JPH0465451U - - Google Patents
Info
- Publication number
- JPH0465451U JPH0465451U JP10941890U JP10941890U JPH0465451U JP H0465451 U JPH0465451 U JP H0465451U JP 10941890 U JP10941890 U JP 10941890U JP 10941890 U JP10941890 U JP 10941890U JP H0465451 U JPH0465451 U JP H0465451U
- Authority
- JP
- Japan
- Prior art keywords
- resin case
- heat sink
- semiconductor element
- contact
- contact surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990109418U JPH079381Y2 (ja) | 1990-10-18 | 1990-10-18 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990109418U JPH079381Y2 (ja) | 1990-10-18 | 1990-10-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0465451U true JPH0465451U (en:Method) | 1992-06-08 |
| JPH079381Y2 JPH079381Y2 (ja) | 1995-03-06 |
Family
ID=31856619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990109418U Expired - Fee Related JPH079381Y2 (ja) | 1990-10-18 | 1990-10-18 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079381Y2 (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310381A (ja) * | 2005-04-26 | 2006-11-09 | Toyota Industries Corp | 電子機器 |
| JP2012015349A (ja) * | 2010-07-01 | 2012-01-19 | Fuji Electric Co Ltd | 半導体装置 |
| JP2018190894A (ja) * | 2017-05-10 | 2018-11-29 | 株式会社豊田自動織機 | 半導体モジュール |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126649U (en:Method) * | 1979-03-01 | 1980-09-08 | ||
| JPS58166045U (ja) * | 1982-04-28 | 1983-11-05 | 日本電気株式会社 | 半導体装置 |
| JPS62108545A (ja) * | 1985-11-06 | 1987-05-19 | Shinko Electric Ind Co Ltd | プリント基板型パッケ−ジ |
-
1990
- 1990-10-18 JP JP1990109418U patent/JPH079381Y2/ja not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126649U (en:Method) * | 1979-03-01 | 1980-09-08 | ||
| JPS58166045U (ja) * | 1982-04-28 | 1983-11-05 | 日本電気株式会社 | 半導体装置 |
| JPS62108545A (ja) * | 1985-11-06 | 1987-05-19 | Shinko Electric Ind Co Ltd | プリント基板型パッケ−ジ |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310381A (ja) * | 2005-04-26 | 2006-11-09 | Toyota Industries Corp | 電子機器 |
| JP2012015349A (ja) * | 2010-07-01 | 2012-01-19 | Fuji Electric Co Ltd | 半導体装置 |
| JP2018190894A (ja) * | 2017-05-10 | 2018-11-29 | 株式会社豊田自動織機 | 半導体モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH079381Y2 (ja) | 1995-03-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |