JPH0458896U - - Google Patents
Info
- Publication number
- JPH0458896U JPH0458896U JP9759990U JP9759990U JPH0458896U JP H0458896 U JPH0458896 U JP H0458896U JP 9759990 U JP9759990 U JP 9759990U JP 9759990 U JP9759990 U JP 9759990U JP H0458896 U JPH0458896 U JP H0458896U
- Authority
- JP
- Japan
- Prior art keywords
- disk
- printed board
- enclosure
- cover member
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 229910000975 Carbon steel Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000010962 carbon steel Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
Description
第１図は本考案に係る放熱構造を有するデイス
ク装置の縦断面図、第２図は第１図のＡ部の拡大
図、第３図は第１図のＡ部の第２実施例を示す拡
大図、第４図は第１図のＡ部の第３実施例を示す
拡大図である。
２６……デイスクエンクロージヤ、２８……プ
リント板、３２……カバー部材、３２ａ……フラ
ンジ部。
FIG. 1 is a longitudinal sectional view of a disk device having a heat dissipation structure according to the present invention, FIG. 2 is an enlarged view of section A in FIG. 1, and FIG. 3 is a second embodiment of section A in FIG. 1. Enlarged view, FIG. 4 is an enlarged view showing the third embodiment of section A in FIG. 26... Disk enclosure, 28... Printed board, 32... Cover member, 32a... Flange portion.
Claims (1)
とを囲繞するデイスクエンクロージヤ２６の上面
に、前記駆動装置の作動を制御する回路を有する
プリント板２８を取り付けたデイスク装置におい
て、前記プリント板を被うと共に、前記エンクロ
ージヤと熱伝導的に連結するよう取り付けられた
炭素鋼の熱伝導率よりも大きな熱伝導率を有する
アルミニウム等の高熱伝導材料から成るカバー部
材３２並びにその締結用のねじ部材３４とを具備
したことを特徴とするデイスク装置の放熱構造。 ２ 前記カバー部材が前記デイスクエンクロージ
ヤと直接に面接触すると共に前記ねじ部材３４に
よつて押圧されつつ取り付けられるフランジ部３
２ｂを有して成る請求項１記載のデイスク装置の
放熱構造。[Claims for Utility Model Registration] 1. Disk 10 and head drive device 18, 24
In a disk device in which a printed board 28 having a circuit for controlling the operation of the drive device is attached to the upper surface of a disk enclosure 26 surrounding the drive device, the printed board 28 covers the printed board and is thermally conductively connected to the enclosure. A disk device comprising a cover member 32 made of a highly thermally conductive material such as aluminum having a thermal conductivity higher than that of carbon steel attached to the disk device, and a screw member 34 for fastening the cover member 32. Heat dissipation structure. 2 a flange portion 3 to which the cover member is attached while being in direct surface contact with the disk enclosure and being pressed by the screw member 34;
2. The heat dissipation structure for a disk device according to claim 1, comprising: 2b.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9759990U JP2510931Y2 (en) | 1990-09-19 | 1990-09-19 | Heat dissipation structure of disk device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9759990U JP2510931Y2 (en) | 1990-09-19 | 1990-09-19 | Heat dissipation structure of disk device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0458896U true JPH0458896U (en) | 1992-05-20 |
| JP2510931Y2 JP2510931Y2 (en) | 1996-09-18 |
Family
ID=31838107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9759990U Expired - Fee Related JP2510931Y2 (en) | 1990-09-19 | 1990-09-19 | Heat dissipation structure of disk device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510931Y2 (en) |
-
1990
- 1990-09-19 JP JP9759990U patent/JP2510931Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2510931Y2 (en) | 1996-09-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |