JPH0470799B2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to an electronic component housing case in which a heat-generating semiconductor element and other electronic components are housed and attached.
In particular, the present invention relates to a heat dissipation structure and mounting structure for heat generated by a heat generating semiconductor element in a small case.

(b) Background of the technology A single module (for example, a power supply) has heat-generating semiconductor elements such as transistors and diodes, and other electronic components such as capacitors housed in a single small case and has a predetermined electrical function. There is an electronic component housing case that is formed as a module. This electronic component housing case is often further mounted on a printed board of an electronic device. In such a small electronic component storage case, the semiconductor device itself and other electronic components are likely to be heated by the heat generated by the heat generating semiconductor device. For this reason, it is best to dissipate the heat generated by the heat generating semiconductor element to maintain the temperature of the heat generating semiconductor element itself below a predetermined temperature, and to prevent the temperature of other electronic components such as capacitors that are relatively sensitive to heat from rising. This is important for achieving high reliability. However, in such a small electronic component housing case, the space inside the case is small and a dedicated heat radiator or heat dissipation member cannot be installed, so the case itself or the mounting structure of the housing components cannot perform a good heat dissipation effect. It is desired that the heat generating semiconductor element has a simple structure and that the mounting structure of the heat generating semiconductor element is simple.

(c) Conventional technology and problems Conventional electronic component storage cases of this type include:
A heat-generating semiconductor element and other electronic components may be mounted on a single printed board and the entire body may be covered with a resin material, or both may be mounted on an internal printed board placed inside a small case. Some are attached and formed. However, in the former case, there is a problem in that the heat generated by the heat generating semiconductor element conducts heat through the resin material and directly heats other electronic components, raising their temperature, which leads to a decrease in reliability. arise. Furthermore, since the mounting structure for the heat generating semiconductor element uses bolts and nuts, there is a problem in that the mounting work is time-consuming. Also,
In the latter case, other electronic components are heated due to the heat conduction of the heat generated by the heat generating semiconductor element through the printed board and the temperature rise inside the case due to radiation of the generated heat, which is different from the former case described above. I have almost the same problem.

Therefore, in order to solve the above-mentioned problems, the inventors of the present invention installed a heat-generating semiconductor element and other electronic components inside a case consisting of an internal printed board and a wall board covering it. We devised a structure that allows them to be installed in separate spaces. That is, as shown in FIG.
2 to the wall plate 13a of the case 13 (not shown).
The internal printed board (not shown) that is placed inside the case is fixed by the machine screw 14, insulating bush 15, small washer 16, spring washer 17, and nut 18. None) We devised a structure to attach it to the top. In addition, in order to make the figure easier to understand, FIG. 1 is shown turned upside down.
With this configuration, the semiconductor element 11
The mounting part of the semiconductor element 1 is formed as a heat dissipation part.
The generated heat of No. 1 is conducted to the wall plate 13a and is radiated to the outside from the wall plate 13a. As a result, a better heat dissipation effect could be obtained compared to the conventional example described above. However, even in this case, a part of the heat generated by the semiconductor element 11 is conducted through the wall plate 13a and is dissipated in the area corresponding to the mounting area of other electronic components, increasing the temperature inside the case, which causes other electronic components to be mounted. There remains the problem that the electronic components of the semiconductor element 11 are slightly heated, and since the machine screws 14, nuts 18, etc. are used to attach the semiconductor element 11, there is a problem that the attachment work is time-consuming.

(iv) Purpose of the Invention In view of the above-mentioned problems of the prior art, an object of the present invention is to provide a method that can effectively dissipate the heat generated by a heat-generating semiconductor element, and at the same time dissipate the generated heat to other electronic component mounting areas. It is an object of the present invention to provide an electronic component housing case that can block heat conduction to a case wall plate part and further simplify the mounting structure of a heat-generating semiconductor element.

(E) Structure of the Invention In order to achieve the above object, according to the present invention, a heat-generating semiconductor element and other electronic components are housed and attached within a case consisting of an internal printed board and a wall plate covering the internal printed board. In the electronic component housing case, a slit is provided in the wall plate to divide the inside of the case into at least two regions, and both ends of the heat-generating semiconductor element are engaged with mounting brackets fixed to the wall plate in one region. An elastic plate is fixed in contact with the surface of the wall board in the one region, the other electronic components are accommodated in the other region, and the wall board on the other region side of the slit is bent inward of the case. There is provided an electronic component storage case characterized in that at least an opening directed toward the heat generating semiconductor element is formed and a ventilation hole is provided in the case wall plate facing the opening.

