JPH045648U - - Google Patents
Info
- Publication number
- JPH045648U JPH045648U JP1990045299U JP4529990U JPH045648U JP H045648 U JPH045648 U JP H045648U JP 1990045299 U JP1990045299 U JP 1990045299U JP 4529990 U JP4529990 U JP 4529990U JP H045648 U JPH045648 U JP H045648U
- Authority
- JP
- Japan
- Prior art keywords
- metal layers
- metallized metal
- package
- housing
- insulating container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は第１図
に示すパツケージの絶縁基体の平面図である。 １……絶縁基体、２……蓋体、３……絶縁容器
、５……メタライズ金属層、７……外部リード端
子。
ケージの一実施例を示す断面図、第２図は第１図
に示すパツケージの絶縁基体の平面図である。 １……絶縁基体、２……蓋体、３……絶縁容器
、５……メタライズ金属層、７……外部リード端
子。
Claims (1)
- 内部に半導体素子を収容するための空所を有す
る絶縁容器の外表面に多数のメタライズ金属層を
被着させるとともに該メタライズ金属層の各々に
銀を含有するロウ材を介して外部リード端子を取
着して成る半導体素子収納用パツケージにおいて
、前記絶縁容器の少なくともメタライズ金属層間
に位置する外表面の表面粗さを中心線平均粗さＲ
ａで６．０乃至２０．０μｍとしたことを特徴と
する半導体素子収納用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045299U JPH045648U (ja) | 1990-04-28 | 1990-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045299U JPH045648U (ja) | 1990-04-28 | 1990-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045648U true JPH045648U (ja) | 1992-01-20 |
Family
ID=31559352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990045299U Pending JPH045648U (ja) | 1990-04-28 | 1990-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045648U (ja) |
-
1990
- 1990-04-28 JP JP1990045299U patent/JPH045648U/ja active Pending