JPH0457107B2 - - Google Patents
Info
- Publication number
- JPH0457107B2 JPH0457107B2 JP20045085A JP20045085A JPH0457107B2 JP H0457107 B2 JPH0457107 B2 JP H0457107B2 JP 20045085 A JP20045085 A JP 20045085A JP 20045085 A JP20045085 A JP 20045085A JP H0457107 B2 JPH0457107 B2 JP H0457107B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead frame
- jig
- mask
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20045085A JPS6261351A (ja) | 1985-09-12 | 1985-09-12 | 噴流式メツキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20045085A JPS6261351A (ja) | 1985-09-12 | 1985-09-12 | 噴流式メツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6261351A JPS6261351A (ja) | 1987-03-18 |
| JPH0457107B2 true JPH0457107B2 (cg-RX-API-DMAC7.html) | 1992-09-10 |
Family
ID=16424503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20045085A Granted JPS6261351A (ja) | 1985-09-12 | 1985-09-12 | 噴流式メツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6261351A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01198497A (ja) * | 1988-02-02 | 1989-08-10 | Mitsubishi Electric Corp | 部分めっき方法 |
| JP2023121244A (ja) * | 2022-02-21 | 2023-08-31 | Dowaメタルテック株式会社 | 部分めっき用マスク部材及び部分めっき方法 |
-
1985
- 1985-09-12 JP JP20045085A patent/JPS6261351A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6261351A (ja) | 1987-03-18 |
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