JPS60180198A - Electronic part containing case - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to an electronic component housing case in which a heat-generating semiconductor element and its electronic components are housed and mounted, and particularly relates to an electronic component housing case that accommodates and mounts a heat-generating semiconductor element and its electronic components. The present invention relates to a heat dissipation structure and a mounting structure.

(b) Background of the technology A single module (for example, There is an electronic component housing case formed as a power supply module. In many cases, the electronic component storage case is further mounted on a printed board of an electronic device.

In such a small electronic component storage case, the semiconductor device itself and other electronic components are likely to be heated by the heat generated by the heat generating semiconductor device. For this reason, it is best to dissipate the heat generated by the heat generating semiconductor element to maintain the temperature of the heat generating semiconductor element itself below a predetermined temperature, and to prevent the temperature of other electronic components such as capacitors that are relatively sensitive to heat from rising. This is important for achieving high reliability. However, in such a small electronic component housing case, the space inside the case is small and a dedicated heat radiator or heat dissipation member cannot be installed, so the case itself or the mounting structure of the housing components cannot perform a good heat dissipation effect. It is desired that the heat generating semiconductor element has a simple structure and that the mounting structure of the heat generating semiconductor element is simple.

(c) Conventional technology and problems Conventional electronic component storage cases of this type are formed by mounting the heat-generating semiconductor element and other electronic components on a single printed board, and covering the entire body with a resin-based material. In some cases, the above-mentioned devices are attached together on an internal printed board placed inside a small case. However, in the former case, there is a problem in that the heat generated by the heat generating semiconductor element conducts heat through the resin material and directly heats other electronic components, raising their temperature, which leads to a decrease in reliability. arise. And what is the mounting structure for the heat generating semiconductor element? There is a problem in that the installation work is time-consuming because bolts and nuts are used. In the latter case, other electronic components are heated due to the heat conduction of the heat generated by the exothermic semiconductor confectionery through the printed circuit board and the temperature rise inside the case (3) due to the radiation of the generated heat. There is almost the same problem as in the former case.

Therefore, in order to solve the above-mentioned problems, the inventors of the present invention installed a heat-generating semiconductor element and other electronic components inside a case consisting of an internal printed board and a wall board covering it. We devised a structure that allows them to be installed in separate spaces. That is, as shown in FIG. 1, the heat-generating semiconductor element 11 is brought into contact with the wall plate 13& of the case 13 (not shown) via the insulating sheet 12, and the machine screws 14, the insulating pushers 15, the small washers 16, A structure was devised in which the case is fixed by a spring washer 17 and a nut 18, and other electronic components (not shown) are mounted on an internal printed board (not shown) disposed inside the case. It should be noted that FIG. 1 is shown with the top and bottom turned upside down in order to make the drawing easier to understand.

With this configuration, the mounting part of the semiconductor element 11 is formed as a heat radiating part, and the heat generated by the semiconductor element 11 is conducted to the wall plate 13& and is radiated to the outside from the wall plate 131L. As a result, a better heat dissipation effect could be obtained compared to the conventional example (4) described above. but,
Even in this case, some of the heat generated by the semiconductor element 11 is transferred to the wall plate 13.
Since the heat is radiated in the area corresponding to the mounting area of other electronic components by conducting the heat a, the temperature inside the case increases, and this causes the problem of slightly heating the other electronic components. Since machine screws 14, nuts 18, etc. are used for attachment, there is a problem in that the attachment work is time-consuming.

B) Purpose of the Invention In view of the above-mentioned problems of the prior art, an object of the present invention is to provide a case in which the heat generated by a heat-generating semiconductor element can be effectively dissipated, and the generated heat can be transferred to other electronic component mounting parts. It is an object of the present invention to provide an electronic component housing case that can block heat conduction to a wall plate part and further simplify the mounting structure of a heat generating semiconductor element.

(e) Structure of the invention In order to achieve the above object, according to the present invention,
In an electronic component housing case in which a heat generating semiconductor element and other electronic components are housed and mounted in a case consisting of an internal printed board and a wall plate covering the inner printed board, the heat generating semiconductor element and other electronic components are housed in the case respectively. A slit is provided in the wall plate of the case at a boundary between the housing space for the heat-generating semiconductor element and the housing space for the electronic component in the case, and the heat-generating semiconductor element is mounted. In this case, there is provided an electronic component storage case characterized in that the heat generating semiconductor element is fixed in contact with the wall plate surface of the case by an elastic plate without using delts or nuts.

