JPH02146439U - - Google Patents

Info

Publication number
JPH02146439U
JPH02146439U JP1989055490U JP5549089U JPH02146439U JP H02146439 U JPH02146439 U JP H02146439U JP 1989055490 U JP1989055490 U JP 1989055490U JP 5549089 U JP5549089 U JP 5549089U JP H02146439 U JPH02146439 U JP H02146439U
Authority
JP
Japan
Prior art keywords
pad electrode
wire bonding
semiconductor device
electrode structure
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989055490U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989055490U priority Critical patent/JPH02146439U/ja
Publication of JPH02146439U publication Critical patent/JPH02146439U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/90
    • H10W72/07141
    • H10W72/07551
    • H10W72/07553
    • H10W72/50
    • H10W72/531
    • H10W72/536
    • H10W72/59
    • H10W72/934
    • H10W72/983
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1989055490U 1989-05-15 1989-05-15 Pending JPH02146439U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989055490U JPH02146439U (cg-RX-API-DMAC10.html) 1989-05-15 1989-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989055490U JPH02146439U (cg-RX-API-DMAC10.html) 1989-05-15 1989-05-15

Publications (1)

Publication Number Publication Date
JPH02146439U true JPH02146439U (cg-RX-API-DMAC10.html) 1990-12-12

Family

ID=31578488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989055490U Pending JPH02146439U (cg-RX-API-DMAC10.html) 1989-05-15 1989-05-15

Country Status (1)

Country Link
JP (1) JPH02146439U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071317A (ja) * 2009-09-25 2011-04-07 Renesas Electronics Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071317A (ja) * 2009-09-25 2011-04-07 Renesas Electronics Corp 半導体装置
US8772952B2 (en) 2009-09-25 2014-07-08 Renesas Electronics Corporation Semiconductor device with copper wire having different width portions
US9024454B2 (en) 2009-09-25 2015-05-05 Renesas Electronics Corporation Method of manufacturing semiconductor device

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