JPH0459140U - - Google Patents

Info

Publication number
JPH0459140U
JPH0459140U JP1990097276U JP9727690U JPH0459140U JP H0459140 U JPH0459140 U JP H0459140U JP 1990097276 U JP1990097276 U JP 1990097276U JP 9727690 U JP9727690 U JP 9727690U JP H0459140 U JPH0459140 U JP H0459140U
Authority
JP
Japan
Prior art keywords
wire
bonding
amount control
control device
detection means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990097276U
Other languages
Japanese (ja)
Other versions
JP2513442Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990097276U priority Critical patent/JP2513442Y2/en
Publication of JPH0459140U publication Critical patent/JPH0459140U/ja
Application granted granted Critical
Publication of JP2513442Y2 publication Critical patent/JP2513442Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図乃至第３図は本考案一実施例を示すもの
で、第１図はワイヤ供給装置の正面図、第２図は
ワイヤ繰出し量制御装置の横断面図であつて第１
図−線による断面図、第３図はワイヤセンサ
およびボンデイング非常停止センサの端面図、第
４図は別の実施例に係るワイヤ供給装置の正面図
、第５図は従来例のワイヤ供給装置の正面図であ
る。 １，３８……ワイヤ繰出し量制御装置、２１，
２２……対向板、３１，３２……貫通孔、４，２
７，４０……ワイヤガイド部材、５，２５，３９
……エア吹出し口、６……ワイヤセンサ、７……
ボンデイング非常停止センサ、６１，７１……発
光軸、６２，７２……受光軸、８……カバー部材
、２１……摩擦装置、２２，２３……円筒体、２
３１……偏心軸、２６……張力付与装置、３１…
…ワイヤスプール、３２……モータ、３３……ボ
ンデイングヘツド、３４……クランプ、３５……
ボンデイングツール、３６……ボンデイングアー
ム、３７……ワイヤガイド、４１……モータ停止
センサ、４２……モータ回転センサ、４３……ハ
ーフクランプ、ａ……エア、ｗ……ワイヤ。 1 to 3 show one embodiment of the present invention, in which FIG. 1 is a front view of a wire feeding device, and FIG.
3 is an end view of a wire sensor and a bonding emergency stop sensor, FIG. 4 is a front view of a wire feeding device according to another embodiment, and FIG. 5 is a front view of a wire feeding device of a conventional example. It is a front view. 1, 38...Wire feeding amount control device, 2 1 ,
2 2 ... Opposing plate, 3 1 , 3 2 ... Through hole, 4, 2
7, 40... Wire guide member, 5, 25, 39
...Air outlet, 6...Wire sensor, 7...
Bonding emergency stop sensor, 6 1 , 7 1 ... Light emitting axis, 6 2 , 7 2 ... Light receiving axis, 8 ... Cover member, 21 ... Friction device, 22, 23 ... Cylindrical body, 2
3 1 ... Eccentric shaft, 26... Tension applying device, 31...
... Wire spool, 32 ... Motor, 33 ... Bonding head, 34 ... Clamp, 35 ...
Bonding tool, 36... Bonding arm, 37... Wire guide, 41... Motor stop sensor, 42... Motor rotation sensor, 43... Half clamp, a... Air, w... Wire.

Claims (1)

【実用新案登録請求の範囲】 (1) ワイヤスプール回転用モータとワイヤ繰出
し量制御装置とを備え、該ワイヤ繰出し量制御装
置がエア吹出し口と、ワイヤガイド部材と、ワイ
ヤ検出手段と、該ワイヤ検出手段により前記モー
タを回転制御する機構とを備えてなるワイヤボン
デイング装置におけるワイヤ供給装置において、
前記ワイヤ繰出し量制御装置がボンデイング非常
停止センサを備えていることを特徴とするワイヤ
ボンデイング装置におけるワイヤ供給装置。 (2) 前記ワイヤ繰出し量制御装置のワイヤガイ
ド部材が２枚の対向板で構成され、ワイヤ検出手
段およびボンデイング非常停止センサが該ガイド
部材の一方側に間隔をおいて配設され、ガイド部
材の他方側には対向して貫通孔が設けられており
、該貫通孔はカバー部材で遮蔽されている請求項
１記載のワイヤ供給装置。 (3) 前記ワイヤ検出手段およびボンデイング非
常停止センサが、中心に発光軸を、その周囲に複
数の受光軸を配設した光センサで構成されている
請求項１または２記載のワイヤ供給装置。 (4) 前記ワイヤ繰出し量制御装置とワイヤボン
デイング装置のボンデイングツールとの間に、ワ
イヤ摩擦装置とエア吹付けによる張力付与装置を
設けた請求項１，２または３記載のワイヤ供給装
置。[Claims for Utility Model Registration] (1) A motor for rotating a wire spool and a wire feed-out amount control device, the wire feed-out amount control device including an air outlet, a wire guide member, a wire detection means, and a wire feed-out amount control device. A wire supply device for a wire bonding apparatus comprising a mechanism for controlling rotation of the motor by a detection means,
A wire feeding device in a wire bonding apparatus, wherein the wire feeding amount control device includes a bonding emergency stop sensor. (2) The wire guide member of the wire feed amount control device is composed of two opposing plates, and a wire detection means and a bonding emergency stop sensor are arranged at a distance on one side of the guide member. 2. The wire feeding device according to claim 1, wherein opposing through holes are provided on the other side, and the through holes are shielded by a cover member. (3) The wire supply device according to claim 1 or 2, wherein the wire detection means and the bonding emergency stop sensor are constituted by an optical sensor having a light emitting axis at the center and a plurality of light receiving axes arranged around the light emitting axis. (4) The wire feeding device according to claim 1, 2 or 3, further comprising a wire friction device and a tension applying device by air blowing provided between the wire feeding amount control device and the bonding tool of the wire bonding device.
JP1990097276U 1990-09-18 1990-09-18 Wire feeder for wire bonding machine Expired - Fee Related JP2513442Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990097276U JP2513442Y2 (en) 1990-09-18 1990-09-18 Wire feeder for wire bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990097276U JP2513442Y2 (en) 1990-09-18 1990-09-18 Wire feeder for wire bonding machine

Publications (2)

Publication Number Publication Date
JPH0459140U true JPH0459140U (en) 1992-05-21
JP2513442Y2 JP2513442Y2 (en) 1996-10-09

Family

ID=31837508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990097276U Expired - Fee Related JP2513442Y2 (en) 1990-09-18 1990-09-18 Wire feeder for wire bonding machine

Country Status (1)

Country Link
JP (1) JP2513442Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262435A (en) * 1984-06-08 1985-12-25 Nec Kyushu Ltd Supplying device of bonding wire in semiconductor fabricating apparatus
JPH02137343A (en) * 1988-11-18 1990-05-25 Matsushita Electric Ind Co Ltd Wire feed apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262435A (en) * 1984-06-08 1985-12-25 Nec Kyushu Ltd Supplying device of bonding wire in semiconductor fabricating apparatus
JPH02137343A (en) * 1988-11-18 1990-05-25 Matsushita Electric Ind Co Ltd Wire feed apparatus

Also Published As

Publication number Publication date
JP2513442Y2 (en) 1996-10-09

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Legal Events

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LAPS Cancellation because of no payment of annual fees