JPH0464300A - Board positioning device - Google Patents
Board positioning deviceInfo
- Publication number
- JPH0464300A JPH0464300A JP2177921A JP17792190A JPH0464300A JP H0464300 A JPH0464300 A JP H0464300A JP 2177921 A JP2177921 A JP 2177921A JP 17792190 A JP17792190 A JP 17792190A JP H0464300 A JPH0464300 A JP H0464300A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- board
- printed circuit
- circuit board
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、リード付きおよびリードレスの電子部品をプ
リント基板上の所定位置に挿入・装置する際などに、プ
リント基板を所定の位置まで、搬送・位置決めする基板
位置決め装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is useful for transporting and transporting printed circuit boards to predetermined positions, such as when inserting and installing leaded and leadless electronic components into predetermined positions on a printed circuit board. The present invention relates to a substrate positioning device for positioning.
従来の技術
昨今、電子部品実装分野の拡大とともに電子部品実装装
置には高生産性・高稼働率が求められ、部品１点当たり
の実装タクトの向上が急速に進んでいる。BACKGROUND OF THE INVENTION Recently, with the expansion of the field of electronic component mounting, high productivity and high operating rates are required of electronic component mounting equipment, and the mounting takt time per component is rapidly improving.
第４図、第５図を参照しなから、電子部品装置装置に適
用されている従来の基板位置決め装置について説明する
。With reference to FIGS. 4 and 5, a conventional board positioning device applied to an electronic component device will be described.
第４図は従来例として、電子部品実装装中に組み込まれ
た基板位置決め装置を示している。電子部品装置装置に
おいても基板位置決め装置の基本的構成は変わらない。FIG. 4 shows, as a conventional example, a board positioning device incorporated into an electronic component mounting system. The basic configuration of the board positioning device remains the same in electronic component devices.
１は部品供給テーブルであり、着脱可能の部品供給装置
２を有しており、所定の電子部品５を主軸３に移すため
に位置決めを行う。主軸３の周縁には投雪ノズル４が回
動・昇降自在に取付けられ、この投雪ノズル４は吸着し
た電子部品５を主軸３の間欠回転運動に伴い、部品姿勢
規正装置１８に送る。この部品姿勢規正装置１８で姿勢
を規正された電子部品５は、次に所定の絢度方向に回転
された後、プリント基板１９上に実装される。２０は固
定具、２１は基板位置決め装置であり、プリント基板１
９は固定真夏により、基板位置決め装置１２１上に固定
保持されている。基板位置決め装置２１は、２次元平面
上を自在に動作可能ないわゆるＸ−Ｙテーブル１個によ
り構成されている。基板位置決め装置２１はボールねじ
ｎの回転動作により、電子部品５を吸着している吸着ノ
ズル４の装着位置にプリント基板１９か合致するように
、プリント基板１９の位置決め動作を行う。ｎはローダ
−であり、鱈工程より図示しないベルトコンベアなどの
搬入装置から本装置に搬入した次のプリント基板１９を
待機させている。また、冴はアンローダ−であり、実装
中のプリント基板１９は、実装終ｒ＆にアンローダ−２
４に搬出され、図示しない搬出装置により次工程へ送ら
れる。２５は基板搬送装置であり、ボールねじ２６によ
り直線移動自在とされ、先端にブラケット２７が取付け
られた２つのアーム部２５ａを有し、この基板搬送装置
５はプリント基板１９の基板位置決め装置２１への搬入
および基板位置決め装置２１からの搬出を行うものであ
る。Reference numeral 1 denotes a component supply table, which has a removable component supply device 2, which positions a predetermined electronic component 5 to be transferred to the main shaft 3. A snow-throwing nozzle 4 is attached to the periphery of the main shaft 3 so as to be rotatable and movable up and down, and the snow-throwing nozzle 4 sends the picked-up electronic components 5 to the component attitude adjustment device 18 along with the intermittent rotational movement of the main shaft 3. The electronic component 5 whose posture has been regulated by the component posture regulating device 18 is then mounted on the printed circuit board 19 after being rotated in a predetermined density direction. 20 is a fixture, 21 is a board positioning device, and the printed board 1
9 is fixedly held on the substrate positioning device 121 by a fixed midsummer. The substrate positioning device 21 includes one so-called X-Y table that can freely move on a two-dimensional plane. The board positioning device 21 performs a positioning operation of the printed circuit board 19 by rotating the ball screw n so that the printed circuit board 19 matches the mounting position of the suction nozzle 4 that is sucking the electronic component 5. A loader n waits for the next printed circuit board 19 carried into this apparatus from a carrying device such as a belt conveyor (not shown) from the cod process. Further, Sae is an unloader, and the printed circuit board 19 being mounted is transferred to the unloader 2 at the end of mounting.
