JPH0459451U - - Google Patents
Info
- Publication number
- JPH0459451U JPH0459451U JP10303390U JP10303390U JPH0459451U JP H0459451 U JPH0459451 U JP H0459451U JP 10303390 U JP10303390 U JP 10303390U JP 10303390 U JP10303390 U JP 10303390U JP H0459451 U JPH0459451 U JP H0459451U
- Authority
- JP
- Japan
- Prior art keywords
- test liquid
- storage tank
- sample
- liquid storage
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
図面は本考案の実施例を示し、第１図は縦断正
面図、第２図は第１図の−線断面図である。 １……ケーシング、２……試料搬出入室、３…
…試料加熱室、５……試験液貯溜槽、８……試料
かご、９……昇降手段、１０……加熱手段、１３
……接続通路、１４……冷却手段。
面図、第２図は第１図の−線断面図である。 １……ケーシング、２……試料搬出入室、３…
…試料加熱室、５……試験液貯溜槽、８……試料
かご、９……昇降手段、１０……加熱手段、１３
……接続通路、１４……冷却手段。
Claims (1)
- ケーシング１内に試料搬出入室２と試料加熱室
３とを上下に区画して形成し、試料加熱室３にフ
ツ素系不活性液からなる試験液を貯溜する試験液
貯溜槽５を配置するとともに、この試験液貯溜槽
５に加熱手段１０を配置して貯溜槽５内の試験液
を加熱可能に構成し、試料搬出入室２内における
試験液貯溜槽５の上側に対応する個所に試料かご
８の昇降手段９を配置し、試料搬出入室２と試験
液貯溜槽５との接続通路１３部分に冷却手段１４
を配置した半導体耐久試験用液槽式前処理装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990103033U JPH0714864Y2 (ja) | 1990-09-27 | 1990-09-27 | 半導体耐久試験用の液槽式前処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990103033U JPH0714864Y2 (ja) | 1990-09-27 | 1990-09-27 | 半導体耐久試験用の液槽式前処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459451U true JPH0459451U (ja) | 1992-05-21 |
| JPH0714864Y2 JPH0714864Y2 (ja) | 1995-04-10 |
Family
ID=31847759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990103033U Expired - Lifetime JPH0714864Y2 (ja) | 1990-09-27 | 1990-09-27 | 半導体耐久試験用の液槽式前処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0714864Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013190112A (ja) * | 2012-03-12 | 2013-09-26 | Mitsubishi Electric Corp | 熱処理装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60263836A (ja) * | 1984-06-12 | 1985-12-27 | Nippon Saamic:Kk | 液槽式熱衝撃試験装置 |
| JPH0296634A (ja) * | 1988-10-03 | 1990-04-09 | Tabai Espec Corp | 液槽式環境試験装置 |
-
1990
- 1990-09-27 JP JP1990103033U patent/JPH0714864Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60263836A (ja) * | 1984-06-12 | 1985-12-27 | Nippon Saamic:Kk | 液槽式熱衝撃試験装置 |
| JPH0296634A (ja) * | 1988-10-03 | 1990-04-09 | Tabai Espec Corp | 液槽式環境試験装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013190112A (ja) * | 2012-03-12 | 2013-09-26 | Mitsubishi Electric Corp | 熱処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0714864Y2 (ja) | 1995-04-10 |