JPH0171444U - - Google Patents

Info

Publication number
JPH0171444U
JPH0171444U JP1987165373U JP16537387U JPH0171444U JP H0171444 U JPH0171444 U JP H0171444U JP 1987165373 U JP1987165373 U JP 1987165373U JP 16537387 U JP16537387 U JP 16537387U JP H0171444 U JPH0171444 U JP H0171444U
Authority
JP
Japan
Prior art keywords
wire
amount control
control device
bonding
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987165373U
Other languages
Japanese (ja)
Other versions
JPH0521879Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987165373U priority Critical patent/JPH0521879Y2/ja
Publication of JPH0171444U publication Critical patent/JPH0171444U/ja
Application granted granted Critical
Publication of JPH0521879Y2 publication Critical patent/JPH0521879Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例の正面図、第２図は従
来例の正面図である。 １……スプール、２……モータ、３……ボンデ
イングヘツド、４……クランプ、５……ボンデイ
ングツール、６……ボンデイングアーム、７……
ガイド、８……繰り出し量制御装置、９……エア
吹き出し口、１０……センサ、１１……センサ、
１２……ハーフクランプ、１３……摩擦装置、１
３Ａ，１３Ｂ……ガイド片、１４……張力付与装
置。 FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2 is a front view of a conventional example. 1... Spool, 2... Motor, 3... Bonding head, 4... Clamp, 5... Bonding tool, 6... Bonding arm, 7...
Guide, 8... Feeding amount control device, 9... Air outlet, 10... Sensor, 11... Sensor,
12...Half clamp, 13...Friction device, 1
3A, 13B... Guide piece, 14... Tension applying device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] エアをワイヤに吹きつけた際の撓み量に応じて
ワイヤの繰り出し量を制御する繰り出し量制御装
置を備えたワイヤボンデイング装置におけるワイ
ヤ供給装置において、前記繰り出し量制御装置と
ボンデイングツールとの間のワイヤにエアを吹き
つけてワイヤに張力を与える張力付与装置を設け
、該張力付与装置と前記繰り出し量制御装置との
間のワイヤに摩擦抵抗を与える摩擦装置を設けた
ことを特徴とするワイヤボンデイング装置におけ
るワイヤ供給装置。 In a wire supply device for a wire bonding apparatus, which is equipped with a payout amount control device that controls the payout amount of the wire according to the amount of deflection when air is blown onto the wire, the wire is connected between the feedout amount control device and the bonding tool. A wire bonding device comprising: a tension applying device that applies tension to the wire by blowing air to the wire; and a friction device that applies frictional resistance to the wire between the tension applying device and the feeding amount control device. wire feeding device.
JP1987165373U 1987-10-30 1987-10-30 Expired - Lifetime JPH0521879Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987165373U JPH0521879Y2 (en) 1987-10-30 1987-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987165373U JPH0521879Y2 (en) 1987-10-30 1987-10-30

Publications (2)

Publication Number Publication Date
JPH0171444U true JPH0171444U (en) 1989-05-12
JPH0521879Y2 JPH0521879Y2 (en) 1993-06-04

Family

ID=31451802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987165373U Expired - Lifetime JPH0521879Y2 (en) 1987-10-30 1987-10-30

Country Status (1)

Country Link
JP (1) JPH0521879Y2 (en)

Also Published As

Publication number Publication date
JPH0521879Y2 (en) 1993-06-04

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