JPH0469774A - Parts arranging method for printed board cad device - Google Patents

Abstract

PURPOSE:To arrange the parts in an optimal position by taking up a candidate position of the parts face to the face of one side of a substrate, taking up a candidate position of the solder face to the face of the other side, and determining these candidate positions as arrangement positions of parts, in the case both the candidate position are the position which is not used yet for the arrangement of parts. CONSTITUTION:In a surface table storage part 63, an arrangement inhibition area table storage part 631, and an arrangement position retrieval table storage part 632 in which data for instructing an area used for arrangement of parts is stored are stored, and in a reverse side table 64, as well, an arrangement inhibition area table storage part 641 and an arrangement position retrieval table storage part 642 are provided in the same way. In such a state, with respect to the surface and the reverse side of a substrate, one of them and the other are set as a candidate position of the parts face, and a candidate position of the solder face, respectively, and in the case both the candidate positions are the position which is not used yet for the arrangement of parts, the candidate position position is determined as an arrangement position of parts. In such a way, parts are arranged in an optimal position.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an improvement in a component placement method of a printed circuit board CAD device that determines the position of components on a printed circuit board.

<Prior Art> Some conventional printed board CAD devices determine the placement positions of parts on a board so that they do not overlap with other parts.

<Problems to be Solved by the Invention> However, the conventional printed board CAD device has the following problems.

■Since the mounting surface of the components is not taken into account, when placing the components, even if you want to form a diagonal pattern on the back side of the board and other patterns on the front side, as shown in Figure 7, it is difficult to actually In the substrate pattern diagram shown in FIG. 8, the front surface pattern and the back surface pattern are arranged so that they do not overlap. For this reason, the efficiency of pattern arrangement is poor.

(2) As an initial arrangement, as shown in FIG. 9, parts can be divided and arranged into blocks B1 to B3 of logical functional units. However, since there is no function to actually place the parts within the board area A, the placement must be manually corrected after the divided placement to fit the parts within the area A.

■When dividing parts into blocks for each logical function unit and when determining the placement position, each part is processed individually, so parts that should originally be in the same block are placed in different blocks. They may become separated or placed in inappropriate positions. For example, in the circuit diagram of Figure 10, components d1 and d2 were originally functional unit block D.
, although in the actual board pattern diagram, component d is classified as block D as shown in FIG.
2, part d2 may end up in block 1)3.

The present invention has been made to solve these problems, and it is possible to determine the placement position by taking into account whether the component is placed on the front or back side of the board, and it also makes it possible to 17 The purpose of this invention is to realize a method for arranging parts for a printed board CA■) device that allows parts to be placed at optimal positions without disrupting the layout.

Means for Solving the Problems> The present invention is a component arrangement method for a printed board CAD device as follows.

(1) Printed board CA to determine the placement position of the components on the board 1) In the device component placement method, pick up the candidate position of the component side on one side of the board, and place the solder side on the other side. 1) A method for arranging parts in an apparatus.

2) To determine the placement position of components, divide the circuit diagram of the board into groups centered on the core components, decide the placement location of the core components on the board first, and then 2. The method according to claim 1, further comprising determining the placement position of other components around the component according to the connection state.

(3) If all parts are to be placed within a specified area, set a prohibited area outside the specified area and claim (2)
A claim characterized in that the placement position is determined by the method (
1) The method described.

In the present invention, one of the front and back sides of the board is set as a candidate position for the component side, and the other side is set as a candidate position for the filler side, and both candidate positions are not yet used for placing parts. If the position is not listed, the candidate position is determined as the part placement position. In addition, the circuit diagram of the board is divided into groups with the core component as the center, and the placement position on the board is determined from the core component within the group to other peripheral components according to the connection state. Furthermore, if all parts are to be placed within the specified area, a placement prohibited area is set outside the specified area.

<Example> Hereinafter, the present invention will be explained using the drawings.

FIG. 1 shows a printer for carrying out the method according to the present invention.
- Substrate CA I) It is a block diagram of an example of an apparatus.

This printed circuit board CAD device includes a data input section 1, a program input section 2, a display section 3, a printer 4, a CPU 5, and a storage section 6.

The data input unit 1 is a device for inputting various data used when designing a circuit diagram and designing a pattern of a printed circuit board.

The program input unit 2 is a device into which various programs such as a network I to list 1 creation program, a component placement/wiring program, and a wiring position search program are input.

The display section 3 and the printer 4 display and print circuit diagrams, print patterns, etc. designed by the CA and D devices, respectively.

CP tJ 5 centrally controls the operation of the CAD device.

The storage unit 6 includes a program storage unit 61, a graphic storage unit 62,
It consists of a table storage section 63 for the front side and a table storage section 64 for the back side.

The program storage section 61 stores various programs input from the program input section 2.

The graphic recording/listening section 62 stores designed circuit diagrams and print patterns in the form of graphic data.

The front surface table storage section 63 includes a placement prohibited area table storage section 631 that stores data indicating placement prohibited areas on the front surface of a printed circuit board, and a storage area 631 that stores data indicating prohibited placement areas on the front surface of a printed circuit board, and a storage area 631 that indicates areas used for arranging components on the surface of a printed circuit board. A placement position search table storage unit 632 is stored with data to be searched.

