JPH01129885U - - Google Patents
Info
- Publication number
- JPH01129885U JPH01129885U JP2381488U JP2381488U JPH01129885U JP H01129885 U JPH01129885 U JP H01129885U JP 2381488 U JP2381488 U JP 2381488U JP 2381488 U JP2381488 U JP 2381488U JP H01129885 U JPH01129885 U JP H01129885U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- device casing
- printed
- wiring board
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は本考案に係る印刷配線基板の一例を示す断面
図、第３図は従来の電子機器筐体を示す断面図で
ある。 １１……ボード、１２……印刷配線基板、１３
……電子機器筐体、１４……電子部品、１５……
入出力端子、１２１……金属基板、１２２……絶
縁物、１２３……導電体パターン。
図は本考案に係る印刷配線基板の一例を示す断面
図、第３図は従来の電子機器筐体を示す断面図で
ある。 １１……ボード、１２……印刷配線基板、１３
……電子機器筐体、１４……電子部品、１５……
入出力端子、１２１……金属基板、１２２……絶
縁物、１２３……導電体パターン。
Claims (1)
- 上面に絶縁物が設けられた金属基板上に導電体
パターンが印刷配線された印刷配線基板を用いて
電子機器筐体の少なくとも１部を構成することを
特徴とする電子機器筐体。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2381488U JPH01129885U (ja) | 1988-02-26 | 1988-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2381488U JPH01129885U (ja) | 1988-02-26 | 1988-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129885U true JPH01129885U (ja) | 1989-09-04 |
Family
ID=31243121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2381488U Pending JPH01129885U (ja) | 1988-02-26 | 1988-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129885U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (ja) * | 1988-10-19 | 1990-04-26 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856483B2 (ja) * | 1980-12-29 | 1983-12-15 | 松下電工株式会社 | Ｗｐｃ単板の製造方法 |
-
1988
- 1988-02-26 JP JP2381488U patent/JPH01129885U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856483B2 (ja) * | 1980-12-29 | 1983-12-15 | 松下電工株式会社 | Ｗｐｃ単板の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (ja) * | 1988-10-19 | 1990-04-26 |