JPH044749U - - Google Patents
Info
- Publication number
- JPH044749U JPH044749U JP1990044895U JP4489590U JPH044749U JP H044749 U JPH044749 U JP H044749U JP 1990044895 U JP1990044895 U JP 1990044895U JP 4489590 U JP4489590 U JP 4489590U JP H044749 U JPH044749 U JP H044749U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- adjusting means
- tension adjusting
- rotating drum
- bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011148 porous material Substances 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 230000002265 prevention Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一具体例の略示正面図、第２
図は、その要部の拡大正面図である。第３図はワ
イヤボンダの従来例を示す概略正面図である。
１……スプール、２……ワイヤ、３……キヤピ
ラリ、１１……負圧吸引装置、１２……負圧吸引
孔、１３……吸込み防止部材。
Fig. 1 is a schematic front view of one specific example of the present invention;
The figure is an enlarged front view of the main parts. FIG. 3 is a schematic front view showing a conventional example of a wire bonder. DESCRIPTION OF SYMBOLS 1... Spool, 2... Wire, 3... Capillary, 11... Negative pressure suction device, 12... Negative pressure suction hole, 13... Suction prevention member.
Claims (1)
ラリとの間にワイヤの張力を調節する手段を設け
たワイヤボンダにおいて、 上記ワイヤの張力調節手段を、外周面の周方向
に多数の吸引孔を開口させ、かつ吸引孔開口面を
多孔質部材にて被覆した回転ドラムにて構成しワ
イヤを回転ドラムの周面に沿つて配設したことを
特徴とするワイヤボンダ。[Claims for Utility Model Registration] A wire bonder in which a wire tension adjusting means is provided between a wire winding spool and a bonding capillary, the wire tension adjusting means being provided in a plurality of wire tension adjusting means in the circumferential direction of the outer peripheral surface. 1. A wire bonder comprising a rotating drum having suction holes opened and the suction hole opening surface covered with a porous material, and a wire disposed along the circumferential surface of the rotating drum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044895U JPH044749U (en) | 1990-04-25 | 1990-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044895U JPH044749U (en) | 1990-04-25 | 1990-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044749U true JPH044749U (en) | 1992-01-16 |
Family
ID=31558601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990044895U Pending JPH044749U (en) | 1990-04-25 | 1990-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044749U (en) |
-
1990
- 1990-04-25 JP JP1990044895U patent/JPH044749U/ja active Pending