JPH0463238A - High ductility ti-al intermetallic compound - Google Patents
High ductility ti-al intermetallic compoundInfo
- Publication number
- JPH0463238A JPH0463238A JP17504190A JP17504190A JPH0463238A JP H0463238 A JPH0463238 A JP H0463238A JP 17504190 A JP17504190 A JP 17504190A JP 17504190 A JP17504190 A JP 17504190A JP H0463238 A JPH0463238 A JP H0463238A
- Authority
- JP
- Japan
- Prior art keywords
- atomic
- intermetallic compound
- tial
- less
- based intermetallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910021362 Ti-Al intermetallic compound Inorganic materials 0.000 title abstract 5
- 229910052718 tin Inorganic materials 0.000 claims abstract description 24
- 229910052745 lead Inorganic materials 0.000 claims abstract description 17
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 16
- 229910000765 intermetallic Inorganic materials 0.000 claims description 37
- 229910010038 TiAl Inorganic materials 0.000 claims description 26
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
Abstract
Description
【発明の詳細な説明】 Ａｌ発明の目的 （１）産業上の利用分野 本発明は高延性ＴｉＡ／！系金属間他金属間化合物。[Detailed description of the invention] Purpose of Al invention (1) Industrial application fields The present invention provides high ductility TiA/! Intermetallic and other intermetallic compounds.
（２）従来の技術
ＴｉＡｌ！系金属間他金属間化合物、且つ優れた耐熱性
を有するためエンジン部品等の構造材料として着目され
ている。(2) Conventional technology TiAl! Because it is an intermetallic compound and has excellent heat resistance, it is attracting attention as a structural material for engine parts.
（３）発明が解決しようとする課題
しかしながらＴｉＡ／！系金属間他金属間化合物°Ｃ程
度に延性−脆性遷移温度を有するため常温延性が極めて
低い、といった問題がある。(3) Problems to be solved by the invention However, TiA/! Since the intermetallic compound has a ductile-brittle transition temperature of about °C, there is a problem that the room temperature ductility is extremely low.
そこで、第３元素を添加することによってＴｉＡｌ系金
属間化合物の常温延性の向上を図ることが試みられてい
る（例えば、特公昭６２−２１５号公報参照）。Therefore, attempts have been made to improve the room temperature ductility of TiAl-based intermetallic compounds by adding a third element (see, for example, Japanese Patent Publication No. 62-215).
本発明は前記従来のものとは異なった見地、即ち金属組
織および第３元素添加の観点より開発されたものであっ
て、その金属組織を改善すると共に第３元素の添加を行
うことによって常温延性を向上させたＴｉＡ／！系金属
間他金属間化合物ることを目的とする。The present invention was developed from a different perspective from the conventional ones, namely from the viewpoint of the metal structure and the addition of a third element. TiA/! The aim is to intermetallic and other intermetallic compounds.
Ｂ１発明の構成
（１）課題を解決するための手段
本発明に係る高延性ＴｉＡｊｌ！系金属間化合金属間化
合物子％以上、６０原子％以下のＡｌを含有し、残部が
ＴｉであるＴｉＡｊ２系金属化合金属化合物組成分０５
原子％以上、１．５原子％以下のＰｂを添加したことを
特徴とする。B1 Structure of the invention (1) Means for solving the problem Highly ductile TiAjl according to the present invention! TiAj2-based metal compound containing Al in an amount of % to 60 atomic %, with the remainder being Ti.Composition 05
It is characterized by adding Pb in an amount of at least 1.5 at %.
この場合、第３元素であるＰｂは、０．０５原子％以上
、３原子％以下のＳｎおよびＧｅの一方、合計量で３．
５原子％以下のＰｂおよびＳｎ、または合計量で３．５
原子％以下のＰｂ、ＧｅおよびＳｎによって代替される
。In this case, the third element Pb is one of Sn and Ge in an amount of 0.05 atomic % or more and 3 atomic % or less, and the total amount is 3.
Pb and Sn up to 5 atomic % or 3.5 in total amount
Substituted by atomic percent or less of Pb, Ge, and Sn.
（２）作 用
前記のようにＡｌ量を特定されたＴｉＡ／！系金属間他
金属間化合物金属組織は、Ｔ ｉ Ａ γ相およびＴｉ
ｘＡｌ相を交互に析出させた層状組織、またはＴｉＡｌ
ｆｉ相のみからなる単相部と、ＴｉＡｌ相およびＴｉ、
Ａｆｆｉ相を交互に析出させた層状組織部とより構成さ
れる。(2) Effect TiA/! with the Al amount specified as described above! The metal structure of other intermetallic compounds is T i A γ phase and Ti
Layered structure in which xAl phases are alternately precipitated, or TiAl
A single phase part consisting only of fi phase, TiAl phase and Ti,
It is composed of a layered structure in which Affi phases are alternately precipitated.