Similarly, the back table 64 is also provided with a prohibited area table storage section 641 and a placement position search table storage section 642.

Using such a board CAD device, the positions at which parts are to be placed are determined in the following steps.

The pattern of the printed circuit board before the method according to the present invention is implemented is as shown in FIG. 2 in the case of block division arrangement, and as shown in FIG. 3 in the case of area designated arrangement. Here, the block division arrangement is to divide a circuit diagram into blocks in units of logical functions, and arrange components on a board according to this division. In addition, area specified placement means arranging components so that they fit within a specified area on the board.

In the case of block division arrangement, parts are arranged around key part A in FIG. 2 to construct a logical function. In addition, in the case of area designated placement, the parts are placed around the fixed part C so as to fit within the placement area B in FIG.

From the state of the printed circuit board shown in Figure 2 or Figure 3, two of the parts to be placed, including key parts or fixed parts, are
Sub-components, such as resistors, capacitors, diodes, etc., are
Components that are more than terminals, such as transistors, transformers, and ICs
Divide into small groups with etc. as the core.

Next, the areas of the key parts or fixed parts that have already been placed are entered in the placement position search table. There are two layout position search tables, one for the front surface of the board and one for the back surface. For example, when a component is placed on the surface as shown in Fig. 1, the JTobe data of the component surface area E of the component is sent to the solder 1 in the surface placement search table '1'', and the solder surface area F is The coordinate data is stored in the rear side arrangement search table 'I'2. Conversely, if the component is placed on the back side, the coordinate data of the component surface area is stored in the back side placement search table, and the coordinates of the solder side area are placed in the front side placement search table. In the case of area specified placement, as shown in FIG. 5, the coordinate data of areas G, .about.G5 outside the placement area are placed in the placement prohibition table '3'.

Here, parts that make up a small group with the key part or fixed part as the core are placed around the key part or fixed part according to their connection status, and then each group is placed on the board. conduct.

In the position search, the vicinity of connected equipment components is extracted as placement position candidates.

Here, when placing on the front side of the board, and in the case of block division placement, check the front side placement position search table in the component surface area of the candidate position, and search the back side placement position search table in the solder side area. investigate. If there is no overlap between both areas and the multiple flight area of the search table, the candidate position is determined as the component placement area.

When placing on the front side of the board, if it is a specified area placement, search the front side placement prohibited area table in the component rfi1 area of the candidate position, and search the back side placement prohibited area table in the solder surface area. do. Then, if there is no overlap between both areas and the area for multiple flights in the placement prohibited area table,
The candidate position is determined as the part placement position.

When components are placed on the back side of the board, the front side table and back side table that are searched in each area are reversed from those for front side placement.

When the placement position is found, the area of the part is placed in the placement position search table or placement prohibited area table according to the placement plane, in the same way as key parts or fixed parts, and the part is processed later. Define existing equipment parts for parts and items.

The process ends when the placement positions of all parts are determined.

Such a processing procedure is shown in flowcharts 1 to 6 as shown in FIG.

Effect〉 According to the present invention, the following effects can be obtained.

■For a component, areas are set on the component side and the solder side, and the placement position is determined after checking the overlap with other parts for each area. Components with different mounting surfaces can be stacked on the front and back of the board.

■Parts are divided into small groups, and block divisions and parts placement positions are determined in units of these small groups, so highly related parts are no longer placed in separate locations.

- In the case of area-designated placement, the area outside the specified area is registered as a placement-prohibited area, so parts will not be placed outside the specified area.

[Brief explanation of the drawing]

FIG. 1 shows a substrate CA for carrying out the method according to the present invention.
Figures 2 to 6 are explanatory diagrams of the method according to the present invention, and Figures 7 to 11 are diagrams showing an example of the configuration of the D device. It is an explanatory diagram showing an example. 1...Data input section, 2...Program input section, 3
...Display section, 4...Printer, 5...CPU, 6
...Storage section, 61...Program storage section, 62...
・Graphic data storage unit, 63...Table storage unit for front side, 64...Table record for back 1rll・Hoof part, 631
, 641-arrangement tffi prohibited area table storage unit, 63
2,642...Placement position search table. Sorrow 9 Figure/θ 1st/

Claims (3)

[Claims] (1) In the component placement method of a printed board CAD device that determines the placement position of components on a printed circuit board, candidate positions for the component surface are picked up on one side of the board, and candidate positions for the solder side are picked up on the other side. , if both candidate positions are positions that have not yet been used for component placement, these candidate positions are determined as the component placement positions. (2) To determine the placement position of components, divide the circuit diagram of the board into groups centered on the core components, determine the placement location of the core components on the board first, and then 2. The method according to claim 1, further comprising determining the placement position of other components around the component according to the connection state. (3) If all parts are to be placed within a specified area, set a prohibited area outside the specified area and claim (2)
A claim characterized in that the placement position is determined by the method (
1) The method described.