JPH02124976U - - Google Patents
Info
- Publication number
- JPH02124976U JPH02124976U JP1989030956U JP3095689U JPH02124976U JP H02124976 U JPH02124976 U JP H02124976U JP 1989030956 U JP1989030956 U JP 1989030956U JP 3095689 U JP3095689 U JP 3095689U JP H02124976 U JPH02124976 U JP H02124976U
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- spool
- bonding
- spool body
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004804 winding Methods 0.000 claims description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Winding Filamentary Materials (AREA)
- Tension Adjustment In Filamentary Materials (AREA)
- Wire Bonding (AREA)
Description
第１図及び第２図は本考案の２つの実施例を示
すスプール及び孔空きガイド部材の各縦断面図、
第３図はワイヤボンデイング装置の一部断面を含
む略示正面図、第４図は従来のボンデイングワイ
ヤの巻回構造を示すスプールの縦断面図、第５図
はボンデイングワイヤの綾巻き形態を説明するス
プールの正面図、第６図はボンデイングワイヤの
巻層にくずれが発生した状態を説明するスプール
の部分拡大断面図である。
１……ワイヤボンデイング装置、２……ボンデ
イングワイヤ、５……スプール本体、８ｄ……ス
プール本体の軸線方向に対して傾斜した巻回整列
層。
1 and 2 are longitudinal sectional views of a spool and a perforated guide member showing two embodiments of the present invention,
Fig. 3 is a schematic front view including a partial cross section of the wire bonding device, Fig. 4 is a vertical cross-sectional view of a spool showing a conventional bonding wire winding structure, and Fig. 5 explains the cross-wound form of the bonding wire. FIG. 6 is a partially enlarged cross-sectional view of the spool illustrating a state in which the winding layer of the bonding wire is distorted. 1... wire bonding device, 2... bonding wire, 5... spool body, 8d... winding alignment layer inclined with respect to the axial direction of the spool body.
Claims (1)
体の中心孔を通してボンデイングツールに向けて
送り出すスプールに於いて、 前記ボンデイングワイヤがスプール本体の軸線
方向に対して傾斜した巻回整列層を形成してなる
ことを特徴とするボンデイングワイヤの巻回構造
。[Claims for Utility Model Registration] In a spool that feeds a cross-wound bonding wire toward a bonding tool through a center hole of a spool body, the bonding wire has a winding alignment layer that is inclined with respect to the axial direction of the spool body. A bonding wire winding structure characterized by forming a bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989030956U JPH02124976U (en) | 1989-03-18 | 1989-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989030956U JPH02124976U (en) | 1989-03-18 | 1989-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02124976U true JPH02124976U (en) | 1990-10-15 |
Family
ID=31533679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989030956U Pending JPH02124976U (en) | 1989-03-18 | 1989-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02124976U (en) |
-
1989
- 1989-03-18 JP JP1989030956U patent/JPH02124976U/ja active Pending