4, and sent to the next process by a transport device (not shown). Reference numeral 25 denotes a board transfer device, which is linearly movable by a ball screw 26 and has two arm portions 25a each having a bracket 27 attached to its tip. The substrate positioning device 21 carries in the board and takes it out from the board positioning device 21.
以上のように構成された電子部品装着装置についてその
動作を第５図（Ａ）〜（Ｄ）を用いて説明する。The operation of the electronic component mounting apparatus configured as described above will be explained using FIGS. 5(A) to 5(D).
第５図（Ａ）は主軸３の回転動作によりプリント基板１
９上へ電子部品５を実装している際の状態を示している
。このきき、次のプリント基板１９はローダ−田土で待
機している。第５図（Ｂ）は、プリント基板１９への実
装が終Ｔした状態を示すもので、主軸３は装着動作を停
止し、次のプリント基板１９が、所定の位置へ位置決め
されるまで、装着動作は行われない。基板位置決め装置
２１が、このとき、ローダ−おとアンローダースの間の
、あらかしめ決められたプリント基板１９の搬入・搬出
位＠まで移動してくる。ここで、基板位置決め装置２１
のストローク長や基板位置決め装置２１のサイズに応じ
て、ローダ−おおよびアンローダ−２４は、あらかじめ
基板位置決め装置２１のストローク動作に干渉しない位
置に配置されている。その場合、ローダ−ｎ、アンロー
ダ−２４の移動する時間か、プリント基板１９の搬入・
搬出作業のタイムロスにはならない。それはローダーお
およびアンローダ−２４が基板位置決め装置１ｉ２１と
同時に移動されるからである。Figure 5 (A) shows that the printed circuit board 1 is
9 shows a state in which the electronic component 5 is being mounted on the electronic component 9. At this time, the next printed circuit board 19 is waiting in the loader field. FIG. 5(B) shows a state in which the mounting on the printed circuit board 19 has been completed, and the main spindle 3 stops the mounting operation and waits until the next printed circuit board 19 is positioned at a predetermined position. No action is taken. At this time, the board positioning device 21 moves to a predetermined loading/unloading position of the printed circuit board 19 between the loader and the unloader. Here, the substrate positioning device 21
Depending on the stroke length of the substrate positioning device 21 and the size of the substrate positioning device 21, the loader and unloader 24 are arranged in advance at positions where they do not interfere with the stroke operation of the substrate positioning device 21. In that case, depending on the time it takes for loader n and unloader 24 to move,
There will be no time loss during the unloading process. This is because the loader and unloader 24 are moved simultaneously with the substrate positioning device 1i21.
次に、第５図（Ｃ）に示すように、基板搬送装置２５で
ローグー田上および基板位置決め装置ｍ上の各プリント
基板１９の後縁にブラケットｎを押し付けながら、ボー
ルねじ２６の回転駆動により、各プリント基板１９の、
アンローダ冴への搬出、およびローダ−羽より基板位置
決め装置２１への搬入を同時に行う。この動作終了後、
第５図（Ｄ）に示すように、ローダ−おおよびアンロー
ダ−冴か元の位置に戻るとともに基板位置決め装置２１
は、プリント基板１９の実装位置へ移動して、再び実装
状態となる。Next, as shown in FIG. 5(C), while pressing the bracket n against the trailing edge of each printed circuit board 19 on the Rogue Tagami and the board positioning device m using the board transfer device 25, the ball screw 26 is rotated. of each printed circuit board 19,
Unloading to the unloader and loading from the loader vane to the substrate positioning device 21 are performed simultaneously. After this operation is completed,
As shown in FIG. 5(D), as the loader and unloader return to their original positions, the substrate positioning device 21
moves to the mounting position of the printed circuit board 19 and returns to the mounting state.
