted. The second embodiment shown in FIGS. 6 and 7 and the third embodiment described below
In this embodiment, those having the same functions as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof will be omitted.
本実施例のカソード側リード部材２は折曲部2aに２個
の発光素子11a・11bを取り付けることができ、アノード
側リード部材は２個配置されている。また、カソード側
リード部材２とアノード側リード部材3a・3bとは絶縁物
４の表面に形成され、各リード部材２・3a・3bは各々絶
縁されている。その他の構成は第１の実施例と同様であ
る。In the cathode-side lead member 2 of this embodiment, two light emitting elements 11a and 11b can be attached to the bent portion 2a, and two anode-side lead members are arranged. The cathode lead member 2 and the anode lead members 3a and 3b are formed on the surface of the insulator 4, and the lead members 2.3a and 3b are insulated from each other. Other configurations are the same as those of the first embodiment.
本実施例では、カソード側リード部材２上に発色の異
なる２個の発光素子11a・11bをマウントし、発光素子11
aとアノード側リード部材3aとはワイヤ12aにより、また
発光素子11bとアノード側リード部材3bとはワイヤ12bに
より各々電気的に接続されている。上記の実施例によれ
ば、多色機能を持った発光ダイオードとなる。その他の
作用・効果は第１の実施例と同様である。尚、同様の構
造により、３個以上の発光素子を取り付けることも可能
である。In this embodiment, two light emitting elements 11a and 11b having different colors are mounted on the cathode-side lead member 2, and the light emitting element 11
a and the anode-side lead member 3a are electrically connected by a wire 12a, and the light emitting element 11b and the anode-side lead member 3b are electrically connected by a wire 12b. According to the above embodiment, the light emitting diode has a multicolor function. Other operations and effects are the same as those of the first embodiment. In addition, it is also possible to attach three or more light emitting elements by the same structure.
第８図は本発明の第３の実施例である発光ダイオード
に用いるリード部の概略斜視図である。また、第９図は
そのリード部に発光素子をマウントしワイヤボンディン
グした状態の概略斜視図である。第３の実施例における
リード部１は、第８図に示すように金属フレーム（カソ
ード側リード部材５）上に先端部分を除いて絶縁層７が
形成され、その絶縁層７上に銅等の金属箔処理によりア
ノード側リード部材６が形成されている。そして、その
金属箔上には良好なワイヤボンディングができるよう
に、金や銀等による鍍金処理又は箔処理が施されてい
る。以上のような構成により前記第１の実施例と同様の
作用・効果が生じる。FIG. 8 is a schematic perspective view of a lead portion used for a light emitting diode according to a third embodiment of the present invention. FIG. 9 is a schematic perspective view showing a state where a light emitting element is mounted on the lead portion and wire-bonded. As shown in FIG. 8, the lead portion 1 in the third embodiment has an insulating layer 7 formed on a metal frame (cathode-side lead member 5) except for a tip portion. The anode-side lead member 6 is formed by metal foil processing. Then, plating or foil treatment with gold, silver, or the like is performed on the metal foil so that good wire bonding can be performed. With the above configuration, the same operations and effects as those of the first embodiment are obtained.
ところで、第３の実施例においてはアノード側リード
部材６を金属箔で形成した場合について説明したが、ア
ノード側リード部材６も金属フレームとし、２本の金属
フレーム（カソード側リード部材５及びアノード側リー
ド部材６）を絶縁層７を介して上下に重ね、一体的に形
成したものであってもよい。By the way, in the third embodiment, the case where the anode-side lead member 6 is formed of a metal foil has been described. However, the anode-side lead member 6 is also formed of a metal frame, and two metal frames (the cathode-side lead member 5 and the anode-side The lead member 6) may be formed as an integral part by vertically stacking the lead member 6) with the insulating layer 7 interposed therebetween.
以上説明したように本発明によれば、カソード側リー
ド部材とアノード側リード部材とが一体的に形成され、
カソード側リード部材とアノード側リード部材とは、発
光素子が発し、反射面で反射される光の進行方向に対し
て重なり合うように配置されているので、前面方向の光
の損失を少なくすることができると共に、製造が容易な
発光ダイオードを提供することができる。According to the present invention as described above, the cathode-side lead member and the anode-side lead member are integrally formed,
The cathode-side lead member and the anode-side lead member are arranged so as to overlap with the traveling direction of light emitted from the light-emitting element and reflected by the reflection surface, so that light loss in the front direction can be reduced. It is possible to provide a light emitting diode which can be manufactured easily.
