JPH02104692U - - Google Patents

Info

Publication number
JPH02104692U
JPH02104692U JP1310389U JP1310389U JPH02104692U JP H02104692 U JPH02104692 U JP H02104692U JP 1310389 U JP1310389 U JP 1310389U JP 1310389 U JP1310389 U JP 1310389U JP H02104692 U JPH02104692 U JP H02104692U
Authority
JP
Japan
Prior art keywords
board
chassis
circuit
wiring
board mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1310389U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1310389U priority Critical patent/JPH02104692U/ja
Publication of JPH02104692U publication Critical patent/JPH02104692U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示す断面図で第2
図は上面図で、第3図は従来例を示す図である。 1…プリント基板、2…基板取付け孔、3…配
線孔、4…シヤーシ、5…ネジ、6…ジヤンパー
配線である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電子部品組付け基板に於いて基板取付け孔と基
    板取付け孔の周辺部の配線孔間にジヤンパー配線
    を有し基板をシヤーシに取付けた状態で基板取付
    けネジとジヤンパー配線が接触して基板回路とシ
    ヤーシとを導通せしめることを特徴とするプリン
    ト基板のアース。
JP1310389U 1989-02-08 1989-02-08 Pending JPH02104692U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1310389U JPH02104692U (ja) 1989-02-08 1989-02-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1310389U JPH02104692U (ja) 1989-02-08 1989-02-08

Publications (1)

Publication Number Publication Date
JPH02104692U true JPH02104692U (ja) 1990-08-20

Family

ID=31223135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1310389U Pending JPH02104692U (ja) 1989-02-08 1989-02-08

Country Status (1)

Country Link
JP (1) JPH02104692U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5224552B2 (ja) * 1973-12-27 1977-07-01
JPS5524858U (ja) * 1978-08-04 1980-02-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5224552B2 (ja) * 1973-12-27 1977-07-01
JPS5524858U (ja) * 1978-08-04 1980-02-18

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