発明が解決しようとする課題
しかし上記従来構成では現在のプリント基板への実装終
了時点から、次のプリント基板への実装開始までに、
■ 基板位置決め装置２１の実装位置から、プリント基
板１９の搬入・搬出位置までの移動■ プリント基板の
搬入・搬出動作
■ 基板位置決め装置２１の、次の基板の実装位置まで
の移動
の３段階の動作、待ち時間が必要となる。プリント基板
１９への装着点数が少なくなるにつれ、稼動時間内にお
ける基板交換作業時間の占める割合は大きくなり、−点
当たりの装着・挿入タクトか向上しても、基板交換作業
自体が早くならなくては、全体としての生産性は向上し
にくい。Problems to be Solved by the Invention However, in the above-mentioned conventional configuration, from the time when mounting on the current printed circuit board ends to the start of mounting on the next printed circuit board, the following steps are required: Movement to the unloading position■ Loading/unloading of the printed circuit board■ A three-step operation of moving the board positioning device 21 to the mounting position of the next board requires waiting time. As the number of points to be mounted on the printed circuit board 19 decreases, the proportion of the board replacement work time in the operating time increases, and even if the mounting/insertion tact per point improves, the board replacement work itself will not become faster. It is difficult to improve overall productivity.
−例として、基板交換作業時間と一点あたりの実装タク
トとの比か２０対ｌで、プリント基板１９−枚当たり電
子部品５を四点実装する生産形態を考えると、１日のう
ち半日はプリント基板１９の入れ替え作業に費やされる
ことになる。- As an example, if we consider a production system in which 4 electronic components are mounted on 19 printed circuit boards with a ratio of 20 to 1 between board replacement work time and mounting takt per point, half of the day is spent on The time will be spent on replacing the board 19.
本発明は上記問題を解決するもので、プリント基板の入
れ替え作業のための実装を停止しなくてはならない時間
を飛躍的に短縮し、実装などの処理作業全体として生産
性を向上させる基板位置決め装置を提供することを目的
とするものである。The present invention solves the above problems, and is a board positioning device that dramatically shortens the time required to stop mounting for printed circuit board replacement work and improves the overall productivity of processing work such as mounting. The purpose is to provide the following.
課題を解決するための手段
上記問題を解決するために本発明の基板位置決め装置は
、回転可能な支持平面部上に、プリント基板を所定領域
内で移動自在に塔載する可動位置決め部を、少なくとも
３個以上所定絢度毎に設けて、前記支持平面部の回転に
より各可動位置決め部を、プリント基板を可動位置決め
部に搬入する位置と、プリント基板への処理を行う位置
と、プリント基板を可動位置決め部から搬出する位置と
に順次切換配置自在としたものである。Means for Solving the Problems In order to solve the above-mentioned problems, the board positioning device of the present invention includes at least a movable positioning part for mounting a printed circuit board movably within a predetermined area on a rotatable support flat part. Three or more movable positioning parts are provided for each predetermined degree of fineness, and each movable positioning part is moved by rotation of the support flat part to a position where the printed circuit board is carried into the movable positioning part, a position where the printed circuit board is processed, and a position where the printed circuit board is moved. The arrangement can be sequentially switched from the positioning section to the unloading position.
作 用
上記構成により、各位置に対応して搬Ｘ装置、処理装置
および搬出装置を配置することにより、一方の可動位置
決め部において、プリント基板上への電子部品実装など
の処理を行いながら、他方の各可動位置決め部では、次
のプリント基板の搬入やプリント基板の搬出を同時に行
うことかでき、現在のプリント基板への実装終ｒ後直ち
に、支持平面部の回転動作のみで次のプリント基板の処
理作業位置へ移動することが可能となる。したがって、
処理作業停止時間を、支持平面部の回転動作時間のみに
節約できる。Effect With the above configuration, by arranging the carrying device, processing device, and unloading device corresponding to each position, one movable positioning section performs processing such as mounting electronic components on a printed circuit board while the other Each of the movable positioning parts allows the loading and unloading of the next printed circuit board at the same time. Immediately after the mounting on the current printed circuit board is completed, the next printed circuit board can be loaded and unloaded by simply rotating the supporting plane part. It becomes possible to move to the processing work position. therefore,
Processing work stoppage time can be reduced to only the rotational operation time of the support plane.
