JP2694226B2 - Wire feeder for wire bonding equipment - Google Patents
Wire feeder for wire bonding equipmentInfo
- Publication number
- JP2694226B2 JP2694226B2 JP3228546A JP22854691A JP2694226B2 JP 2694226 B2 JP2694226 B2 JP 2694226B2 JP 3228546 A JP3228546 A JP 3228546A JP 22854691 A JP22854691 A JP 22854691A JP 2694226 B2 JP2694226 B2 JP 2694226B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- spool
- cover body
- motor
- friction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置を製造する
ときに用いられるワイヤボンディング装置のワイヤ供給
装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire supply device for a wire bonding device used when manufacturing a semiconductor device.
【０００２】[0002]
【従来の技術】従来のワイヤ供給装置としては、例えば
図５に示すように、ワイヤスプール回転用モータのモー
タ軸に、スプール嵌挿定着部材を固定し、該嵌挿定着部
材の外周にワイヤＷを巻回したワイヤスプール１を着脱
自在に設け、一方、キャピラリ１６、クランプ１４，１
５、ワイヤガイド１３を備えたボンディングヘッド１８
と前記ワイヤスプール１との間に、エア吹き付け装置１
９、ワイヤ摩擦装置２３、エア吹き付け装置１９とモー
タ回転センサ２０、モータ停止センサ２１を備えたワイ
ヤ繰り出し量制御装置２２、ワイヤガイド１２を設けて
いる。なお、図５中１７はボンディングアームである。
そして、ワイヤボンディングに際しては、前記ワイヤス
プール１をスプール嵌挿定着部材に嵌挿定着し、ワイヤ
Ｗの一端をワイヤガイド１２、ワイヤ繰り出し量制御装
置２２、ワイヤ摩擦装置２３、エア吹き付け装置１９、
ワイヤガイド１３、クランプ１４，１５を介してキャピ
ラリ１６に導いていた。そして、ワイヤの繰り出し制御
は、モータ回転センサ２０がワイヤＷを検出したときに
モータをオンとしてワイヤＷを繰り出し、モータ停止セ
ンサ２１がワイヤＷを検出したときにモータをオフとし
てワイヤの繰り出しを停止する制御により行うものであ
り、この際にワイヤＷにはワイヤ摩擦装置２３により所
定の摩擦力が与えられ、エア吹き付け装置１９により所
定のテンションが与えられていた。2. Description of the Related Art As a conventional wire feeder, for example, as shown in FIG. 5, a spool fitting and fixing member is fixed to a motor shaft of a wire spool rotating motor, and a wire W is provided on the outer periphery of the fitting and fixing member. A wire spool 1 wound around is detachably provided, while a capillary 16 and clamps 14, 1 are provided.
5. Bonding head 18 with wire guide 13
And the wire spool 1 between the air blowing device 1
9, a wire friction device 23, an air blowing device 19, a motor rotation sensor 20, a wire feed-out amount control device 22 having a motor stop sensor 21, and a wire guide 12. Reference numeral 17 in FIG. 5 is a bonding arm.
At the time of wire bonding, the wire spool 1 is fitted and fixed on the spool fitting and fixing member, and one end of the wire W is fixed to the wire guide 12, the wire feeding amount control device 22, the wire friction device 23, the air blowing device 19,
It was guided to the capillary 16 via the wire guide 13 and the clamps 14 and 15. In the wire feeding control, when the motor rotation sensor 20 detects the wire W, the motor is turned on to feed the wire W, and when the motor stop sensor 21 detects the wire W, the motor is turned off to stop the wire feeding. In this case, a predetermined frictional force is applied to the wire W by the wire friction device 23, and a predetermined tension is applied to the wire W by the air blowing device 19.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、この従
来のワイヤ供給装置では、ワイヤ摩擦装置２３を、ワイ
ヤスプール回転用モータに着脱自在に設けられたワイヤ
スプール１とボンディングヘッド１８との間に設けてい
るため、ワイヤ供給装置が大型化してしまう問題点があ
った。また、ワイヤがワイヤスプール１とワイヤ摩擦装
置２３の間で切れた場合、ワイヤはワイヤスプール１の
ところでたるんでからみ、その後ワイヤボンディングを
行う場合にはワイヤをワイヤスプール１の外周に再度巻
き直して該スプール１をスプール嵌挿定着部材に定着す
る必要があり、修復作業が面倒であった。本発明はこの
従来の問題点を解消するワイヤボンディング装置のワイ
ヤ供給装置を提供しようとするものである。However, in this conventional wire feeding device, the wire friction device 23 is provided between the wire spool 1 and the bonding head 18 which are detachably provided in the wire spool rotating motor. Therefore, there is a problem that the wire feeding device becomes large. When the wire breaks between the wire spool 1 and the wire friction device 23, the wire is slackened at the wire spool 1 and entangled. When the wire bonding is performed thereafter, the wire is rewound around the outer circumference of the wire spool 1. It was necessary to fix the spool 1 to the spool fitting and fixing member, and the repair work was troublesome. The present invention is intended to provide a wire supply device for a wire bonding device that solves the conventional problems.
