JPH02137343A - Wire feed apparatus - Google Patents

Wire feed apparatus

Info

Publication number
JPH02137343A
JPH02137343A JP29013788A JP29013788A JPH02137343A JP H02137343 A JPH02137343 A JP H02137343A JP 29013788 A JP29013788 A JP 29013788A JP 29013788 A JP29013788 A JP 29013788A JP H02137343 A JPH02137343 A JP H02137343A
Authority
JP
Japan
Prior art keywords
wire
turn
metal rod
guides
tension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29013788A
Other languages
Japanese (ja)
Inventor
Takahiro Endo
Shinji Kanayama
Shozo Minamitani
Nobuhiko Muraoka
Hitoshi Nakamura
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP29013788A priority Critical patent/JPH02137343A/en
Publication of JPH02137343A publication Critical patent/JPH02137343A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H59/00Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators
    • B65H59/38Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by regulating speed of driving mechanism of unwinding, paying-out, forwarding, winding, or depositing devices, e.g. automatically in response to variations in tension
    • B65H59/384Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by regulating speed of driving mechanism of unwinding, paying-out, forwarding, winding, or depositing devices, e.g. automatically in response to variations in tension using electronic means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/18Methods or apparatus in which packages rotate
    • B65H49/34Arrangements for effecting positive rotation of packages
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2553/00Means for sensing, detecting or otherwise used for control
    • B65H2553/20Means for sensing, detecting or otherwise used for control using electric elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Abstract

PURPOSE: To prevent a wire from being cut by a shortage of a feed amount of the wire, caused by a detection error of a sensor by a method wherein a metal rod connected to an electrostatic switch is installed in a wire route.
CONSTITUTION: In order to detect a wire, a metal rod 13 connected to an electrostatic switch is installed in a wire route. A wire 5 sent out from feed rollers 7, 8 is fed to the supply side through guides 9, 10, 11. During this process, the wire 5 is bent by its own weigh between the guides 9, 10, 11; a turn part 12 is formed. When the turn part is reduced gradually and the wire 5 approaches the metal rod 13, a sensor is turned on. By this arrangement, it is possible to detect a state of a tension before the wire 5 is cut by the tension; when a motor for drive use is turned by its detection signal, the wire 5 is sent out again and the proper turn part 12 can be formed.
COPYRIGHT: (C)1990,JPO&Japio
JP29013788A 1988-11-18 1988-11-18 Wire feed apparatus Pending JPH02137343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29013788A JPH02137343A (en) 1988-11-18 1988-11-18 Wire feed apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29013788A JPH02137343A (en) 1988-11-18 1988-11-18 Wire feed apparatus

Publications (1)

Publication Number Publication Date
JPH02137343A true JPH02137343A (en) 1990-05-25

Family

ID=17752269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29013788A Pending JPH02137343A (en) 1988-11-18 1988-11-18 Wire feed apparatus

Country Status (1)

Country Link
JP (1) JPH02137343A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459140U (en) * 1990-09-18 1992-05-21
US7255259B2 (en) * 2004-09-04 2007-08-14 Texas Instruments Incorporated Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication
JP2013139320A (en) * 2012-01-05 2013-07-18 Nittoku Eng Co Ltd Slack preventing device for wire rod wound around spool, and slack preventing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459140U (en) * 1990-09-18 1992-05-21
US7255259B2 (en) * 2004-09-04 2007-08-14 Texas Instruments Incorporated Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication
JP2013139320A (en) * 2012-01-05 2013-07-18 Nittoku Eng Co Ltd Slack preventing device for wire rod wound around spool, and slack preventing method thereof
EP2612834A3 (en) * 2012-01-05 2014-09-17 Nittoku Engineering Co., Ltd. Slack preventing device for wire rod wound around spool, and slack preventing method therefore

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