前者の金属組織において、ＴｉＡ／！相はγ相であって
常温延性が低いが、第２相であるＴｉ５Ａ！相（α２相
）をＴｉＡｌ相と交互に層状に析出させると、Ｔ ｉ
Ａ １２系金属間化合物の常温延性が向上する。In the former metal structure, TiA/! The phase is γ phase and has low room temperature ductility, but the second phase is Ti5A! When the phase (α2 phase) is precipitated in layers alternately with the TiAl phase, Ti
A: The room temperature ductility of the 12-based intermetallic compound is improved.
また後者の金属組織において、常温延性の低いＴｉＡｌ
相よりなる単相部に第２相である層状組織部を混在させ
ると、その層状組織部の存在に起因してＴ ｉ Ａ ｊ
２２系金属化合物の常温延性が向上する。In addition, in the latter metal structure, TiAl, which has low room temperature ductility,
When a layered structure part which is a second phase is mixed with a single phase part made up of phases, T i A j due to the presence of the layered structure part
Room-temperature ductility of the 22-series metal compound is improved.
このような金属組織に、前記のような第３元素を特定量
添加すると、ＴｉＡｌｆｉ系金属間化合物の常温延性が
さらに向上する。この種手段を採用してもＴｉＡｊ２系
金属間他金属間化合物性を損うことはない。When a specific amount of the third element described above is added to such a metal structure, the room temperature ductility of the TiAlfi-based intermetallic compound is further improved. Even if this kind of means is employed, the properties of the TiAj2-based intermetallic and other intermetallic compounds will not be impaired.
た！し、Ｐｂの含有量、ＳｎおよびＧｅの一方の含有量
、ＰｂおよびＳｎの合計含有量、ならびにＰｂ、Ｇｅお
よびＳｎの合計含有量が前記規定量を逸脱すると、Ｔｉ
Ａｌ系金属間化合物の常温延性が低下する。Ta! However, if the content of Pb, the content of one of Sn and Ge, the total content of Pb and Sn, and the total content of Pb, Ge, and Sn deviate from the specified amounts, Ti
Room temperature ductility of the Al-based intermetallic compound decreases.
（３）実施例
第１図は、Ｔ ｉ Ａ ｌ系金属間化合物の金属組織の
一例を模型的に示したもので、この金属組織は、ＴｉＡ
ｌ相ＴおよびＴｌ ｓ Ａ γ相α２を交互に析出させ
た層状組織（ラメラ−組織）、図示例では層状組織部り
の集合体よりなる。このような金属組織を得るためには
、組成上、Ａｆｆｉ含有量を３５原子％≦Ａｊ２≦５２
原子％に設定することが必要である。(3) Example Figure 1 schematically shows an example of the metal structure of a TiAl-based intermetallic compound.
A layered structure (lamellar structure) in which l-phase T and Tl s A γ-phase α2 are alternately precipitated, and in the illustrated example, it consists of an aggregate of layered structure parts. In order to obtain such a metal structure, the Affi content must be adjusted to 35 atomic %≦Aj2≦52 in terms of composition.
It is necessary to set it to atomic%.
この場合、Ｔｉ、Ａｊ！相α２の体積分率α２（Ｖｆ）
を０．０５％以上、８０％以下、好ましくは５％以上、
６０％以下に設定することにより、ＴｉＡｌ系金属間化
合物の常温延性を向上させることができる。また常温延
性向上の観点より層状組織部りの平均粒径は、１μｍ以
上、１０００μｍ以下であることが望ましい。In this case, Ti, Aj! Volume fraction α2 (Vf) of phase α2
0.05% or more and 80% or less, preferably 5% or more,
By setting it to 60% or less, the room temperature ductility of the TiAl-based intermetallic compound can be improved. Further, from the viewpoint of improving cold ductility, the average grain size of the layered structure portion is preferably 1 μm or more and 1000 μm or less.
第２図は、ＴｉＡｌ系金属間化合物。（３）織の他例を
模型的に示したもので、この金属組織は、ＴｉＡｊ！相
のみからなる単相部Ｓｒと、Ｔ ｉ Ａ １相Ｔおよび
Ｔｉ、Ａｆｆｉ相α２相変２に析出させた層状組織部り
とより構成される。このような金属組織を得るためには
、組成上、Ａ！含有量を、４５原子％＜、１２≦６０原
子％に設定することが必要である。Figure 2 shows a TiAl-based intermetallic compound. (3) This is a model showing another example of weaving, and this metal structure is TiAj! It is composed of a single phase part Sr consisting only of phases, and a layered structure part precipitated into a Ti, Affi phase α2 phase T and Ti, and an Affi phase α2 phase change 2. In order to obtain such a metal structure, A! It is necessary to set the content to 45 atomic %<, 12≦60 atomic %.