(F) Embodiments of the invention Examples of the invention will be described in detail below with reference to the drawings.

FIGS. 2 to 5 are diagrams for explaining embodiments of the present invention. In these figures, the same or corresponding parts as in FIG. 1 mentioned above are designated by the same reference numerals. Therefore, the reference numeral 11 indicates a heat generating semiconductor element such as a transistor or a diode, and the reference numeral 12 indicates an insulating sheet.

FIG. 2 is a perspective view showing the mounting structure of the heat-generating semiconductor element (hereinafter referred to as semiconductor element) 11 of FIG. 5 (however, it is shown half turned upside down).
The small case 22 is formed from a non-magnetic thin metal plate (brass plate, copper plate, etc.) into a box shape having an opening at the bottom by press drawing or press punching and then bending. An internal printed board 23 is arranged and fixed to one side of the lower internal portion of the case 22. The internal printed board 23 is fixed in a predetermined position by protrusions or tongues (both not shown) provided on the side wall plates 22b, 22c, 22d of the case 22 by press working or the like. A semiconductor element 1 is placed on the inner surface of the ceiling wall plate 22h of the case 22.
1 is abutted and fixed via an insulating sheet 12 (see FIGS. 2 and 5). Therefore, the heat generated by the semiconductor element 11 is conducted to the ceiling wall plate 22h.
Heat is radiated outward from h. In addition, the semiconductor element 11
is electrically connected to the internal printed board 23 by having its terminal 11a connected and fixed to the internal printed board 23. On the other hand, other electronic components 24 such as capacitors are centrally housed and mounted on the internal printed board 23. As a result, the semiconductor element 1
1 and other electronic components 24 are housed and mounted separately in separate spaces within the case 22 into a case heat radiation section 25 and other electronic component mounting section 26.
The wall plates 22a, 22b, 2 of the case 22 at the boundary between the housing space for the semiconductor element 11, that is, the case heat radiation section 25, and the housing space for other electronic components 24, that is, the other electronic component mounting section 26.
A slit 27, which is one of the features of the present invention, is provided at 2d and 22h. Slit 27 is
The lower ends of the side wall plates 22b and 22d (see FIG. 5),
A connecting portion is provided at the center of the ceiling wall plates 22a, 22h (see reference numeral 22f in FIG. 3). As a result, both divided portions of the case 22 (that is, portions corresponding to the case heat dissipation section 25 and the other electronic component mounting section 26) are integrally coupled with sufficient strength. By providing the slit 27 in this way, the heat generated by the semiconductor element 11 is almost completely blocked from being conducted to the ceiling wall plate 22h, and the heat is not transferred to the ceiling wall plate 22a in the other electronic component mounting portions 26. Heat conduction is prevented. As a result, the other electronic components 24 are not heated by the heat generated by the semiconductor element 11 and can be kept at a predetermined low temperature at all times. That is,
The case heat radiating section 25 is formed by a ceiling wall plate 22h and a slit 27 working together to form a kind of radiator. Therefore, as described above, the heat generated by the semiconductor element 11 is also radiated from the ceiling wall plate 22h in the case heat radiating section 25, and the heated high-temperature air inside the case heat radiating section 25 is radiated through the slit 2.
7 to the outside. As a result, according to the present Example 21, although it depends on conditions such as the size of the case and the environmental temperature, as an example, when the internal temperature of the case heat dissipation part 25 is about 50°C, other The internal temperature of the electronic component mounting section 26 can be suppressed to about 25°C to 30°C. Incidentally, an integral heat dissipation fin (not shown) can be provided on the upper side of the ceiling wall plate 22h of the case heat dissipation section 25, and the heat dissipation effect can be further improved.

Further, as shown in FIG. 2, the semiconductor element 11 is arranged between a pair of mounting brackets 28 fixed on the ceiling wall plate 22h of the case 22, and a leaf spring ( The elastic plate 29 is tightly abutted (pressed) and fixed on the ceiling wall plate 22h via the insulating sheet 12. A recess (drawn part) 29a is provided in the center of the leaf spring 29 by pressing or the like as a reinforcing part of the center. Further, instead of the recess 29a, it is also possible to easily form a reinforcing portion by bending both side edges of the central portion of the leaf spring 29 at approximately right angles. The mounting bracket 28 is provided with a bent portion 28a that is slightly bent outward at its upper end. This bent portion 28a serves to facilitate the engagement and mounting of the leaf spring 29. By forming the mounting structure for the semiconductor element 11 in this way, the semiconductor element 11
The installation work can be extremely simplified.
In addition, in FIG. 5, the reference numeral 22g indicates the side wall plate 22b.
(22b) shows a plurality of mounting pieces protruding from the top.
By inserting and fixing this mounting piece 22g into the printed board 40 of the electronic device, the case 22 is fixedly attached onto the printed board 40. In addition, this example 31
The internal print 23 and the printed circuit board 40 of the device are electrically connected by electrode pins (not shown).

