JPH0211334U - - Google Patents

Info

Publication number
JPH0211334U
JPH0211334U JP1988089516U JP8951688U JPH0211334U JP H0211334 U JPH0211334 U JP H0211334U JP 1988089516 U JP1988089516 U JP 1988089516U JP 8951688 U JP8951688 U JP 8951688U JP H0211334 U JPH0211334 U JP H0211334U
Authority
JP
Japan
Prior art keywords
wire
control device
bonding
amount control
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988089516U
Other languages
Japanese (ja)
Other versions
JPH0622986Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988089516U priority Critical patent/JPH0622986Y2/en
Publication of JPH0211334U publication Critical patent/JPH0211334U/ja
Application granted granted Critical
Publication of JPH0622986Y2 publication Critical patent/JPH0622986Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例の側面図、第２図はス
プール付近の正面図、第３図は従来例の側面図で
ある。 １……スプール、２……モータ、３……ボンデ
イングヘツド、４……カツトクランプ、５……ボ
ンデイングツール、６……ボンデイングアーム、
７……ガイド、８……繰り出し量制御装置、９…
…エア吹き出し口、１０……センサ、１１……セ
ンサ、１２……テンシヨンクランプ、１３……摩
擦装置、１３Ａ，１３Ｂ……ガイド片、１４……
張力付与装置、１５……取付台、１６……ガイド
、１６Ａ，１６Ｂ……ローラ、１７……ワイヤガ
イド部、１８……エア吹き出し口。 FIG. 1 is a side view of an embodiment of the present invention, FIG. 2 is a front view of the vicinity of the spool, and FIG. 3 is a side view of a conventional example. 1... Spool, 2... Motor, 3... Bonding head, 4... Cut clamp, 5... Bonding tool, 6... Bonding arm,
7... Guide, 8... Feeding amount control device, 9...
...Air outlet, 10...Sensor, 11...Sensor, 12...Tension clamp, 13...Friction device, 13A, 13B...Guide piece, 14...
Tension applying device, 15...Mounting base, 16...Guide, 16A, 16B...Roller, 17...Wire guide section, 18...Air outlet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] エアをワイヤに吹きつけた際の撓み量に応じて
スプールからのワイヤの繰り出し量を制御する繰
り出し量制御装置を備えたワイヤボンデイング装
置におけるワイヤ供給装置において、前記スプー
ルと繰り出し量制御装置とを静止した取付台に、
また前記繰り出し量制御装置とボンデイングツー
ルとの間のワイヤにエアを吹きつけてワイヤに張
力を与える張力付与装置と該張力付与装置と前記
繰り出し量制御装置との間のワイヤに摩擦抵抗を
与える摩擦装置とを前記ボンデイングツールが設
けられているボンデイングヘツドに、それぞれ設
けたことを特徴とするワイヤボンデイング装置に
おけるワイヤ供給装置。 In a wire supply device for a wire bonding apparatus that is equipped with a payout amount control device that controls the payout amount of the wire from the spool according to the amount of deflection when air is blown onto the wire, the spool and the payout amount control device are kept stationary. On the mounting base,
Also, a tensioning device that applies tension to the wire by blowing air to the wire between the feeding amount control device and the bonding tool, and a friction device that provides frictional resistance to the wire between the tensioning device and the feeding amount controlling device. 1. A wire supply device in a wire bonding apparatus, characterized in that a wire feeding device is provided in each bonding head on which the bonding tool is provided.
JP1988089516U 1988-07-07 1988-07-07 Wire feeder for wire bonding machine Expired - Lifetime JPH0622986Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988089516U JPH0622986Y2 (en) 1988-07-07 1988-07-07 Wire feeder for wire bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988089516U JPH0622986Y2 (en) 1988-07-07 1988-07-07 Wire feeder for wire bonding machine

Publications (2)

Publication Number Publication Date
JPH0211334U true JPH0211334U (en) 1990-01-24
JPH0622986Y2 JPH0622986Y2 (en) 1994-06-15

Family

ID=31314065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988089516U Expired - Lifetime JPH0622986Y2 (en) 1988-07-07 1988-07-07 Wire feeder for wire bonding machine

Country Status (1)

Country Link
JP (1) JPH0622986Y2 (en)

Also Published As

Publication number Publication date
JPH0622986Y2 (en) 1994-06-15

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