JPH0465465U - - Google Patents

Info

Publication number
JPH0465465U
JPH0465465U JP1990109204U JP10920490U JPH0465465U JP H0465465 U JPH0465465 U JP H0465465U JP 1990109204 U JP1990109204 U JP 1990109204U JP 10920490 U JP10920490 U JP 10920490U JP H0465465 U JPH0465465 U JP H0465465U
Authority
JP
Japan
Prior art keywords
led element
insulating substrate
electrodes
led
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990109204U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990109204U priority Critical patent/JPH0465465U/ja
Publication of JPH0465465U publication Critical patent/JPH0465465U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1990109204U 1990-10-18 1990-10-18 Pending JPH0465465U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990109204U JPH0465465U (zh) 1990-10-18 1990-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990109204U JPH0465465U (zh) 1990-10-18 1990-10-18

Publications (1)

Publication Number Publication Date
JPH0465465U true JPH0465465U (zh) 1992-06-08

Family

ID=31856369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990109204U Pending JPH0465465U (zh) 1990-10-18 1990-10-18

Country Status (1)

Country Link
JP (1) JPH0465465U (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114751A (ja) * 1991-10-23 1993-05-07 Sharp Corp 光半導体装置
JPH08287178A (ja) * 1995-04-13 1996-11-01 Keyence Corp 照明装置および光学的情報読取装置
WO2001082386A1 (fr) * 2000-04-24 2001-11-01 Rohm Co., Ltd. Dispositif semi-conducteur electroluminescent a emission laterale et son procede de production
JP2003234507A (ja) * 2002-02-07 2003-08-22 Koha Co Ltd 側面発光型ｌｅｄランプ
JP2015170813A (ja) * 2014-03-10 2015-09-28 日亜化学工業株式会社 発光装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02151086A (ja) * 1988-12-01 1990-06-11 Matsushita Electric Ind Co Ltd 発光ダイオード

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02151086A (ja) * 1988-12-01 1990-06-11 Matsushita Electric Ind Co Ltd 発光ダイオード

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114751A (ja) * 1991-10-23 1993-05-07 Sharp Corp 光半導体装置
JPH08287178A (ja) * 1995-04-13 1996-11-01 Keyence Corp 照明装置および光学的情報読取装置
WO2001082386A1 (fr) * 2000-04-24 2001-11-01 Rohm Co., Ltd. Dispositif semi-conducteur electroluminescent a emission laterale et son procede de production
JP2003234507A (ja) * 2002-02-07 2003-08-22 Koha Co Ltd 側面発光型ｌｅｄランプ
JP2015170813A (ja) * 2014-03-10 2015-09-28 日亜化学工業株式会社 発光装置

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