【０００４】[0004]
【課題を解決するための手段】本発明は、ワイヤスプー
ル回転用モータに着脱自在に設けられたワイヤスプール
とボンディングヘッドとの間にワイヤ摩擦装置、ワイヤ
繰り出し量制御装置を備えたワイヤボンディング装置に
おいて、前記ワイヤスプールを被蓋するスプール用カバ
ー体を備え、該スプール用カバー体にワイヤ摩擦装置を
設けたことを特徴とするワイヤボンディング装置のワイ
ヤ供給装置である。The present invention relates to a wire bonding apparatus having a wire friction device and a wire feeding amount control device between a wire spool detachably provided on a wire spool rotating motor and a bonding head. A wire supply device for a wire bonding apparatus, comprising a spool cover body for covering the wire spool, and a wire friction device provided on the spool cover body.
【０００５】[0005]
【作用】スプール用カバー体でワイヤスプールを被蓋
し、ワイヤの一端をスプール用カバー体のワイヤ摩擦装
置に挿通してボンディングヘッド側に導く。ワイヤボン
ディングに際して前記ワイヤ摩擦装置によりワイヤに摩
擦力が与えられる。又、ワイヤがスプール用カバー体の
外側で切れたときは、ワイヤ摩擦装置の摩擦力によりワ
イヤのスプール用カバー体内におけるたるみ、からみが
防止される。The wire cover is covered with the spool cover body, and one end of the wire is inserted into the wire friction device of the spool cover body and guided to the bonding head side. A frictional force is applied to the wire by the wire friction device during wire bonding. Further, when the wire breaks outside the spool cover body, slack and entanglement of the wire in the spool cover body are prevented by the friction force of the wire friction device.
【０００６】[0006]
【実施例】本発明の実施例を図１に基づいて説明する
と、図１はワイヤスプール１をスプール用カバー体６で
被蓋した状態を示す縦断面図で、モータ取付板７にモー
タ軸受ボス部を設け、該モータ軸受ボス部外周にスプラ
イン部７1 を形成している。そして、前記モータ取付板
７にワイヤスプール回転用モータ４を取り付けている。
また、スプール用カバー体６は図１乃至図３に示すよう
にプラスチック製の円筒体で構成され、該円筒体の一側
壁部にボス部を形成し、該ボス部内面にスプライン部６
1 を形成すると共に、該円筒体の外周面一部に開口部６
2 を形成し、該開口部６2 にはワイヤ摩擦装置８が設け
られている。前記ワイヤ摩擦装置８はフェルト１１を対
向して備え、一方のフェルト１１はスプライン用カバー
体６に固定され、他方のフェルト１１は圧縮スプリング
１０を介して摩擦力調整用ねじ９の先端に遊嵌され、該
摩擦力調整用ねじ９はスプール用カバー体６に螺合され
ている。なお、前記ワイヤ摩擦装置８はエアーや磁気に
よってワイヤに摩擦力を与えるものであってもよい。そ
して、前記スプール用カバー体６のスプライン部６
1 は、前記モータ取付板７のスプライン部７1 と係合
し、スプール用カバー体６を着脱自在に装着している。
なお、前記スプール用カバー体６は、モータ取付板７に
取付足（図示せず）を介して固定してもよい。また、前
記ワイヤスプール回転用モータ４のモータ軸５の先端に
は、スプール嵌挿定着部材２を固定し、該定着部材２の
スプライン部２1 に複数のスプール抜け止め用板バネ３
を介して、ワイヤを巻回したワイヤスプール１を着脱自
在に設けている。そして、図４に示すようにキャピラリ
１６、クランプ１４，１５、ワイヤガイド１３を備えた
ボンディングヘッド１８と前記スプール用カバー体６と
の間に、エア吹き付け装置１９とモータ回転センサ２
０、モータ停止センサ２１を備えたワイヤ繰り出し量制
御装置２２、ワイヤガイド１２を設けている。なお、図
４中１７はボンディングアームである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. 1. FIG. 1 is a vertical sectional view showing a state in which a wire spool 1 is covered with a spool cover body 6, and a motor mounting plate 7 has a motor bearing boss. And a spline portion 7 1 is formed on the outer periphery of the motor bearing boss portion. The wire spool rotating motor 4 is mounted on the motor mounting plate 7.
