JPH0468799B2 - - Google Patents

Info

Publication number
JPH0468799B2
JPH0468799B2 JP2053935A JP5393590A JPH0468799B2 JP H0468799 B2 JPH0468799 B2 JP H0468799B2 JP 2053935 A JP2053935 A JP 2053935A JP 5393590 A JP5393590 A JP 5393590A JP H0468799 B2 JPH0468799 B2 JP H0468799B2
Authority
JP
Japan
Prior art keywords
plating
tank
supply pipe
plating liquid
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2053935A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0375376A (ja
Inventor
Toshuki Oonishi
Atsushi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plantex Ltd
Original Assignee
Plantex Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plantex Ltd filed Critical Plantex Ltd
Priority to JP5393590A priority Critical patent/JPH0375376A/ja
Publication of JPH0375376A publication Critical patent/JPH0375376A/ja
Publication of JPH0468799B2 publication Critical patent/JPH0468799B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP5393590A 1990-03-06 1990-03-06 無電解メッキ槽のメッキ液循環装置 Granted JPH0375376A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5393590A JPH0375376A (ja) 1990-03-06 1990-03-06 無電解メッキ槽のメッキ液循環装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5393590A JPH0375376A (ja) 1990-03-06 1990-03-06 無電解メッキ槽のメッキ液循環装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3792983A Division JPS59161895A (ja) 1983-03-07 1983-03-07 プリント基板のスルーホールメッキ装置

Publications (2)

Publication Number Publication Date
JPH0375376A JPH0375376A (ja) 1991-03-29
JPH0468799B2 true JPH0468799B2 (enExample) 1992-11-04

Family

ID=12956599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5393590A Granted JPH0375376A (ja) 1990-03-06 1990-03-06 無電解メッキ槽のメッキ液循環装置

Country Status (1)

Country Link
JP (1) JPH0375376A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020065711A (ko) * 2001-02-07 2002-08-14 차성욱 피씨비 동도금 방법
JP4602896B2 (ja) * 2005-11-24 2010-12-22 株式会社フジクラ メッキ装置
KR102022920B1 (ko) * 2019-06-25 2019-09-19 주식회사 태성 롤투롤 수평식 연속 도금장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161895A (ja) * 1983-03-07 1984-09-12 株式会社　プランテツクス プリント基板のスルーホールメッキ装置

Also Published As

Publication number Publication date
JPH0375376A (ja) 1991-03-29

Similar Documents

Publication Publication Date Title
EP2458030A1 (en) Method of coating a part of a heat exchanger and heat exchanger
JPH047120B2 (enExample)
US4734296A (en) Electroless plating of through-holes using pressure differential
JPH0468799B2 (enExample)
JPH048960B2 (enExample)
JPH0375378A (ja) 無電解メッキ槽のメッキ液循環装置
JP3196092B2 (ja) 化学メッキ槽
JPH0345970U (enExample)
CN212812193U (zh) 一种用于印刷电路板化学镀镍的装置
JPH03146675A (ja) 無電解メッキ装置
US3824137A (en) Solution agitation process
CN212800534U (zh) 一种印刷电路板用高效溶液循环化学镍槽
JP3339483B2 (ja) 堰部材、液槽及び物品処理装置
CA1219179A (en) Apparatus and method for electroless plating
JP7111386B2 (ja) 無電解めっき装置
US3880409A (en) Solution agitation apparatus
TWM616805U (zh) 逐片連續生產的化學沉積設備
CN213626853U (zh) 一种用于恒温洗浴的自动补水装置
CN206396325U (zh) 一种用于化学镀的装置
JP2003221698A (ja) めっき装置
CN222666058U (zh) 一种喷流装置及电镀设备
CN212983047U (zh) 一种用于ic载板化学镀的镀液循环装置
JPH02298273A (ja) 無電解めっき液の混合装置
JP3880024B2 (ja) 電着レジスト塗布物の製造方法及びそのための装置
JPH01252784A (ja) 通路内壁面の鍍金方法および鍍金装置