JPH0465473U - - Google Patents

Info

Publication number
JPH0465473U
JPH0465473U JP1990107867U JP10786790U JPH0465473U JP H0465473 U JPH0465473 U JP H0465473U JP 1990107867 U JP1990107867 U JP 1990107867U JP 10786790 U JP10786790 U JP 10786790U JP H0465473 U JPH0465473 U JP H0465473U
Authority
JP
Japan
Prior art keywords
conductive pattern
jumper wire
electromagnetic shielding
insulating layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990107867U
Other languages
English (en)
Other versions
JP2516314Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990107867U priority Critical patent/JP2516314Y2/ja
Priority to GB9121899A priority patent/GB2248972B/en
Priority to US07/776,633 priority patent/US5262596A/en
Publication of JPH0465473U publication Critical patent/JPH0465473U/ja
Application granted granted Critical
Publication of JP2516314Y2 publication Critical patent/JP2516314Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0039Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第1図は本考案電磁波シールドプリント配線板
の実施例を示す断面図、第2図は従来のプリント
配線板の断面図である。 1……絶縁基板、2……導電パターン、2a,
2b……接続端子、3,30……絶縁層、4……
ジヤンパー層、5……シールド層、6……オーバ
ーコート。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板上に形成した導電パターンと、この導
    電パターンの所要の接続端子間に絶縁層を介して
    形成したジヤンパー線と、このジヤンパー線を被
    覆する絶縁層と、前記ジヤンパー線を含む前記導
    電パターンをシールドする電磁波シールド層とか
    ら成る電磁波シールドプリント配線板。
JP1990107867U 1990-10-15 1990-10-15 電磁波シールドプリント配線板 Expired - Lifetime JP2516314Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1990107867U JP2516314Y2 (ja) 1990-10-15 1990-10-15 電磁波シールドプリント配線板
GB9121899A GB2248972B (en) 1990-10-15 1991-10-15 Printed wiring board
US07/776,633 US5262596A (en) 1990-10-15 1991-10-15 Printed wiring board shielded from electromagnetic wave

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990107867U JP2516314Y2 (ja) 1990-10-15 1990-10-15 電磁波シールドプリント配線板

Publications (2)

Publication Number Publication Date
JPH0465473U true JPH0465473U (ja) 1992-06-08
JP2516314Y2 JP2516314Y2 (ja) 1996-11-06

Family

ID=14470093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990107867U Expired - Lifetime JP2516314Y2 (ja) 1990-10-15 1990-10-15 電磁波シールドプリント配線板

Country Status (3)

Country Link
US (1) US5262596A (ja)
JP (1) JP2516314Y2 (ja)
GB (1) GB2248972B (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5973910A (en) * 1991-12-31 1999-10-26 Intel Corporation Decoupling capacitor in an integrated circuit
US5472900A (en) * 1991-12-31 1995-12-05 Intel Corporation Capacitor fabricated on a substrate containing electronic circuitry
US5285017A (en) * 1991-12-31 1994-02-08 Intel Corporation Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias
US5414221A (en) * 1991-12-31 1995-05-09 Intel Corporation Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias
JPH069166U (ja) * 1992-07-03 1994-02-04 日本シイエムケイ株式会社 電磁波シールドを有するプリント配線板
US5912809A (en) * 1997-01-21 1999-06-15 Dell Usa, L.P. Printed circuit board (PCB) including channeled capacitive plane structure
US6180876B1 (en) 1997-12-29 2001-01-30 Research In Motion Limited Apparatus and method for RF shielding of a printed circuit board
US6178311B1 (en) 1998-03-02 2001-01-23 Western Multiplex Corporation Method and apparatus for isolating high frequency signals in a printed circuit board
US6150895A (en) * 1999-01-25 2000-11-21 Dell Usa, L.P. Circuit board voltage plane impedance matching
US6753746B2 (en) * 2001-11-07 2004-06-22 Compeq Manufacturing Co., Ltd. Printed circuit board having jumper lines and the method for making said printed circuit board
CN100531543C (zh) * 2005-09-09 2009-08-19 鸿富锦精密工业(深圳)有限公司 降低电磁干扰的接地装置
KR20100104911A (ko) * 2009-03-19 2010-09-29 삼성전자주식회사 반도체 패키지
CN105711252B (zh) * 2016-02-01 2018-06-19 江汉大学 基于电磁兼容的印刷装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529276U (ja) * 1978-08-16 1980-02-26
JPS5778672U (ja) * 1980-10-31 1982-05-15
JPS585659A (ja) * 1981-06-24 1983-01-13 ハイブリテツク インコ−ポレ−テツド 単クロ−ン性抗体を使用する免疫学的、抑制試験
JPS6414992A (en) * 1987-07-08 1989-01-19 Brother Ind Ltd Manufacture of printed wiring board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3647585A (en) * 1969-05-23 1972-03-07 Bell Telephone Labor Inc Method of eliminating pinhole shorts in an air-isolated crossover
US4141055A (en) * 1977-04-27 1979-02-20 Bell Telephone Laboratories, Incorporated Crossover structure for microelectronic circuits
US4118595A (en) * 1977-06-06 1978-10-03 Bell Telephone Laboratories, Incorporated Crossovers and method of fabrication
GB2029645B (en) * 1978-08-07 1982-07-14 Mitsumi Electric Co Ltd High-frequency circuit device
US4801489A (en) * 1986-03-13 1989-01-31 Nintendo Co., Ltd. Printed circuit board capable of preventing electromagnetic interference
DK385587A (da) * 1986-08-01 1988-02-02 Siemens Ag Kredsloebsplade til anvendelse inden for kommunikationsteknikken
US4754101A (en) * 1986-10-23 1988-06-28 Instrument Specialties Co., Inc. Electromagnetic shield for printed circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529276U (ja) * 1978-08-16 1980-02-26
JPS5778672U (ja) * 1980-10-31 1982-05-15
JPS585659A (ja) * 1981-06-24 1983-01-13 ハイブリテツク インコ−ポレ−テツド 単クロ−ン性抗体を使用する免疫学的、抑制試験
JPS6414992A (en) * 1987-07-08 1989-01-19 Brother Ind Ltd Manufacture of printed wiring board

Also Published As

Publication number Publication date
GB2248972A (en) 1992-04-22
JP2516314Y2 (ja) 1996-11-06
US5262596A (en) 1993-11-16
GB9121899D0 (en) 1991-11-27
GB2248972B (en) 1994-06-15

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