As shown in FIGS. 1 to 3, the spool cover body 6 is formed of a plastic cylindrical body, a boss portion is formed on one side wall portion of the cylindrical body, and the spline portion 6 is formed on the inner surface of the boss portion.
1 is formed, and an opening 6 is formed in a part of the outer peripheral surface of the cylindrical body.
2 , and a wire friction device 8 is provided in the opening 6 2 . The wire friction device 8 includes felts 11 facing each other, one felt 11 is fixed to the spline cover body 6, and the other felt 11 is loosely fitted to the tip of the friction force adjusting screw 9 via the compression spring 10. The friction force adjusting screw 9 is screwed onto the spool cover body 6. The wire rubbing device 8 may be one that applies a frictional force to the wire by air or magnetism. Then, the spline portion 6 of the spool cover body 6
1 is engaged with the spline portion 71 of the motor mounting plate 7, are fitted with a spool cover 6 detachably.
The spool cover body 6 may be fixed to the motor mounting plate 7 via mounting feet (not shown). Further, the wire on the end of the motor shaft 5 of the spool rotating motor 4, the spool fitted to fixed挿定adhesive member 2, locking plate spring 3 omission plurality of spools to the spline portion 2 1 of the fixing member 2
A wire spool 1 around which a wire is wound is detachably provided via the. Then, as shown in FIG. 4, between the bonding head 18 having the capillaries 16, the clamps 14 and 15, and the wire guide 13 and the spool cover body 6, the air blowing device 19 and the motor rotation sensor 2 are provided.
0, a wire feeding amount control device 22 having a motor stop sensor 21, and a wire guide 12. In addition, 17 in FIG. 4 is a bonding arm.
【０００７】そして、図４に示すように、ワイヤＷの一
端をワイヤ摩擦装置８のフェルト１１間に挿通して摩擦
力調整用ねじ９によってワイヤＷの摩擦力を調整し、前
記ワイヤＷをワイヤガイド１２、ワイヤ繰り出し量制御
装置２２、ワイヤガイド１３、クランプ１４，１５を介
してキャピラリ１６に導く。これにより、ワイヤＷはワ
イヤ繰り出し量制御装置２２のＯＮ−ＯＦＦ制御による
モータ回転制御により所定量繰り出されることになる
が、この際にワイヤＷにはスプール用カバー体６に設け
たワイヤ摩擦装置８により所定の摩擦力が与えられ、エ
ア吹き付け装置１９により所定のテンションが与えられ
ることになる。従って、従来のようにワイヤスプール回
転用モータに着脱自在に設けられたワイヤスプールとボ
ンディングヘッドとの間にワイヤ摩擦装置を設ける必要
はなく、ワイヤ供給装置の小型化、簡素化を図ることが
できる。又、ワイヤがスプール用カバー体６の外側で切
れた場合であっても、ワイヤ摩擦装置８がスプール用カ
バー体６に設けてあるから、ワイヤは該カバー体６内で
たるんだり、からんだりしないものである。なお、スプ
ール用カバー体６をモータ取付板７に着脱自在に装着し
た場合、前記スプール用カバー体６はワイヤスプール１
と対で取付、取外しすることもできる。Then, as shown in FIG. 4, one end of the wire W is inserted between the felts 11 of the wire friction device 8 and the friction force of the wire W is adjusted by the screw 9 for adjusting the friction force. It is guided to the capillary 16 via the guide 12, the wire feeding amount control device 22, the wire guide 13, and the clamps 14 and 15. As a result, the wire W is fed out by a predetermined amount by the motor rotation control by the ON-OFF control of the wire feed-out amount control device 22. At this time, the wire W is provided with the wire friction device 8 provided on the spool cover body 6. As a result, a predetermined frictional force is applied, and a predetermined tension is applied by the air blowing device 19. Therefore, it is not necessary to provide a wire friction device between the wire spool detachably provided in the wire spool rotating motor and the bonding head as in the prior art, and the wire supply device can be downsized and simplified. . Further, even if the wire is cut outside the spool cover body 6, since the wire friction device 8 is provided on the spool cover body 6, the wire does not sag or entangle in the cover body 6. It does not. When the spool cover body 6 is detachably attached to the motor mounting plate 7, the spool cover body 6 is attached to the wire spool 1.
