JPH0458196B2 - - Google Patents
Info
- Publication number
- JPH0458196B2 JPH0458196B2 JP5265287A JP5265287A JPH0458196B2 JP H0458196 B2 JPH0458196 B2 JP H0458196B2 JP 5265287 A JP5265287 A JP 5265287A JP 5265287 A JP5265287 A JP 5265287A JP H0458196 B2 JPH0458196 B2 JP H0458196B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- tank
- electrodeposition
- liquid
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 47
- 238000004070 electrodeposition Methods 0.000 claims description 45
- 239000007788 liquid Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 16
- 239000003973 paint Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000002659 electrodeposit Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002203 pretreatment Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5265287A JPS63219188A (ja) | 1987-03-06 | 1987-03-06 | プリント配線板のレジスト膜電着方法、および電着装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5265287A JPS63219188A (ja) | 1987-03-06 | 1987-03-06 | プリント配線板のレジスト膜電着方法、および電着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63219188A JPS63219188A (ja) | 1988-09-12 |
| JPH0458196B2 true JPH0458196B2 (enrdf_load_stackoverflow) | 1992-09-16 |
Family
ID=12920788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5265287A Granted JPS63219188A (ja) | 1987-03-06 | 1987-03-06 | プリント配線板のレジスト膜電着方法、および電着装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63219188A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02136359U (enrdf_load_stackoverflow) * | 1989-04-18 | 1990-11-14 | ||
| US5502345A (en) * | 1994-08-29 | 1996-03-26 | The United States Of America As Represented By The Secretary Of The Navy | Unitary transducer with variable resistivity |
-
1987
- 1987-03-06 JP JP5265287A patent/JPS63219188A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63219188A (ja) | 1988-09-12 |
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