JPH0459771B2 - - Google Patents

Info

Publication number
JPH0459771B2
JPH0459771B2 JP61182830A JP18283086A JPH0459771B2 JP H0459771 B2 JPH0459771 B2 JP H0459771B2 JP 61182830 A JP61182830 A JP 61182830A JP 18283086 A JP18283086 A JP 18283086A JP H0459771 B2 JPH0459771 B2 JP H0459771B2
Authority
JP
Japan
Prior art keywords
etching
wafer
semiconductor wafer
diameter
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61182830A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6340325A (ja
Inventor
Tadahiro Oomi
Hiroyuki Mishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Priority to JP18283086A priority Critical patent/JPS6340325A/ja
Publication of JPS6340325A publication Critical patent/JPS6340325A/ja
Publication of JPH0459771B2 publication Critical patent/JPH0459771B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
JP18283086A 1986-08-05 1986-08-05 半導体ウエハの切り出し方法 Granted JPS6340325A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18283086A JPS6340325A (ja) 1986-08-05 1986-08-05 半導体ウエハの切り出し方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18283086A JPS6340325A (ja) 1986-08-05 1986-08-05 半導体ウエハの切り出し方法

Publications (2)

Publication Number Publication Date
JPS6340325A JPS6340325A (ja) 1988-02-20
JPH0459771B2 true JPH0459771B2 (enExample) 1992-09-24

Family

ID=16125211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18283086A Granted JPS6340325A (ja) 1986-08-05 1986-08-05 半導体ウエハの切り出し方法

Country Status (1)

Country Link
JP (1) JPS6340325A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2884778B2 (ja) * 1990-12-21 1999-04-19 株式会社デンソー マスキング装置
JP3417008B2 (ja) 1993-11-04 2003-06-16 株式会社デンソー 半導体ウエハのエッチング方法
JP2010034473A (ja) * 2008-07-31 2010-02-12 Sumco Corp Ｓｉｍｏｘ基板の製造方法及び該方法に用いるエッチング装置
JP6441088B2 (ja) * 2015-01-13 2018-12-19 株式会社Sumco シリコンウェーハの製造方法及び半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950180A (ja) * 1982-09-14 1984-03-23 Hitachi Cable Ltd 機械的マスクを用いたエツチング法

Also Published As

Publication number Publication date
JPS6340325A (ja) 1988-02-20

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