Further, according to the present invention, in an electronic component housing case in which a heat generating semiconductor element and its electronic components are housed and mounted in a case comprising an internal printed board and a wall plate covering the internal printed board, the heat generating semiconductor The device and other electronic components are housed in separate spaces within the case, and a slit is formed in the wall plate of the case at the boundary between the housing space for the heat-generating semiconductor element and the housing space for the electronic component. and bolts when installing the heat generating semiconductor element.

The heat-generating semiconductor element is fixed in contact with the wall plate surface of the case using an elastic plate without using nuts, and one wall of the slit portion is bent inward of the sheet metal case to direct the heat-generating semiconductor element toward the heat-generating semiconductor element. Provided is an electronic component housing case characterized in that an opening is provided to accommodate the electronic components, and a ventilation hole is provided in a case wall plate facing the opening.

(F) Embodiments of the Invention Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

FIGS. 2 to 7 are diagrams for explaining the present invention in detail. In these figures, the same or corresponding parts as in FIG. 1 mentioned above are designated by the same reference numerals. Therefore, the reference numeral 11 indicates a heat generating semiconductor element such as a transistor or a diode, and the reference numeral 12 indicates an insulating sheet.

2 is a plan view of the first embodiment 21 of the present invention, FIG. 3 is a side sectional view taken along line A-A' in FIG. FIG. 11 is a perspective view showing the mounting structure of (referred to as (7)) 11 (however, the top and bottom are shown half-turned in the opposite direction). The small case 22 is formed from a non-magnetic thin metal plate (brass plate, copper plate, etc.) into a box shape having an opening at the bottom by press drawing or press punching and then bending. An internal printed board 23 is arranged and fixed to one side of the lower internal portion of the case 22. Note that the internal printed board 23 is a side wall plate 22b of the case 22.

They are fixed in a predetermined position by protrusions or tongue pieces (both not shown) provided on 22c and 22d by press working or the like. The semiconductor element 11 is abutted and fixed on the inner surface of the ceiling wall plate 22h of the case 22 via an insulating sheet 12 (see FIG. 3.4). Therefore, the heat generated by the semiconductor element 11 is conducted to the ceiling wall plate 22h and radiated outward from the ceiling wall plate 22h.

Further, the terminals 11a of the semiconductor element 11 are connected and fixed to the internal glint board 23, so that the internal printed board 23
It is electrically connected to 3. On the other hand, other electronic components 24 such as capacitors are centrally housed and mounted on the internal printed circuit board 23. This allows one semiconductor element 11 and other electronic components 24 (8) to be separated from each other in separate spaces within the case 22. Inside, case heat dissipation part 25
and other electronic component mounting portions 26. Wall plates (22a, 22b, 22d, and 22h) of the case 22 at the boundary between the housing space for the semiconductor element 11, that is, the case heat radiation part 25, and the housing space for other electronic components 24, that is, the other electronic component mounting part 26.
A slit 27, which is one of the features of the present invention, is provided in the. The slits 27 are formed at the lower ends of the side wall plates 22b and 22d (see FIG. 3) and at the center portions of the top wall plates 22a and 22h (see FIG.
(see reference numeral 22f in FIG. 2). As a result, both divided portions of the case 22 (that is, portions corresponding to the case heat dissipation section 25 and the other electronic component mounting section 26) are integrally coupled with sufficient strength. By providing the slit 27 in this way, the heat generated by the semiconductor element 11 is almost completely blocked from being conducted to the ceiling wall plate 22h, and the heat conduction to the ceiling wall plate 22& in the other electronic component mounting portions 26 is completely blocked. is prevented. As a result, the other electronic components 24 are not heated by the heat generated by the semiconductor element 11 and can be kept at a predetermined low temperature at all times. That is, the case heat radiating section 25 is formed by the ceiling wall plate 22h and the slit 27 working together to form a kind of radiator. Therefore, the heat generated by the semiconductor element 11 is transferred to the case heat dissipation section 2 as described above.
Most of the heat is radiated from the ceiling wall plate 22h at 5, and the heated high-temperature air inside the case heat radiating section 25 flows out from the slit 27.