実施例
以下、本発明の一実施例の基板位置決め装置を電子部品
製着装ｆｌＫ遍用したものについて図面を参照しながら
説明する。Embodiment Hereinafter, a substrate positioning device according to an embodiment of the present invention, which is commonly used for mounting electronic components, will be described with reference to the drawings.
第１図は、本発明の一実施例における電子部品装着装置
に適用した基板位置決め装置を示すものである。なお、
第４図に示す従来例と同じものには同符号を付し、その
説明は省略する。７，８゜９．１０は第１〜第４の可動
位置決め部であり、各可動位置決め部７〜１０は、それ
ぞれボールねじ２２とサーボモーター１５によりボール
ねじ２２に制限されるストローク内で平面上を移動可能
とされている。可動位置決め部７ 、８ 、９ 、１０
は回転自在な平面支持部１１の周縁に固定されている。FIG. 1 shows a board positioning device applied to an electronic component mounting apparatus according to an embodiment of the present invention. In addition,
Components that are the same as those in the conventional example shown in FIG. 4 are given the same reference numerals, and their explanations will be omitted. 7, 8゜9.10 are the first to fourth movable positioning parts, and each movable positioning part 7 to 10 is moved on a plane within the stroke limited by the ball screw 22 by the ball screw 22 and the servo motor 15, respectively. is said to be movable. Movable positioning parts 7, 8, 9, 10
is fixed to the periphery of the rotatable planar support part 11.
第２図は平面支持部１ｆの構造を示す断面図である。平
面支持部１１は、水平面内で回転自在の回転板６に歯車
１６が取付けられているとともにこの歯車１６にはモー
ター１７側の歯車１７ａが噛み合わされ、モーター１７
の回転動作により、回転板６上の第１〜第４町動位置決
め部７ 、８ 、９ 、１０か回転動作可能とされてい
る。また、第１図において、ａは電子部品５か実装され
る実装位置、ｂはプリント基板１９が搬入される搬入位
置、Ｃはプリント基板１９か搬出される搬出位置である
。FIG. 2 is a sectional view showing the structure of the planar support part 1f. In the plane support part 11, a gear 16 is attached to a rotary plate 6 that is rotatable in a horizontal plane, and a gear 17a on the motor 17 side is meshed with this gear 16.
By the rotational movement of the rotary plate 6, the first to fourth movement positioning parts 7, 8, 9, and 10 can be rotated. Further, in FIG. 1, a is a mounting position where the electronic component 5 is mounted, b is a carry-in position where the printed circuit board 19 is carried in, and C is a carry-out position where the printed circuit board 19 is carried out.
次に、第１図、第２図、第３図を用いて本発明における
基板位置決め装置の動作を説明する。Next, the operation of the substrate positioning apparatus according to the present invention will be explained using FIGS. 1, 2, and 3.
第１図では、第４ｃｉＴ動位置決め部１０上のプリント
基板１９への実装動作を示している。第４町動位置決め
部１０はあらかじめ決められた実装順序に従い、部品供
給装置２から順に供給された電子部品５の実装位ｆｌｉ
ａへ位置決め動作を行っている。この動作中に、第３図
（Ａ）に示すように、次の実装基板（プリント基板１９
〕か、搬入位ａｂに配置されている第３町動位置決め部
９上に、電子部品装、Ｉｆ装ｆｌｌの外部から搬入され
て待機されている。プリント基板１９への実装が終ｒす
ると、支持平面部１１は回転動作を行い、第３図（Ｂ）
に示すように、主軸３の下の実装位置ａに第３町動位置
決め部９か位置するように（社）度回転し、実装作業が
開始される。この回転動作の前には、第３可動位置決め
部９において実装点と装着位置とか合致するように予め
位置決めが行われており、プリント基板１９の交換のた
め、実装を停止する時間は、平面支持部１１が匍度回転
するのに要する時間のみであり、１〜２秒で十分可能と
されている。従来までの方法では、その構造を変えぬ限
り、プリント基板１９の入れ替え作業時間は５秒程度か
かり、この時間中は実装は不可能であった。さて、第４
町動位置決め部１０は、平面支持部１１が（社）度回転
された結果、搬出位ｆｔ ｃ Ｋ移動され、第３図（Ｃ
）に示すように、次のプリント基板実装中に、プリント
基板１９の搬出が行われる。これと同時に第２町動位置
決め部８にはさらに次のプリント基板１９が搬入される
。FIG. 1 shows the mounting operation on the printed circuit board 19 on the fourth ciT dynamic positioning section 10. The fourth movement positioning unit 10 performs a mounting position fli of the electronic components 5 sequentially supplied from the component supply device 2 according to a predetermined mounting order.
