JPH0459777B2 - - Google Patents
Info
- Publication number
- JPH0459777B2 JPH0459777B2 JP1314329A JP31432989A JPH0459777B2 JP H0459777 B2 JPH0459777 B2 JP H0459777B2 JP 1314329 A JP1314329 A JP 1314329A JP 31432989 A JP31432989 A JP 31432989A JP H0459777 B2 JPH0459777 B2 JP H0459777B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- space
- lead
- package case
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 28
- 238000000465 moulding Methods 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000006060 molten glass Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000428 dust Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31432989A JPH03177054A (ja) | 1989-12-05 | 1989-12-05 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31432989A JPH03177054A (ja) | 1989-12-05 | 1989-12-05 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03177054A JPH03177054A (ja) | 1991-08-01 |
JPH0459777B2 true JPH0459777B2 (xx) | 1992-09-24 |
Family
ID=18052022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31432989A Granted JPH03177054A (ja) | 1989-12-05 | 1989-12-05 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03177054A (xx) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4828830A (xx) * | 1971-08-16 | 1973-04-17 |
-
1989
- 1989-12-05 JP JP31432989A patent/JPH03177054A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4828830A (xx) * | 1971-08-16 | 1973-04-17 |
Also Published As
Publication number | Publication date |
---|---|
JPH03177054A (ja) | 1991-08-01 |
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