JPS62199950U - - Google Patents
Info
- Publication number
- JPS62199950U JPS62199950U JP1986089037U JP8903786U JPS62199950U JP S62199950 U JPS62199950 U JP S62199950U JP 1986089037 U JP1986089037 U JP 1986089037U JP 8903786 U JP8903786 U JP 8903786U JP S62199950 U JPS62199950 U JP S62199950U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- spool
- unraveling
- wound around
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Guides For Winding Or Rewinding, Or Guides For Filamentary Materials (AREA)
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例を示す図、第２図
は他の実施例を示す図、第３図は従来例を示す図
である。
１……ワイヤースプール、２……ワイヤーガイ
ド、３……ワイヤーテンシヨンクランプ、４……
ワイヤーカツトクランプ、５……キヤピラリーツ
ール、６……ワイヤーのくせ、７……棒状矯正ユ
ニツト、７′……リング状矯正ユニツト、８……
ワイヤー、９……支柱。
FIG. 1 shows one embodiment of this invention, FIG. 2 shows another embodiment, and FIG. 3 shows a conventional example. 1... Wire spool, 2... Wire guide, 3... Wire tension clamp, 4...
Wire cut clamp, 5... Capillary tool, 6... Wire habit, 7... Rod-shaped correction unit, 7'... Ring-shaped correction unit, 8...
Wire, 9...post.
Claims (1)
用するワイヤーボンデイング装置において、スプ
ール近傍に、ワイヤーの巻きぐせを矯正するユニ
ツトを設けたことを特徴とするワイヤーボンデイ
ング装置におけるワイヤー供給装置。 1. A wire supply device for a wire bonding device, which uses a wire wound around a spool by unraveling the wire, characterized in that a unit for correcting curls in the wire is provided near the spool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986089037U JPS62199950U (en) | 1986-06-11 | 1986-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986089037U JPS62199950U (en) | 1986-06-11 | 1986-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199950U true JPS62199950U (en) | 1987-12-19 |
Family
ID=30947655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986089037U Pending JPS62199950U (en) | 1986-06-11 | 1986-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199950U (en) |
-
1986
- 1986-06-11 JP JP1986089037U patent/JPS62199950U/ja active Pending