JPH0474429U - - Google Patents
Info
- Publication number
- JPH0474429U JPH0474429U JP1990116819U JP11681990U JPH0474429U JP H0474429 U JPH0474429 U JP H0474429U JP 1990116819 U JP1990116819 U JP 1990116819U JP 11681990 U JP11681990 U JP 11681990U JP H0474429 U JPH0474429 U JP H0474429U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- block
- cylindrical hole
- tension mechanism
- tension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の実施例１の概略図、第２図は
実施例２の概略図、第３図は従来のワイヤテンシ
ヨン機構の概略図である。
１……ワイヤ、２……スプール、３……ワイヤ
ガイド、４……ボンデイングツール、５……ノズ
ル、６……円筒穴、７……空気穴、８……ブロツ
ク。
FIG. 1 is a schematic diagram of Embodiment 1 of the present invention, FIG. 2 is a schematic diagram of Embodiment 2, and FIG. 3 is a schematic diagram of a conventional wire tension mechanism. 1... Wire, 2... Spool, 3... Wire guide, 4... Bonding tool, 5... Nozzle, 6... Cylindrical hole, 7... Air hole, 8... Block.
Claims (1)
ヨン機構において、ワイヤスプールからボンデイ
ングツールまでのワイヤ経路の途中に、ワイヤ軸
に沿つて同芯となる円筒穴を有するブロツクを位
置させ、このブロツクに複数の空気穴を配置して
円筒穴内に開口させ、ワイヤの繰り出し方向と逆
方向に気流を生ぜしめてワイヤにバツクテンシヨ
ンを与えることを特徴とするワイヤテンシヨン機
構。 In the wire tension mechanism of a wire bonding device, a block having a cylindrical hole concentric with the wire axis is located in the middle of the wire path from the wire spool to the bonding tool, and a plurality of air holes are arranged in this block. A wire tension mechanism is characterized in that the wire is opened in a cylindrical hole, and an air current is generated in a direction opposite to the direction in which the wire is fed out to give back tension to the wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116819U JPH0474429U (en) | 1990-11-07 | 1990-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116819U JPH0474429U (en) | 1990-11-07 | 1990-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0474429U true JPH0474429U (en) | 1992-06-30 |
Family
ID=31864659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990116819U Pending JPH0474429U (en) | 1990-11-07 | 1990-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0474429U (en) |
-
1990
- 1990-11-07 JP JP1990116819U patent/JPH0474429U/ja active Pending