JPH0458687B2 - - Google Patents
Info
- Publication number
- JPH0458687B2 JPH0458687B2 JP59063857A JP6385784A JPH0458687B2 JP H0458687 B2 JPH0458687 B2 JP H0458687B2 JP 59063857 A JP59063857 A JP 59063857A JP 6385784 A JP6385784 A JP 6385784A JP H0458687 B2 JPH0458687 B2 JP H0458687B2
- Authority
- JP
- Japan
- Prior art keywords
- sliding ring
- main shaft
- gripper
- support rod
- grippers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 24
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 230000000630 rising effect Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000007246 mechanism Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Centrifugal Separators (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6385784A JPS60206139A (ja) | 1984-03-30 | 1984-03-30 | 半導体材料の水切乾燥装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6385784A JPS60206139A (ja) | 1984-03-30 | 1984-03-30 | 半導体材料の水切乾燥装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60206139A JPS60206139A (ja) | 1985-10-17 |
JPH0458687B2 true JPH0458687B2 (US20020051482A1-20020502-M00012.png) | 1992-09-18 |
Family
ID=13241424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6385784A Granted JPS60206139A (ja) | 1984-03-30 | 1984-03-30 | 半導体材料の水切乾燥装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60206139A (US20020051482A1-20020502-M00012.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4924852U (US20020051482A1-20020502-M00012.png) * | 1972-06-10 | 1974-03-02 | ||
JPS5737837A (en) * | 1980-08-20 | 1982-03-02 | Toshiba Corp | Drying device for semiconductor wafer |
-
1984
- 1984-03-30 JP JP6385784A patent/JPS60206139A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4924852U (US20020051482A1-20020502-M00012.png) * | 1972-06-10 | 1974-03-02 | ||
JPS5737837A (en) * | 1980-08-20 | 1982-03-02 | Toshiba Corp | Drying device for semiconductor wafer |
Also Published As
Publication number | Publication date |
---|---|
JPS60206139A (ja) | 1985-10-17 |