A positioning operation is being performed to a. During this operation, as shown in FIG. 3(A), the next mounting board (printed board 19
], the electronic component equipment and the If equipment are brought in from outside the electronic component equipment and the If equipment full and are placed on the third movement positioning section 9 placed at the delivery position ab and are on standby. When the mounting on the printed circuit board 19 is completed, the support flat part 11 performs a rotational operation, as shown in FIG. 3(B).
As shown in FIG. 3, the third movement positioning section 9 is rotated once so that it is located at the mounting position a below the main shaft 3, and the mounting work is started. Before this rotation operation, positioning is performed in advance in the third movable positioning section 9 so that the mounting point matches the mounting position, and the time when mounting is stopped for replacing the printed circuit board 19 is limited to the flat support. The only time it takes is for the part 11 to rotate, and it is said that 1 to 2 seconds is sufficient. In the conventional method, unless the structure is changed, it takes about 5 seconds to replace the printed circuit board 19, and mounting is impossible during this time. Now, the fourth
As a result of the rotation of the plane support section 11, the town moving positioning section 10 is moved to the unloading position ft c K, and is moved to the unloading position ft c K as shown in FIG. 3 (C
), the printed circuit board 19 is carried out during the next printed circuit board mounting. At the same time, the next printed circuit board 19 is carried into the second moving positioning section 8.
上述したサイクルで、プリント基板１９への実装作業、
プリント基板１９の搬入・搬出作業を複数の可動位置決
め部７〜１０を用いて同時に行え、実装停止時間を飛躍
的に短縮できる。また、搬入位置Ｃの可動位置決め部上
にプリント基板１９を待機させるため、従来のローダ−
やアンローダ−などは不要となる。In the cycle described above, mounting work on the printed circuit board 19,
Loading and unloading of the printed circuit board 19 can be performed simultaneously using a plurality of movable positioning units 7 to 10, and the mounting downtime can be dramatically shortened. In addition, in order to make the printed circuit board 19 wait on the movable positioning section at the loading position C, the conventional loader
, unloader, etc. are no longer required.
本実施例ではｏＴ＠位置決め部７〜１０を４個設けた構
成としたが、３個の可動位置決め部を支持平面部１１の
中心０から周縁に１２０度毎に配置してもよい。また、
吸着ノズル４の代わりに電子部品５を把持する手段を用
いてもよい。Although this embodiment has a configuration in which four oT@ positioning parts 7 to 10 are provided, three movable positioning parts may be arranged every 120 degrees from the center 0 of the support flat part 11 to the periphery. Also,
Instead of the suction nozzle 4, a means for gripping the electronic component 5 may be used.
以上のように、本実施例によれば、実装停止時間が、そ
の前のプリント基板１９の実装停止時間、つまり次基板
を保持した可動位置決め部か待機場所（すなわち搬入位
置）に位置している時点から、実装点へ移動する時間の
みになる。したかって、従来方式に比べ、プリント基板
１９の搬入・搬出時間によるロスタイム削減に効果があ
り、実装停止時間を削減できる。As described above, according to this embodiment, the mounting stop time is the previous mounting stop time of the printed circuit board 19, that is, the movable positioning part holding the next board is located at the standby place (that is, the loading position). It only takes time to move from the point to the point of implementation. Therefore, compared to the conventional method, it is effective in reducing loss time due to loading and unloading time of the printed circuit board 19, and it is possible to reduce mounting stoppage time.
発明の効果
以上のように本発明によれば、互いに独立駆動可能な少
なくとも３個以上の可動位置決め部を、回転自在の支持
平面部上に設けて、各可動位置決め部を、処理位置と搬
入位置と搬出位置とに順次切換配置自在としたので、一
方の可動位置決め部において実装工程などの処理作業を
行っているときに、他方の可動位置決め部により基板の
搬出・搬入作業を行うことかできて、実装などの処理停
止時間は、可動位置決め部を保持している平面支持部の
回転動作時間のみにしか支配されなくなる。Effects of the Invention As described above, according to the present invention, at least three or more movable positioning parts that can be driven independently from each other are provided on a rotatable support flat part, and each movable positioning part can be set at a processing position and a loading position. Since the position can be switched sequentially between the position and the unloading position, when one movable positioning part is performing processing work such as the mounting process, the other movable positioning part can be used to unload and load the board. The processing stop time for , mounting, etc. is controlled only by the rotation operation time of the planar support section holding the movable positioning section.
