JPH0470752U - - Google Patents

Info

Publication number
JPH0470752U
JPH0470752U JP1990113810U JP11381090U JPH0470752U JP H0470752 U JPH0470752 U JP H0470752U JP 1990113810 U JP1990113810 U JP 1990113810U JP 11381090 U JP11381090 U JP 11381090U JP H0470752 U JPH0470752 U JP H0470752U
Authority
JP
Japan
Prior art keywords
semiconductor device
package structure
case
metal base
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990113810U
Other languages
English (en)
Japanese (ja)
Other versions
JP2505068Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990113810U priority Critical patent/JP2505068Y2/ja
Publication of JPH0470752U publication Critical patent/JPH0470752U/ja
Application granted granted Critical
Publication of JP2505068Y2 publication Critical patent/JP2505068Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1990113810U 1990-10-30 1990-10-30 半導体装置のパッケ―ジ構造 Expired - Lifetime JP2505068Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990113810U JP2505068Y2 (ja) 1990-10-30 1990-10-30 半導体装置のパッケ―ジ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990113810U JP2505068Y2 (ja) 1990-10-30 1990-10-30 半導体装置のパッケ―ジ構造

Publications (2)

Publication Number Publication Date
JPH0470752U true JPH0470752U (ko) 1992-06-23
JP2505068Y2 JP2505068Y2 (ja) 1996-07-24

Family

ID=31861426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990113810U Expired - Lifetime JP2505068Y2 (ja) 1990-10-30 1990-10-30 半導体装置のパッケ―ジ構造

Country Status (1)

Country Link
JP (1) JP2505068Y2 (ko)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051560A (ja) * 2001-08-03 2003-02-21 Fuji Electric Co Ltd 半導体装置のパッケージ
JP2008147234A (ja) * 2006-12-06 2008-06-26 Denso Corp 半導体基板のキャップ固着方法
JP2011096750A (ja) * 2009-10-28 2011-05-12 Shizuki Electric Co Inc コンデンサ
JP2011205270A (ja) * 2010-03-25 2011-10-13 Nippon Dempa Kogyo Co Ltd 圧電デバイス
WO2018055667A1 (ja) * 2016-09-20 2018-03-29 三菱電機株式会社 半導体装置
JP2019096797A (ja) * 2017-11-27 2019-06-20 三菱電機株式会社 半導体装置および電力変換装置
JP2020088141A (ja) * 2018-11-26 2020-06-04 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS63100842U (ko) * 1986-12-19 1988-06-30
JPH01165145A (ja) * 1987-12-21 1989-06-29 Mitsubishi Electric Corp 半導体装置
JPH02109418A (ja) * 1988-10-19 1990-04-23 Toshiba Corp 計時回路

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS63100842U (ko) * 1986-12-19 1988-06-30
JPH01165145A (ja) * 1987-12-21 1989-06-29 Mitsubishi Electric Corp 半導体装置
JPH02109418A (ja) * 1988-10-19 1990-04-23 Toshiba Corp 計時回路

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051560A (ja) * 2001-08-03 2003-02-21 Fuji Electric Co Ltd 半導体装置のパッケージ
JP4710194B2 (ja) * 2001-08-03 2011-06-29 富士電機システムズ株式会社 半導体装置のパッケージ
JP2008147234A (ja) * 2006-12-06 2008-06-26 Denso Corp 半導体基板のキャップ固着方法
JP2011096750A (ja) * 2009-10-28 2011-05-12 Shizuki Electric Co Inc コンデンサ
JP2011205270A (ja) * 2010-03-25 2011-10-13 Nippon Dempa Kogyo Co Ltd 圧電デバイス
WO2018055667A1 (ja) * 2016-09-20 2018-03-29 三菱電機株式会社 半導体装置
JPWO2018055667A1 (ja) * 2016-09-20 2019-02-28 三菱電機株式会社 半導体装置
CN109716516A (zh) * 2016-09-20 2019-05-03 三菱电机株式会社 半导体装置
US10748830B2 (en) 2016-09-20 2020-08-18 Mitsubishi Electric Corporation Semiconductor device
CN109716516B (zh) * 2016-09-20 2023-05-23 三菱电机株式会社 半导体装置
JP2019096797A (ja) * 2017-11-27 2019-06-20 三菱電機株式会社 半導体装置および電力変換装置
JP2020088141A (ja) * 2018-11-26 2020-06-04 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置

Also Published As

Publication number Publication date
JP2505068Y2 (ja) 1996-07-24

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