As a result, according to the present Example 21, although it depends on the size of the case and the conditions such as the environmental temperature, - as an example,
When the internal temperature of the case heat radiation section 25 is about 50°C, the internal temperature of the other electronic component mounting section 26 can be suppressed to about 25°C to 30°C.

Incidentally, an integral heat dissipation fin (not shown) can be provided on the upper side of the ceiling wall plate 22h of the case heat dissipation section 25, and the heat dissipation effect can be further improved.

Further, as shown in FIG.
8, and is tightly abutted (suppressed) fixed on the ceiling wall plate 22h via the insulating sheet 12 by a leaf spring (elastic plate) 29 whose both ends are engaged with the mounting bracket 28. A recess (drawn part) 29a is provided in the center of the plate spring 29 by pressing or the like as a reinforcing part of the center. Further, in place of the recess 29a, it is also possible to easily form a reinforcing portion by bending both side edges of the central portion of the leaf spring 29 at approximately right angles. The mounting bracket 28 is provided with a bent portion 28a that is slightly bent outward at its upper end. This bent portion 28a serves to facilitate the engagement and mounting of the leaf spring 29. By forming the mounting structure for the semiconductor element 11 in this way, the semiconductor element 1
The installation work in step 1 can be extremely simplified.

In addition, in FIG. 3, the reference numeral 22g indicates the side wall plate 22b (22
d) shows a plurality of mounting pieces protruding from FIG. This mounting piece 2
By inserting and fixing 2g into the printed board 40 of the electronic device, the case 22 is attached and fixed onto the printed board 40. Further, the internal printed board 23 of the present embodiment 21 (11) and the printed board 40 of the device are electrically connected by electrode bins, although not shown.

5 is a plan view of the second embodiment 31 of the present invention, FIG. 6 is an end view seen from the direction of arrow B in FIG. 5, and FIG.
-c' line side sectional view. The present embodiment 31 is basically constructed in the same manner as the first embodiment 21 described above. The difference of the present embodiment 31 from the first embodiment 21 is that one ceiling wall plate 22a of the slit 27 is bent inward of the case 22 to provide an opening 32 directed toward the semiconductor element 11. , and a plurality of (six in this case) ventilation holes 33 are provided in the case side wall plate 22e facing the opening 32. In this way, opening 3
2 and the ventilation hole 33, the case heat dissipation part 2
The ventilation inside the semiconductor element 11 can be improved, and as a result, the heat generated by the semiconductor element 11 can be dissipated more efficiently. In particular, in the present embodiment 31, the case heat dissipation section 25
is on the upper side, and the other electronic component mounting section 26 is on the lower side (12).The effect is most pronounced when it is installed vertically.

Other functions and effects of the 31st embodiment are substantially the same as those of the first embodiment.

(G) Effects of the Invention As explained in detail above, the electronic component housing case of the present invention provides a wall plate of the case at the boundary between the housing space for the heat-generating semiconductor element and the housing space for the electronic component. A slit is provided, and a wall plate of the slit portion is bent inward of the case to provide an opening directed toward the heat generating semiconductor element, and a ventilation hole is provided in the case wall plate facing the opening, and By fixing the heat generating semiconductor element in contact with the case wall surface using an elastic plate without using M bolts or nuts, the heat generated by the heat generating semiconductor element can be effectively dissipated, and the heat generated by the heat generating semiconductor element can be effectively dissipated. It is possible to cut off heat conduction to the case wall plate corresponding to the mounting part, thereby preventing the temperature rise of heat-generating semiconductor elements and other electronic components, and further simplifying the installation process of heat-generating semiconductor elements. It has the great effect of being able to
This contributes to improved axis stability and reduced assembly costs◎