この場合、層状組織部りの体積分率Ｌ（Ｖｆ）を１５％
以上、好ましくは３５％以上に設定することによりＴｉ
Ａ／！系金属間他金属間化合物性を向上させることがで
きる。また常温延性向上の観点より層状組織部りの平均
粒径は、１μｍ以上、１０００μｍ以下であることが望
ましい。In this case, the volume fraction L (Vf) of the layered structure is 15%.
By setting the above, preferably 35% or more, Ti
A/! The properties of intermetallic and other intermetallic compounds can be improved. Further, from the viewpoint of improving cold ductility, the average grain size of the layered structure portion is preferably 1 μm or more and 1000 μm or less.
本発明においては、前記のような金属Ｍｉ織を現出する
３５原子％以上、６０原子％以下のＡ２を含有するＴｉ
Ａｊ！ｉＡｊ！化合物組成分に、０．０５原子％以上、
１．５原子％以下のＰｂ、０．０５原子％以上、３原子
％以下のＳｎおよびＧｅの一方、合計量で３．５原子％
以下のＰｂおよびＳｎ、または合計量で３．５原子％以
下のＰｂ、ＧｅおよびＳｎを添加するものである。In the present invention, Ti containing A2 of 35 atomic % or more and 60 atomic % or less is used to produce the metallic Mi weave as described above.
Aj! iAj! In the compound composition, 0.05 atom% or more,
1.5 at% or less of Pb, 0.05 at% or more and 3 at% or less of Sn and Ge, the total amount of which is 3.5 at%
The following Pb and Sn are added, or the total amount of Pb, Ge and Sn is 3.5 atomic % or less.
ＴｉＡｌ系金属間化合物の製造に当っては、原材料をア
ルゴンガス雰囲気下にてボタンアーク溶解を行うことに
よりインゴットを溶製し、次いでそのインゴットに、ア
ルゴンガス雰囲気下にて１０００°Ｃ程度で所定時間の
加熱、それに次ぐ炉冷、または空冷よりなる熱処理を施
す、といった方法が採用される。この場合、金属組織を
第１図のものにするか、または第２図のものにするかに
よって、熱処理条件が異なる。In producing TiAl-based intermetallic compounds, raw materials are melted into an ingot by button arc melting in an argon gas atmosphere, and then the ingot is melted at a predetermined temperature of about 1000°C in an argon gas atmosphere. A heat treatment method consisting of heating for a period of time followed by furnace cooling or air cooling is employed. In this case, the heat treatment conditions differ depending on whether the metal structure is the one shown in FIG. 1 or the one shown in FIG. 2.
第３図は４７原子％Ａ！のＴｉＡｌ！、系金属間化合物
におけるＰｂ添加量と常温伸びの関係を示す。Figure 3 shows 47 atomic%A! TiAl! , which shows the relationship between the amount of Pb added and elongation at room temperature in intermetallic compounds.
このＴｉＡｌｆｉ系金属間化合物は第１図の金属組織を
有する。引張り伸び試験片の平行部の寸法は縦２閣、横
３■、長さ１５■であり、歪速度は０．０５■ｉｎ−’
に設定された。この試験条件は以下に述べる他例におい
ても同じである。This TiAlfi-based intermetallic compound has the metal structure shown in FIG. The dimensions of the parallel part of the tensile elongation test piece were 2 cm vertically, 3 cm horizontally, and 15 cm long, and the strain rate was 0.05 cm in-'
was set to . These test conditions are the same in other examples described below.
第３図から明らかなように、前記金属組織を有し、また
Ｐｂ添加量を０．０５原子％以上、１．５原子％以下に
設定することによって、ＴｉＡｌ系金属間化合物。（３
）１．２％以上の常温伸びを確保することができる。As is clear from FIG. 3, the TiAl-based intermetallic compound has the above-mentioned metal structure and the amount of Pb added is set to 0.05 atomic % or more and 1.5 atomic % or less. (3
) A room temperature elongation of 1.2% or more can be secured.
