JPS63197354U - - Google Patents

Info

Publication number
JPS63197354U
JPS63197354U JP1987089255U JP8925587U JPS63197354U JP S63197354 U JPS63197354 U JP S63197354U JP 1987089255 U JP1987089255 U JP 1987089255U JP 8925587 U JP8925587 U JP 8925587U JP S63197354 U JPS63197354 U JP S63197354U
Authority
JP
Japan
Prior art keywords
semiconductor
lead frame
view
plan
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987089255U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987089255U priority Critical patent/JPS63197354U/ja
Publication of JPS63197354U publication Critical patent/JPS63197354U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/07141
    • H10W72/07168
    • H10W72/075
    • H10W72/07521
    • H10W72/536
    • H10W72/5363
    • H10W72/5449
    • H10W72/932
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987089255U 1987-06-09 1987-06-09 Pending JPS63197354U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987089255U JPS63197354U (cg-RX-API-DMAC10.html) 1987-06-09 1987-06-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987089255U JPS63197354U (cg-RX-API-DMAC10.html) 1987-06-09 1987-06-09

Publications (1)

Publication Number Publication Date
JPS63197354U true JPS63197354U (cg-RX-API-DMAC10.html) 1988-12-19

Family

ID=30948080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987089255U Pending JPS63197354U (cg-RX-API-DMAC10.html) 1987-06-09 1987-06-09

Country Status (1)

Country Link
JP (1) JPS63197354U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000044040A1 (fr) * 1999-01-22 2000-07-27 Seiko Epson Corporation Technique de soudage de fils, dispositif semi-conducteur, carte de circuit imprime, dispositif electronique et poste de soudure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000044040A1 (fr) * 1999-01-22 2000-07-27 Seiko Epson Corporation Technique de soudage de fils, dispositif semi-conducteur, carte de circuit imprime, dispositif electronique et poste de soudure

Similar Documents

Publication Publication Date Title
JPS63197354U (cg-RX-API-DMAC10.html)
JPS63197355U (cg-RX-API-DMAC10.html)
JPH0456336U (cg-RX-API-DMAC10.html)
JPS60181051U (ja) リ−ドフレ−ムの構造
JPS6382950U (cg-RX-API-DMAC10.html)
JPH02118948U (cg-RX-API-DMAC10.html)
JPS63180929U (cg-RX-API-DMAC10.html)
JPS63172149U (cg-RX-API-DMAC10.html)
JPH0356153U (cg-RX-API-DMAC10.html)
JPS6240842U (cg-RX-API-DMAC10.html)
JPH02146439U (cg-RX-API-DMAC10.html)
JPS62142847U (cg-RX-API-DMAC10.html)
JPS62162840U (cg-RX-API-DMAC10.html)
JPS63201331U (cg-RX-API-DMAC10.html)
JPS6142840U (ja) 半導体装置
JPS622249U (cg-RX-API-DMAC10.html)
JPH01100452U (cg-RX-API-DMAC10.html)
JPS63201330U (cg-RX-API-DMAC10.html)
JPS60186715U (ja) 音叉型圧電振動子の支持構造
JPS63201347U (cg-RX-API-DMAC10.html)
JPS6236555U (cg-RX-API-DMAC10.html)
JPS63159847U (cg-RX-API-DMAC10.html)
JPH0298636U (cg-RX-API-DMAC10.html)
JPH0336138U (cg-RX-API-DMAC10.html)
JPH0430745U (cg-RX-API-DMAC10.html)