JPH0463660U - - Google Patents
Info
- Publication number
- JPH0463660U JPH0463660U JP10655990U JP10655990U JPH0463660U JP H0463660 U JPH0463660 U JP H0463660U JP 10655990 U JP10655990 U JP 10655990U JP 10655990 U JP10655990 U JP 10655990U JP H0463660 U JPH0463660 U JP H0463660U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- inclined surface
- inclination angle
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
- 230000003287 optical effect Effects 0.000 claims 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10655990U JPH0463660U (US20030204162A1-20031030-M00001.png) | 1990-10-12 | 1990-10-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10655990U JPH0463660U (US20030204162A1-20031030-M00001.png) | 1990-10-12 | 1990-10-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0463660U true JPH0463660U (US20030204162A1-20031030-M00001.png) | 1992-05-29 |
Family
ID=31852697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10655990U Pending JPH0463660U (US20030204162A1-20031030-M00001.png) | 1990-10-12 | 1990-10-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0463660U (US20030204162A1-20031030-M00001.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4910157B1 (ja) * | 2010-12-20 | 2012-04-04 | 国立大学法人九州工業大学 | Ledパッケージの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4944168B1 (US20030204162A1-20031030-M00001.png) * | 1969-11-04 | 1974-11-27 | ||
JPH02201396A (ja) * | 1988-11-29 | 1990-08-09 | Valeo Vision | 発光ストリップ |
-
1990
- 1990-10-12 JP JP10655990U patent/JPH0463660U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4944168B1 (US20030204162A1-20031030-M00001.png) * | 1969-11-04 | 1974-11-27 | ||
JPH02201396A (ja) * | 1988-11-29 | 1990-08-09 | Valeo Vision | 発光ストリップ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4910157B1 (ja) * | 2010-12-20 | 2012-04-04 | 国立大学法人九州工業大学 | Ledパッケージの製造方法 |