JPH0176040U - - Google Patents

Info

Publication number
JPH0176040U
JPH0176040U JP1987171832U JP17183287U JPH0176040U JP H0176040 U JPH0176040 U JP H0176040U JP 1987171832 U JP1987171832 U JP 1987171832U JP 17183287 U JP17183287 U JP 17183287U JP H0176040 U JPH0176040 U JP H0176040U
Authority
JP
Japan
Prior art keywords
resin
pellet
semiconductor device
mounting part
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987171832U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987171832U priority Critical patent/JPH0176040U/ja
Publication of JPH0176040U publication Critical patent/JPH0176040U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP1987171832U 1987-11-09 1987-11-09 Pending JPH0176040U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987171832U JPH0176040U (cg-RX-API-DMAC10.html) 1987-11-09 1987-11-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987171832U JPH0176040U (cg-RX-API-DMAC10.html) 1987-11-09 1987-11-09

Publications (1)

Publication Number Publication Date
JPH0176040U true JPH0176040U (cg-RX-API-DMAC10.html) 1989-05-23

Family

ID=31463837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987171832U Pending JPH0176040U (cg-RX-API-DMAC10.html) 1987-11-09 1987-11-09

Country Status (1)

Country Link
JP (1) JPH0176040U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112017002421T5 (de) 2016-05-12 2019-01-24 Mitsubishi Electric Corporation Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112017002421T5 (de) 2016-05-12 2019-01-24 Mitsubishi Electric Corporation Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit
US10741413B2 (en) 2016-05-12 2020-08-11 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device

Similar Documents

Publication Publication Date Title
JPH0176040U (cg-RX-API-DMAC10.html)
JPH0226261U (cg-RX-API-DMAC10.html)
JPH0265355U (cg-RX-API-DMAC10.html)
JPH01100443U (cg-RX-API-DMAC10.html)
JPH02101544U (cg-RX-API-DMAC10.html)
JPS6429843U (cg-RX-API-DMAC10.html)
JPS6382945U (cg-RX-API-DMAC10.html)
JPS61182036U (cg-RX-API-DMAC10.html)
JPS61149347U (cg-RX-API-DMAC10.html)
JPH0215738U (cg-RX-API-DMAC10.html)
JPS63128745U (cg-RX-API-DMAC10.html)
JPS63118247U (cg-RX-API-DMAC10.html)
JPS6176971U (cg-RX-API-DMAC10.html)
JPS6422044U (cg-RX-API-DMAC10.html)
JPS6397241U (cg-RX-API-DMAC10.html)
JPS61114842U (cg-RX-API-DMAC10.html)
JPS61123544U (cg-RX-API-DMAC10.html)
JPS6329954U (cg-RX-API-DMAC10.html)
JPH01174946U (cg-RX-API-DMAC10.html)
JPH0211341U (cg-RX-API-DMAC10.html)
JPH02146437U (cg-RX-API-DMAC10.html)
JPS61127644U (cg-RX-API-DMAC10.html)
JPH031543U (cg-RX-API-DMAC10.html)
JPS63102255U (cg-RX-API-DMAC10.html)
JPH01104720U (cg-RX-API-DMAC10.html)