FIG. 3 is a plan view of one embodiment 31 of the present invention, FIG. 4 is an end view seen from the direction of arrow B in FIG. 3, and FIG. 5 is a side sectional view taken along the line CC' in FIG. 3. This example 31
The top wall plate 22a of one of the slits 27 is bent inward of the case 22 to form an opening 32 facing the semiconductor element 11, and this opening 32
A plurality of (six in this case) ventilation holes 33 are provided in the case side wall plate 22e facing the case side wall plate 22e. By providing the opening 32 and the ventilation hole 33 in this manner, the ventilation inside the case heat radiating section 25 can be improved, and as a result, the heat generated by the semiconductor element 11 can be radiated more efficiently.
Particularly, the present embodiment 31 has a great effect when the case is installed vertically with the case heat dissipation section 25 on the upper side and the other electronic component mounting section 26 on the lower side.

(G) Effects of the Invention As explained above in detail, the electronic component housing case of the present invention has a slit in the wall plate of the case at the boundary between the housing space for the heat-generating semiconductor element and the housing space for other electronic components. Further, the wall plate of the slit portion is bent inward of the case to provide an opening oriented toward the heat generating semiconductor element, and a ventilation hole is provided in the wall plate facing the opening, and the wall plate of the heat generating semiconductor element is provided with a ventilation hole. By fixing the element in contact with the case wall surface using an elastic plate without using bolts or nuts, the heat generated by the heat-generating semiconductor element can be effectively dissipated, and the heat generated by the heat-generating semiconductor element can be effectively dissipated, and the heat generated by the heat generating semiconductor element can be effectively dissipated. It is possible to block heat conduction to the corresponding case wall plate, thereby preventing the temperature rise of heat-generating semiconductor elements and other electronic components, and further simplifying the installation process of heat-generating semiconductor elements. This has a significant effect and contributes to improved reliability and reduced assembly costs.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the mounting structure of the heat-generating semiconductor element 11 in a conventional electronic component storage case (however, it is shown in a half-turned state upside down), and FIG. 2 is a perspective view of the heat-generating semiconductor element 11 shown in FIG. A perspective view showing the mounting structure of No. 11 (however, it is shown in a half-turned state upside down),
FIG. 3 is a plan view of one embodiment 31 of the present invention, FIG. 4 is an end view seen from the direction of arrow B in FIG. 3, and FIG. 5 is a side sectional view taken along the line CC' in FIG. 3. 11... Heat generating semiconductor element (transistor, diode, etc.), 22... Small case, 22a, 22
h...Ceiling wall plate, 22b, 22c, 22d, 22e
...Side wall plate, 23...Internal printed board, 24...Other electronic components (capacitors, etc.), 25...Case heat dissipation section, 26...Other electronic component mounting section, 27...Slit, 29...Leaf spring (elastic plate), 29a . . . A recess (throttled portion; reinforcing portion) provided in the center of the leaf spring 29; 32 .

Claims (1)

[Scope of Claims] 1. In an electronic component housing case in which a heat-generating semiconductor element 11 and other electronic components 24 are housed and mounted in a case consisting of an internal printed board 23 and a wall plate 22 covering the inner printed board 23, the wall plate A slit 27 is provided in the case to form at least two areas 2 in the case.
5 and 26, and the heat-generating semiconductor element is fixed to a wall plate in one area 25 with a mounting bracket 2.
The other electronic components are housed in the other area 26, and the other electronic components are accommodated in the other area 26 of the slit. An electronic component characterized in that a side wall plate is bent inward of the case to form an opening 32 facing the heat generating semiconductor element, and a ventilation hole 33 is provided in the case wall plate facing the opening. Containment case. 2. The electronic component storage case according to claim 1, wherein a reinforcing portion for preventing deformation is provided in the center of the elastic plate 29. 3. Place the other electronic components in the other area 26.
An electronic component storage case according to claim 1, which is mounted on an internal printed board.