第１図は本発明の第１の実施例である発光ダイオードに
用いるリード部の概略斜視図、第２図はそのリード部に
発光素子がマウントされた状態の概略斜視図、第３図は
発光ダイオードの概略断面図、第４図は第１の実施例の
変形例を示す図、第５図はリード部の製造方法を示す
図、第６図は本発明の第２の実施例である発光ダイオー
ドのリード部を示す図、第７図はそのリード部に発光素
子を取り付けた状態の概略斜視図、第８図は本発明の第
３の実施例である発光ダイオードに用いるリード部の概
略斜視図、第９図はそのリード部に発光素子を取り付け
た状態の概略斜視図、第10図は従来の反射型発光ダイオ
ードの概略断面図である。 １……リード部、 ２・５……カソード側リード部材、 ３・3a・3b・６……アノード側リード部材、 ４……絶縁物、７……絶縁層、 11・11a・11b……発光素子、 12・12a・12b……ワイヤ、 13……光透過性樹脂、 13a……下端面（反射面）、14……反射基板、 14a……反射面、15……光透過性板、 21……絶縁物、22……金属箔、 22a……溝。FIG. 1 is a schematic perspective view of a lead portion used for a light emitting diode according to a first embodiment of the present invention, FIG. 2 is a schematic perspective view of a state where a light emitting element is mounted on the lead portion, and FIG. FIG. 4 is a schematic sectional view of a diode, FIG. 4 is a diagram showing a modification of the first embodiment, FIG. 5 is a diagram showing a method of manufacturing a lead portion, and FIG. 6 is a light emitting device according to a second embodiment of the present invention. FIG. 7 is a diagram showing a lead portion of a diode, FIG. 7 is a schematic perspective view showing a state where a light emitting element is attached to the lead portion, and FIG. 8 is a schematic perspective view of a lead portion used for a light emitting diode according to a third embodiment of the present invention. FIG. 9 is a schematic perspective view showing a state in which a light emitting element is attached to a lead portion, and FIG. 10 is a schematic sectional view of a conventional reflection type light emitting diode. 1 Lead part 2, 5 Cathode lead member 3.3a 3b 6 Anode lead member 4 Insulator 7, Insulating layer 11, 11a 11b Light emission Element, 12 ・ 12a ・ 12b ... wire, 13 ... light transmissive resin, 13a ... bottom surface (reflective surface), 14 ... reflective substrate, 14a ... reflective surface, 15 ... light transmissive plate, 21 …… Insulator, 22… Metal foil, 22a …… Groove.
Claims (2)
続されたカソード側リード部材と、前記発光素子のアノ
ード側に接続されたアノード側リード部材と、前記発光
素子の発光面に対向する側に配置された反射面と該反射
面より反射された光を前面方向に放射する放射面とを有
し、前記カソード側リード部材と前記アノード側リード
部材とにより前記発光素子に電力を供給する発光ダイオ
ードにおいて、前記カソード側リード部材と前記アノー
ド側リード部材とを絶縁物を介して一体的に形成し、前
記各リード部材は前記発光素子の背面側から一方向にか
つ該発光素子の放射中心方向に対してほぼ90度の方向に
引き出され、前記カソード側リード部材と前記アノード
側リード部材とは、前記発光素子が発し、前記反射面で
反射される光の進行方向に対して重なり合うように配置
されたことを特徴とする発光ダイオード。A light-emitting element; a cathode-side lead member connected to the cathode side of the light-emitting element; an anode-side lead member connected to the anode side of the light-emitting element; and a light-emitting surface of the light-emitting element. And a radiation surface for radiating light reflected from the reflection surface in the front direction, and supplies power to the light emitting element by the cathode side lead member and the anode side lead member. In the light-emitting diode, the cathode-side lead member and the anode-side lead member are integrally formed with an insulator interposed therebetween, and each of the lead members extends in one direction from the back side of the light-emitting element and the radiation center of the light-emitting element. The cathode-side lead member and the anode-side lead member are pulled out in a direction substantially 90 degrees with respect to the direction, and the light emitted from the light-emitting element and reflected by the reflection surface advance. Light emitting diodes, characterized in that it is arranged so as to overlap with respect to the direction.
ド側リード部材は少なくとも一方が金属箔又は金属フレ
ームを用いたものである請求項１記載の発光ダイオー
ド。2. The light emitting diode according to claim 1, wherein at least one of said cathode side lead member and said anode side lead member uses a metal foil or a metal frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101484A JP2782717B2 (en) | 1988-04-26 | 1988-04-26 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101484A JP2782717B2 (en) | 1988-04-26 | 1988-04-26 | Light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01273367A JPH01273367A (en) | 1989-11-01 |
| JP2782717B2 true JP2782717B2 (en) | 1998-08-06 |
Family
ID=14301987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63101484A Expired - Fee Related JP2782717B2 (en) | 1988-04-26 | 1988-04-26 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2782717B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4311530A1 (en) * | 1992-10-02 | 1994-04-07 | Telefunken Microelectron | Optoelectronic component with a narrow opening angle |
| KR101015289B1 (en) | 2002-11-05 | 2011-02-15 | 파나소닉 주식회사 | Light-emitting diode |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5634356U (en) * | 1979-08-23 | 1981-04-03 | ||
| JPH0526759Y2 (en) * | 1987-05-29 | 1993-07-07 |
-
1988
- 1988-04-26 JP JP63101484A patent/JP2782717B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01273367A (en) | 1989-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6833566B2 (en) | Light emitting diode with heat sink | |
| US7781787B2 (en) | Light-emitting diode, led light, and light apparatus | |
| US6552368B2 (en) | Light emission device | |
| JP5505745B2 (en) | Chip coating type LED package | |
| US8256929B2 (en) | Efficient LED array | |
| US9385258B2 (en) | Optoelectronic semiconductor device with protective and reflective sheaths | |
| US10825969B2 (en) | Light emitting diode package | |
| JPH11162231A (en) | Led illumination module | |
| JP2002280614A (en) | Light emitting diode | |
| JP2000277813A (en) | Light source device | |
| JP2002176203A (en) | Light emitting device and light emitting device array | |
| CN109075237B (en) | Device with reflector and method for producing a device | |
| JP3649939B2 (en) | Line light source device and manufacturing method thereof | |
| JPH1126813A (en) | Light emitting diode lamp | |
| JP2782717B2 (en) | Light emitting diode | |
| KR20080028071A (en) | Led device having light reflection patterns at the back | |
| KR20110139514A (en) | Light emitting device | |
| JPH10242532A (en) | Light emitting diode lamp and its unit | |
| JPH06350140A (en) | Light emitting diode | |
| JP3028813B1 (en) | Semiconductor light emitting device | |
| JP2787300B2 (en) | Light emitting diode | |
| JP3600973B2 (en) | Linear light source | |
| JPH01204481A (en) | Led linear light source | |
| JPH0846244A (en) | Light-emitting device | |
| JPH05243618A (en) | Light-emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |