JPS6144861U - 発光素子 - Google Patents

発光素子

Info

Publication number
JPS6144861U
JPS6144861U JP1984130305U JP13030584U JPS6144861U JP S6144861 U JPS6144861 U JP S6144861U JP 1984130305 U JP1984130305 U JP 1984130305U JP 13030584 U JP13030584 U JP 13030584U JP S6144861 U JPS6144861 U JP S6144861U
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
light
conductors
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984130305U
Other languages
English (en)
Inventor
治夫 小材
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP1984130305U priority Critical patent/JPS6144861U/ja
Publication of JPS6144861U publication Critical patent/JPS6144861U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図は第１図に
示された発光素子１５の構造を示す斜視図、第３図は第
１図に示された実施例の外観を示す斜視図、第４図は第
１図〜第３図に示された発光素子１５の製造工程を説明
するための平面図、第５図は取付部１８付近の正面図、
第６図は発光素子１５を以刷配線基板４０に実装した状
態を示す斜視図、第７図は本考案の他の実施例の斜視図
、第８図は先行技術を示す断面図、第９図は先行技術の
斜視図、第１０図は先行技術の製造工程を示す正面図、
第１１図は先行技術の発光素子を印刷配線基板１３に実
装した状態を示す斜視図である。 Ｌ ２，１６，１７・・・導体、３，１８・・・取付部
、５，２１・・・発光素子チップ、６，２５・・・リー
ド線、８，２７・・・被覆体、１５・・・発光素子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 仮想一平面内に間隔をあけて配置した一対の導体を設け
    、一方の導体の端部には前記仮想平面に対して窪んだ凹
    所を有する取付部が形成されており、この凹所の底には
    その凹所の開放端に向けて光を発生する発光素子チップ
    を電気的に接続して固着し、発光素子チップはリード線
    を介して他方の導体の端部に電気的に接続され、前記導
    体の端部と、取付部と発光素子チップとリード線とを透
    光性材料で被覆したことを特徴とする発光素子。
JP1984130305U 1984-08-28 1984-08-28 発光素子 Pending JPS6144861U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984130305U JPS6144861U (ja) 1984-08-28 1984-08-28 発光素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984130305U JPS6144861U (ja) 1984-08-28 1984-08-28 発光素子

Publications (1)

Publication Number Publication Date
JPS6144861U true JPS6144861U (ja) 1986-03-25

Family

ID=30688920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984130305U Pending JPS6144861U (ja) 1984-08-28 1984-08-28 発光素子

Country Status (1)

Country Link
JP (1) JPS6144861U (ja)

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