従来は、プリント基板の搬入・搬出時間が実装停止時間
に含まれていたが、本発明の基板位置決め装置を採用す
ることにより、電子部品実装装置などの生産性は飛躍的
に向上する。Conventionally, the loading and unloading time of printed circuit boards was included in the mounting stop time, but by employing the board positioning apparatus of the present invention, the productivity of electronic component mounting apparatuses and the like is dramatically improved.
第１図は本発明の一実施例における電子部品装造を示す
断面図、第３図／（Ａ）〜（Ｃ）はそれぞれ同基板位置
決め装置の動作を示す概略平面図、第４図は電子部品装
着装置に適用した従来の基板位置決め装置の斜視図、第
５図（Ａ）〜（Ｄ）はそれぞれ同従来の基板位置決め装
置の基板交換作業を示す概略平面図である。
３・−主軸、４・・・吸着ノズル、５・・・電子部品、
７、８ 、９ 、１０・・・可動位置決め部、１１・・
・支持平面部。
ａ・・・実装（処理）位置、ｂ・・・搬入位置、Ｃ・・
・搬出位置。FIG. 1 is a sectional view showing electronic component mounting in one embodiment of the present invention, FIGS. 3A to 3C are schematic plan views showing the operation of the same board positioning device, and FIG. A perspective view of a conventional board positioning device applied to a component mounting device, and FIGS. 5A to 5D are schematic plan views showing a board replacement operation of the conventional board positioning device, respectively. 3.-Spindle, 4.. Suction nozzle, 5.. Electronic components,
7, 8, 9, 10...movable positioning section, 11...
・Support flat part. a... Mounting (processing) position, b... Loading position, C...
・Export position.
Claims (1)
域内で移動自在に塔載する可動位置決め部を、少なくと
も３個以上所定角度毎に設けて、前記支持平面部の回転
により各可動位置決め部を、プリント基板を可動位置決
め部に搬入する位置と、プリント基板への処理を行う位
置と、プリント基板を可動位置決め部から搬出する位置
とに順次切換えて配置自在とした基板位置決め装置。1. At least three or more movable positioning parts for movably mounting the printed circuit board within a predetermined area are provided on a rotatable support flat part at predetermined angle intervals, and each movable positioning part is moved by rotation of the support flat part. A board positioning device that can be freely placed by sequentially switching between a position for carrying a printed circuit board into a movable positioning section, a position for processing the printed circuit board, and a position for carrying out the printed circuit board from the movable positioning section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2177921A JP2925670B2 (en) | 1990-07-04 | 1990-07-04 | Component mounting device and component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2177921A JP2925670B2 (en) | 1990-07-04 | 1990-07-04 | Component mounting device and component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0464300A true JPH0464300A (en) | 1992-02-28 |
| JP2925670B2 JP2925670B2 (en) | 1999-07-28 |
Family
ID=16039398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2177921A Expired - Fee Related JP2925670B2 (en) | 1990-07-04 | 1990-07-04 | Component mounting device and component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2925670B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004052068A1 (en) * | 2002-11-29 | 2004-06-17 | Matsushita Electric Industrial Co., Ltd. | Board carrier, component mounter, and method for carrying board in component mounting |
| JP2010245479A (en) * | 2009-04-10 | 2010-10-28 | Akim Kk | Semiconductor chip mounting device |
-
1990
- 1990-07-04 JP JP2177921A patent/JP2925670B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004052068A1 (en) * | 2002-11-29 | 2004-06-17 | Matsushita Electric Industrial Co., Ltd. | Board carrier, component mounter, and method for carrying board in component mounting |
| US7266887B2 (en) | 2002-11-29 | 2007-09-11 | Matsushita Electric Industrial Co., Ltd. | Substrate transportation apparatus, component mounting apparatus and substrate transportation method in component mounting operation |
| JP2010245479A (en) * | 2009-04-10 | 2010-10-28 | Akim Kk | Semiconductor chip mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2925670B2 (en) | 1999-07-28 |
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