JPH0459167U - - Google Patents
Info
- Publication number
- JPH0459167U JPH0459167U JP1990100245U JP10024590U JPH0459167U JP H0459167 U JPH0459167 U JP H0459167U JP 1990100245 U JP1990100245 U JP 1990100245U JP 10024590 U JP10024590 U JP 10024590U JP H0459167 U JPH0459167 U JP H0459167U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- type light
- emitting diodes
- step surface
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
- H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
- H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990100245U JPH0810211Y2 (ja) | 1990-09-27 | 1990-09-27 | チツプ型発光ダイオードの取付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990100245U JPH0810211Y2 (ja) | 1990-09-27 | 1990-09-27 | チツプ型発光ダイオードの取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459167U true JPH0459167U (US06589383-20030708-C00041.png) | 1992-05-21 |
| JPH0810211Y2 JPH0810211Y2 (ja) | 1996-03-27 |
Family
ID=31842749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990100245U Expired - Lifetime JPH0810211Y2 (ja) | 1990-09-27 | 1990-09-27 | チツプ型発光ダイオードの取付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810211Y2 (US06589383-20030708-C00041.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003534628A (ja) * | 2000-05-02 | 2003-11-18 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 照明装置 |
| JP2005159276A (ja) * | 2003-10-28 | 2005-06-16 | Matsushita Electric Works Ltd | 半導体発光装置及びその製造方法 |
| WO2008038708A1 (fr) * | 2006-09-29 | 2008-04-03 | Rohm Co., Ltd. | Dispositif d'émission de lumière à semiconducteur |
| JP2021192422A (ja) * | 2020-04-02 | 2021-12-16 | 日亜化学工業株式会社 | 面状光源及びその製造方法 |
| US12027501B2 (en) | 2020-04-02 | 2024-07-02 | Nichia Corporation | Surface light source and method of manufacturing surface light source |
-
1990
- 1990-09-27 JP JP1990100245U patent/JPH0810211Y2/ja not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003534628A (ja) * | 2000-05-02 | 2003-11-18 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 照明装置 |
| JP2005159276A (ja) * | 2003-10-28 | 2005-06-16 | Matsushita Electric Works Ltd | 半導体発光装置及びその製造方法 |
| WO2008038708A1 (fr) * | 2006-09-29 | 2008-04-03 | Rohm Co., Ltd. | Dispositif d'émission de lumière à semiconducteur |
| JPWO2008038708A1 (ja) * | 2006-09-29 | 2010-01-28 | ローム株式会社 | 半導体発光装置 |
| JP2021192422A (ja) * | 2020-04-02 | 2021-12-16 | 日亜化学工業株式会社 | 面状光源及びその製造方法 |
| US12027501B2 (en) | 2020-04-02 | 2024-07-02 | Nichia Corporation | Surface light source and method of manufacturing surface light source |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0810211Y2 (ja) | 1996-03-27 |