It can also be installed and removed in pairs.
【０００８】[0008]
【発明の効果】本発明は、ワイヤスプールを被蓋するス
プール用カバー体を備え、該スプール用カバー体にワイ
ヤ摩擦装置を設けたから、ワイヤスプールとボンディン
グヘッドとの間にワイヤ摩擦装置を設ける必要はなくワ
イヤ供給装置の小型化、簡素化が図れるものである。
又、ワイヤが前記スプール用カバー体の外側で切れた場
合であっても、ワイヤはスプール用カバー体内でたるん
だり切れたりすることはなく、その後の修復作業が容易
なものとなる。As described above, according to the present invention, since the spool cover body for covering the wire spool is provided and the spool cover body is provided with the wire friction device, it is necessary to provide the wire friction device between the wire spool and the bonding head. Instead, the wire feeder can be downsized and simplified.
Further, even if the wire breaks outside the spool cover body, the wire does not slacken or break inside the spool cover body, and the subsequent repair work becomes easy.
【図１】本発明の実施例を示す縦断面図FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention.
【図２】本発明の実施例を示す平面図FIG. 2 is a plan view showing an embodiment of the present invention.
【図３】図２のＩ−Ｉ線の断面図FIG. 3 is a sectional view taken along the line II of FIG. 2;
【図４】ワイヤ供給装置の概略説明図FIG. 4 is a schematic explanatory view of a wire supply device.
【図５】従来例を示す概略説明図FIG. 5 is a schematic explanatory view showing a conventional example.
１ ワイヤスプール ２ スプール嵌挿定着部材 ３ 板バネ ４ ワイヤスプール回転用モータ ５ スプール回転用モータ軸 ６ スプール用カバー体 ７ モータ取付板 ８ ワイヤ摩擦装置 ９ 摩擦力調整用ねじ 10 圧縮スプリング 11 フェルト 12 ワイヤガイド 13 ワイヤガイド 14 クランプ 15 クランプ 16 キャピラリ 17 ボンディングアーム 18 ボンディングヘッド 19 エア吹き付け装置 20 モータ回転センサ 21 モータ停止センサ 22 ワイヤ繰り出し量制御装置 1 Wire Spool 2 Spool Fitting and Fixing Member 3 Leaf Spring 4 Wire Spool Rotating Motor 5 Spool Rotating Motor Shaft 6 Spool Cover Body 7 Motor Mounting Plate 8 Wire Friction Device 9 Friction Force Adjustment Screw 10 Compression Spring 11 Felt 12 Wire Guide 13 Wire guide 14 Clamp 15 Clamp 16 Capillary 17 Bonding arm 18 Bonding head 19 Air blowing device 20 Motor rotation sensor 21 Motor stop sensor 22 Wire feeding amount control device
Claims (1)
に設けられたワイヤスプールとボンディングヘッドとの
間にワイヤ摩擦装置、ワイヤ繰り出し量制御装置を備え
たワイヤボンディング装置において、前記ワイヤスプー
ルを被蓋するスプール用カバー体を備え、該スプール用
カバー体にワイヤ摩擦装置を設けたことを特徴とするワ
イヤボンディング装置のワイヤ供給装置。1. A wire bonding apparatus including a wire friction device and a wire feeding amount control device between a wire spool detachably mounted on a wire spool rotating motor and a bonding head, the wire spool being covered. A wire supply device for a wire bonding apparatus, comprising: a spool cover body; and a wire friction device provided on the spool cover body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3228546A JP2694226B2 (en) | 1991-08-15 | 1991-08-15 | Wire feeder for wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3228546A JP2694226B2 (en) | 1991-08-15 | 1991-08-15 | Wire feeder for wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05211199A JPH05211199A (en) | 1993-08-20 |
| JP2694226B2 true JP2694226B2 (en) | 1997-12-24 |
Family
ID=16878082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3228546A Expired - Lifetime JP2694226B2 (en) | 1991-08-15 | 1991-08-15 | Wire feeder for wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2694226B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001151413A (en) * | 1999-11-29 | 2001-06-05 | Shinkawa Ltd | Spool holder structure in wire bonder |
| FI126548B (en) * | 2014-12-16 | 2017-02-15 | Kemppi Oy | Spool reel hub for a welding wire feeder and wire feeder |
-
1991
- 1991-08-15 JP JP3228546A patent/JP2694226B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05211199A (en) | 1993-08-20 |
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