第４図は４７原子％ＡｌのＴｉＡｌ系金属間化合物にお
けるＳｎ添加量と常温伸びの関係を、また第５図は同化
合物におけるＧｅ添加量と常温伸びの関係を示す。これ
らＴｉＡ／！系金属間他金属間化合物の金属組織を有す
る。FIG. 4 shows the relationship between the amount of Sn added and the elongation at room temperature in a TiAl-based intermetallic compound containing 47 atom % Al, and FIG. 5 shows the relationship between the amount of Ge added and the elongation at room temperature in the same compound. These TiA/! It has a metal structure of intermetallic and other intermetallic compounds.
第４．第５図から明らかなように、前記金属組織を有し
、またＳｎまたはＧｅ添加量を０．０５原子％以上、３
原子％以下に設定することによって、ＴｉＡｊ２系金属
間化合物において１．２％以上の常温伸びを確保するこ
とができる。4th. As is clear from FIG.
By setting the content to atomic % or less, room temperature elongation of 1.2% or more can be ensured in the TiAj2-based intermetallic compound.
第６回は４７原子％ＡｆのＴｉＡ／！系金属間他金属間
化合物、Ｓｎ添加量をそれぞれ１，２．３原子％に設定
し、これにＰｂを添加した場合のＰｂ添加量と常温伸び
の関係を示す。これらＴｉＡｌ系金属間化合物は第１図
の金属組織を有する。The 6th episode is TiA/! with 47 atomic% Af! The relationship between the amount of Pb added and elongation at room temperature when Pb is added to the system intermetallic compound and Sn added is set to 1 and 2.3 atomic %, respectively. These TiAl-based intermetallic compounds have the metal structure shown in FIG.
図中、線Ｘ、が１原子％Ｓｎに、線ｘｔが２原子％Ｓｎ
に、線Ｘ、が３原子％Ｓｎにそれぞれ該当する。In the figure, line X represents 1 atomic% Sn, and line xt represents 2 atomic% Sn.
, the line X corresponds to 3 atomic % Sn.
第６図線Ｘ１〜Ｘ３から明らかなように、前記金属組織
を有し、またＰｂおよびＳｎを、それらの合計量で３．
５原子％以下添加することによってＴｉＡｌ２系金属間
化合物において、１．２％以上の常温伸びを確保するこ
とができる。この場合、ＰｂおよびＳｎの合計添加量の
下限値は、ＰｂおよびＳｎを単独で用いたときの下限値
の和、即ち、０．１原子％である。As is clear from the lines X1 to X3 in FIG. 6, it has the above-mentioned metal structure and also contains Pb and Sn in a total amount of 3.
By adding 5 atomic % or less, room temperature elongation of 1.2% or more can be ensured in the TiAl2 intermetallic compound. In this case, the lower limit of the total addition amount of Pb and Sn is the sum of the lower limits when Pb and Sn are used alone, that is, 0.1 atomic %.
第７図は４７原子％ＡｆｆのＴｉＡｌ！系金属間他金属
間化合物、ＳｎおよびＧｅの合計添加量を一定にし、こ
れにＰｂを添加した場合のＰｂ添加量と常温伸びの関係
を示す。これらＴｉＡｌ系金属間化合物は第１図の金属
組織を有する。図中、線ｙ１が１原子％Ｓｎおよび１原
子％Ｇｅ併用の場合に、線ｙ２が１原子％Ｓｎおよび２
原子％Ｇｅ併用の場合に、線ｙ、が２原子％Ｓｎおよび
１原子％Ｇｅ併用の場合に、線ｙ３が２原子％Ｓｎおよ
び２原子％Ｇｅ併用の場合にそれぞれ該当する。Figure 7 shows TiAl with 47 atomic% Aff! The relationship between the amount of Pb added and elongation at room temperature is shown when the total amount of other intermetallic compounds, Sn, and Ge is kept constant and Pb is added thereto. These TiAl-based intermetallic compounds have the metal structure shown in FIG. In the figure, when line y1 is a combination of 1 atom% Sn and 1 atom% Ge, line y2 is a combination of 1 atom% Sn and 2 atom%
In the case of a combination of atomic % Ge, line y corresponds to the case of a combination of 2 atomic % Sn and 1 atomic % Ge, and line y3 corresponds to the case of a combination of 2 atomic % Sn and 2 atomic % Ge.
第７図から明らかなように、前記金属組織を有し、また
Ｐｂ、Ｃ；ｅおよびＳｎを、それらの合計量で３．５原
子％以下添加することによって、ＴｉＡｌ系金属間化合
物において１．２％以上の常温伸びを確保することがで
きる。この場合、Ｐｂ、ｓｎおよびＧｅの合計添加量の
下限値は、Ｐｂ、ｓｎおよびＧｅを単独で用いたときの
下限値の和、即ち、０．１５原子％である。As is clear from FIG. 7, by having the above-mentioned metal structure and adding Pb, C; e, and Sn in a total amount of 3.5 atomic % or less, a TiAl-based intermetallic compound with 1. Room temperature elongation of 2% or more can be secured. In this case, the lower limit of the total addition amount of Pb, sn, and Ge is the sum of the lower limits when Pb, sn, and Ge are used alone, that is, 0.15 atomic %.
