JPH0469819B2 - - Google Patents
Info
- Publication number
- JPH0469819B2 JPH0469819B2 JP12966686A JP12966686A JPH0469819B2 JP H0469819 B2 JPH0469819 B2 JP H0469819B2 JP 12966686 A JP12966686 A JP 12966686A JP 12966686 A JP12966686 A JP 12966686A JP H0469819 B2 JPH0469819 B2 JP H0469819B2
- Authority
- JP
- Japan
- Prior art keywords
- stud
- electrode
- diode
- semiconductor element
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 18
- 238000007789 sealing Methods 0.000 claims description 5
- 239000000696 magnetic material Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000012212 insulator Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Die Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12966686A JPS62286258A (ja) | 1986-06-04 | 1986-06-04 | スタツド形半導体装置 |
| DE19873718598 DE3718598A1 (de) | 1986-06-04 | 1987-06-03 | Halbleiteranordnung |
| US07/289,441 US4893173A (en) | 1986-06-04 | 1988-12-22 | Low-inductance semiconductor apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12966686A JPS62286258A (ja) | 1986-06-04 | 1986-06-04 | スタツド形半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62286258A JPS62286258A (ja) | 1987-12-12 |
| JPH0469819B2 true JPH0469819B2 (enrdf_load_stackoverflow) | 1992-11-09 |
Family
ID=15015147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12966686A Granted JPS62286258A (ja) | 1986-06-04 | 1986-06-04 | スタツド形半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62286258A (enrdf_load_stackoverflow) |
-
1986
- 1986-06-04 JP JP12966686A patent/JPS62286258A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62286258A (ja) | 1987-12-12 |
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