JPH0463661U - - Google Patents
Info
- Publication number
- JPH0463661U JPH0463661U JP10656090U JP10656090U JPH0463661U JP H0463661 U JPH0463661 U JP H0463661U JP 10656090 U JP10656090 U JP 10656090U JP 10656090 U JP10656090 U JP 10656090U JP H0463661 U JPH0463661 U JP H0463661U
- Authority
- JP
- Japan
- Prior art keywords
- wiring conductor
- light emitting
- emitting element
- wall side
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10656090U JP2508409Y2 (ja) | 1990-10-12 | 1990-10-12 | 発光表示装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10656090U JP2508409Y2 (ja) | 1990-10-12 | 1990-10-12 | 発光表示装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0463661U true JPH0463661U (US06330241-20011211-M00004.png) | 1992-05-29 |
| JP2508409Y2 JP2508409Y2 (ja) | 1996-08-21 |
Family
ID=31852700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10656090U Expired - Lifetime JP2508409Y2 (ja) | 1990-10-12 | 1990-10-12 | 発光表示装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508409Y2 (US06330241-20011211-M00004.png) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024238A (ja) * | 1999-07-07 | 2001-01-26 | Citizen Electronics Co Ltd | 多色発光ダイオード |
| WO2001013437A1 (fr) * | 1999-08-12 | 2001-02-22 | Rohm Co., Ltd. | Dispositif electroluminescent a semi-conducteur a puce |
| JP2002111065A (ja) * | 2000-09-26 | 2002-04-12 | Rohm Co Ltd | 半導体発光装置 |
| JP2005277380A (ja) * | 2004-02-23 | 2005-10-06 | Stanley Electric Co Ltd | Ｌｅｄ及びその製造方法 |
| JP2009135484A (ja) * | 2007-11-09 | 2009-06-18 | Hitachi Chem Co Ltd | 光半導体装置 |
| JP2011155311A (ja) * | 2011-05-16 | 2011-08-11 | Citizen Electronics Co Ltd | チップ型発光ダイオード |
-
1990
- 1990-10-12 JP JP10656090U patent/JP2508409Y2/ja not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024238A (ja) * | 1999-07-07 | 2001-01-26 | Citizen Electronics Co Ltd | 多色発光ダイオード |
| WO2001013437A1 (fr) * | 1999-08-12 | 2001-02-22 | Rohm Co., Ltd. | Dispositif electroluminescent a semi-conducteur a puce |
| JP2002111065A (ja) * | 2000-09-26 | 2002-04-12 | Rohm Co Ltd | 半導体発光装置 |
| JP4565723B2 (ja) * | 2000-09-26 | 2010-10-20 | ローム株式会社 | 半導体発光装置 |
| JP2005277380A (ja) * | 2004-02-23 | 2005-10-06 | Stanley Electric Co Ltd | Ｌｅｄ及びその製造方法 |
| JP4572312B2 (ja) * | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | Ｌｅｄ及びその製造方法 |
| JP2009135484A (ja) * | 2007-11-09 | 2009-06-18 | Hitachi Chem Co Ltd | 光半導体装置 |
| JP2011155311A (ja) * | 2011-05-16 | 2011-08-11 | Citizen Electronics Co Ltd | チップ型発光ダイオード |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2508409Y2 (ja) | 1996-08-21 |