Ｃ０発明の効果
本発明によれば、Ａｆ量および第３元素量を前記のよう
に特定することによって、高温特性を損うことなく、優
れた常温延性を有するＴｉＡｊ２系金属間化合物を提供
することができる。Effects of the C0 Invention According to the present invention, by specifying the amount of Af and the amount of the third element as described above, it is possible to provide a TiAj two-based intermetallic compound that has excellent room temperature ductility without impairing high temperature properties. I can do it.
第１図は金属組織の一例の説明図、第２図は金属組織の
他側の説明図、第３〜第７図はＴｉＡｌ系金属間化合物
の引張伸び試験結果を示すグラフである。
α２・・・Ｔｊ３Ａｊ２相、Ｔ・・・ＴｉＡｊ２相、Ｌ
・・・層状組織部、ｓｒ・・・単相部
第１ 図FIG. 1 is an explanatory diagram of an example of a metal structure, FIG. 2 is an explanatory diagram of the other side of the metal structure, and FIGS. 3 to 7 are graphs showing the results of a tensile elongation test of a TiAl-based intermetallic compound. α2...Tj3Aj 2-phase, T...TiAj 2-phase, L
...Layered structure part, sr...Single phase part Fig. 1
Claims (4)
、残部がＴｉであるＴｉＡｌ系金属間化合物組成分に、
０．０５原子％以上、１．５原子％以下のＰｂを添加し
たことを特徴とする高延性ＴｉＡｌ系金属間化合物。(1) A TiAl-based intermetallic compound composition containing 35 atomic % or more and 60 atomic % or less Al, with the remainder being Ti,
A highly ductile TiAl-based intermetallic compound characterized in that Pb is added in an amount of 0.05 atomic % or more and 1.5 atomic % or less.
、残部がＴｉであるＴｉＡｌ系金属間化合物組成分に、
ＳｎおよびＧｅの一方を０．０５原子％以上、３原子％
以下添加したことを特徴とする高延性ＴｉＡｌ系金属間
化合物。(2) A TiAl-based intermetallic compound composition containing 35 atomic % or more and 60 atomic % or less Al, with the remainder being Ti,
One of Sn and Ge is 0.05 atomic % or more, 3 atomic %
A highly ductile TiAl-based intermetallic compound characterized by the addition of the following:
、残部がＴｉであるＴｉＡｌ系金属間化合物組成分に、
ＰｂおよびＳｎを、それらの合計量で３．５原子％以下
添加したことを特徴とする高延性ＴｉＡｌ系金属間化合
物。(3) A TiAl-based intermetallic compound composition containing 35 atomic % or more and 60 atomic % or less Al, with the remainder being Ti,
A highly ductile TiAl-based intermetallic compound, characterized in that Pb and Sn are added in a total amount of 3.5 at % or less.
、残部がＴｉであるＴｉＡｌ系金属間化合物組成分に、
Ｐｂ、ＧｅおよびＳｎを、それらの合計量で３．５原子
％以下添加したことを特徴とする高延性ＴｉＡｌ系金属
間化合物。(4) A TiAl-based intermetallic compound composition containing 35 atomic % or more and 60 atomic % or less Al, with the remainder being Ti,
A highly ductile TiAl-based intermetallic compound characterized by adding Pb, Ge, and Sn in a total amount of 3.5 atomic % or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17504190A JPH0463238A (en) | 1990-07-02 | 1990-07-02 | High ductility ti-al intermetallic compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17504190A JPH0463238A (en) | 1990-07-02 | 1990-07-02 | High ductility ti-al intermetallic compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463238A true JPH0463238A (en) | 1992-02-28 |
Family
ID=15989185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17504190A Pending JPH0463238A (en) | 1990-07-02 | 1990-07-02 | High ductility ti-al intermetallic compound |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463238A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107130139A (en) * | 2017-06-15 | 2017-09-05 | 北京科技大学 | A kind of method of the intensified-sintered Powder Metallurgy TiAl based Alloys of addition Sn |
-
1990
- 1990-07-02 JP JP17504190A patent/JPH0463238A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107130139A (en) * | 2017-06-15 | 2017-09-05 | 北京科技大学 | A kind of method of the intensified-sintered Powder Metallurgy TiAl based Alloys of addition Sn |
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