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the mounting structure of the heat-generating semiconductor element 11 in a conventional electronic component storage case (however, it is shown turned upside down), and FIG. 2 is a perspective view of the electronic component storage case of the present invention. A plan view of the first embodiment 21, FIG. 3 is A of FIG.
4 is a perspective view showing the mounting structure of the heat-generating semiconductor element 11 of FIG. Second example 31
6 is an end view seen from the direction of arrow B in FIG. 5, and FIG. 7 is a side sectional view taken along line c-c' in FIG. 5. 11... Heat generating semiconductor element (transistor, diode, etc.), 22... Small case, 22 a, 22 h
...Ceiling wall board, 22b, 22c, 22d, 22e...
- Side wall plate, 23... Internal printed board, 24... Other electronic components (capacitors, etc.), 25... Case heat dissipation section, 26... Other electronic component mounting section, 27... Slit, 29... Leaf spring (elastic plate), 29a... Recess provided in the center of the leaf spring 29 (throttled part; reinforcing part)
, 32...provided in the slit 27 portion of the semiconductor element 1
an opening oriented toward 1, 33...a ventilation hole; Patent Applicant: Fujitsu Limited, Patent Application Agent: Akira Aoki, Patent Attorney, Kazuyuki Nishidate, Patent Attorney (1) Yukio Patent Attorney, Akira Yamaguchi, Procedural Amendment Letter, September 7, 1985, Commissioner of the Patent Office, Manabu Shiga 1. Indication of the case 1980 Patent Application No. 035111 2. Name of the invention Electronic component storage case 3. Person making the amendment Relationship to the case Name of the patent applicant (522) Fujitsu Limited 4. Agent (3 others) ) 5. Subject of amendment (1) Column 6 of "Claims" of the specification, contents of amendment (II. Scope of claim 1 of the specification) shall be amended as shown in the attached sheet. 7. List of attached documents ( 11 Amended Claims 1 copy (2) 2. Claim 1: Heat-generating semiconductor elements and other electronic components in a case consisting of an internal printed board and a wall plate covering it? Component storage case (2) The heat-generating semiconductor element and other electronic components are each housed in separate spaces within the case, and a housing space for the heat-generating semiconductor element and a housing space for the other electronic component are separated. A slit Y is provided in the wall plate of the case at the boundary opening of the case, and when installing the heat generating semiconductor element, an elastic plate (2) is provided to attach the heat generating semiconductor element to the bottom plate surface (2) of the case without using bolts or nuts. A housing case for electronic components featuring abutment and fixation.Accommodation case. 4. Inside the case, which consists of an internal printed board, a wall plate covering it, and a heat-generating semiconductor element and other electronic components. In the electronic component housing case, which is mounted as an electronic component housing case, the heat generating semiconductor element and other electronic components are respectively housed in separate spaces within the case, and the housing space for the heat generating semiconductor element and the housing space for the other electronic components are separated. The boundary with (
The heat generating semiconductor element is mounted on the wall plate C of the case (2) with an elastic plate C2 without using bolts or nuts. The two walls are fixed in contact with each other, and the wall plate of one of the slits is bent inward of the case to provide the heat generating semiconductor element (an opening between the two fingers). An electronic component storage case characterized by a wall plate (having two ventilation holes). Component storage case. 6. Other electronic components? On the internal printed board (-
The electronic component storage case described in claim 4 or 5 is attached.

Claims (1)

[Scope of Claims] 1. In an electronic component housing case in which a heat generating semiconductor element and other electronic components are housed and mounted within a case consisting of an internal printed board and a wall plate covering the inner printed board, the heat generating semiconductor element and other electronic components are housed and mounted. Other electronic components are accommodated in separate spaces within the case, and 2, a slit is provided in the wall plate of the case at a boundary between the accommodation space for the heat-generating semiconductor element and the accommodation space for the other electronic components. An electronic component storage case, characterized in that when the heat generating semiconductor element is attached, the heat generating semiconductor element is fixed to the wall surface of the case by an elastic plate without using bolts or nuts. 2. In an electronic component housing case in which a heat generating semiconductor element and other electronic components are housed and mounted within a case consisting of an internal printed board and a wall plate covering this, the heat generating semiconductor element and other electronic components are respectively mounted. The heat-generating semiconductor elements are housed in separate spaces in the case, and a slit is provided in the wall plate of the case at a boundary between the heat-generating semiconductor element housing space and the other electronic component housing space, and the heat-generating semiconductor elements are housed in separate spaces. During installation, the heat-generating semiconductor element is fixed in contact with the wall plate surface of the case using an elastic plate without using nuts or bolts, and one wall plate of the slit portion is further bent inward of the case. An electronic component storage case characterized by having an opening facing the heat generating semiconductor element and providing a ventilation hole in a case wall plate facing the opening. 3. The electronic component storage case according to claim 1 or 2, wherein a reinforcing portion for preventing deformation is provided in the center of the elastic plate. 4. The electronic component storage case according to claim 1 or 2, wherein said electronic component is mounted on said internal printed board.