JPH0456336U - - Google Patents

Info

Publication number
JPH0456336U
JPH0456336U JP1990099887U JP9988790U JPH0456336U JP H0456336 U JPH0456336 U JP H0456336U JP 1990099887 U JP1990099887 U JP 1990099887U JP 9988790 U JP9988790 U JP 9988790U JP H0456336 U JPH0456336 U JP H0456336U
Authority
JP
Japan
Prior art keywords
semiconductor element
connecting means
semiconductor device
bonding wire
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990099887U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990099887U priority Critical patent/JPH0456336U/ja
Publication of JPH0456336U publication Critical patent/JPH0456336U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W72/07552
    • H10W72/07553
    • H10W72/07554
    • H10W72/527
    • H10W72/536
    • H10W72/5363
    • H10W72/537
    • H10W72/5445
    • H10W72/5449
    • H10W72/884
    • H10W72/932
    • H10W74/00
    • H10W90/24
    • H10W90/736
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1990099887U 1990-09-25 1990-09-25 Pending JPH0456336U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990099887U JPH0456336U (cg-RX-API-DMAC10.html) 1990-09-25 1990-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990099887U JPH0456336U (cg-RX-API-DMAC10.html) 1990-09-25 1990-09-25

Publications (1)

Publication Number Publication Date
JPH0456336U true JPH0456336U (cg-RX-API-DMAC10.html) 1992-05-14

Family

ID=31842127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990099887U Pending JPH0456336U (cg-RX-API-DMAC10.html) 1990-09-25 1990-09-25

Country Status (1)

Country Link
JP (1) JPH0456336U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335680A (ja) * 1994-06-14 1995-12-22 Fujitsu Ltd 回路基板及びその製造方法、並びに半導体装置のワイヤボンディング方法及び半導体装置の封止方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335680A (ja) * 1994-06-14 1995-12-22 Fujitsu Ltd 回路基板及びその製造方法、並びに半導体装置のワイヤボンディング方法及び半導体装置の封止方法

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