JPH0455536B2 - - Google Patents
Info
- Publication number
- JPH0455536B2 JPH0455536B2 JP61185913A JP18591386A JPH0455536B2 JP H0455536 B2 JPH0455536 B2 JP H0455536B2 JP 61185913 A JP61185913 A JP 61185913A JP 18591386 A JP18591386 A JP 18591386A JP H0455536 B2 JPH0455536 B2 JP H0455536B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- powder
- green sheet
- ceramic substrate
- metallized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W90/756—
Landscapes
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185913A JPS6342148A (ja) | 1986-08-07 | 1986-08-07 | 導電性シ−ト及びそれによるメタライズ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185913A JPS6342148A (ja) | 1986-08-07 | 1986-08-07 | 導電性シ−ト及びそれによるメタライズ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6342148A JPS6342148A (ja) | 1988-02-23 |
| JPH0455536B2 true JPH0455536B2 (enExample) | 1992-09-03 |
Family
ID=16179069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61185913A Granted JPS6342148A (ja) | 1986-08-07 | 1986-08-07 | 導電性シ−ト及びそれによるメタライズ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6342148A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2866962B2 (ja) * | 1988-11-21 | 1999-03-08 | 京セラ株式会社 | 半導体素子収納用パッケージの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62276703A (ja) * | 1986-05-26 | 1987-12-01 | 住友金属鉱山株式会社 | 金被膜形成方法 |
-
1986
- 1986-08-07 JP JP61185913A patent/JPS6342148A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6342148A (ja) | 1988-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4172919A (en) | Copper conductor compositions containing copper oxide and Bi2 O3 | |
| CA2566279C (en) | Lead-free and cadmium-free conductive copper thick film pastes | |
| US5165986A (en) | Copper conductive composition for use on aluminum nitride substrate | |
| US4799958A (en) | Metallizing paste | |
| JPS6254206B2 (enExample) | ||
| US6103146A (en) | Thick film conductor paste compositions for aluminum nitride substrates | |
| JPH0653594B2 (ja) | 導体組成物 | |
| DE69016096T2 (de) | Substrat, verwendbar bei der Herstellung einer Dickschichtschaltung. | |
| US5397830A (en) | Dielectric materials | |
| KR100585909B1 (ko) | 질화알루미늄 기판에 사용하기 위한 후막 전도체 조성물 | |
| US4963187A (en) | Metallizing paste for circuit board having low thermal expansion coefficient | |
| JP2822518B2 (ja) | 窒化アルミニウム焼結体への金属化層形成方法 | |
| EP3824481B1 (en) | Conductive thick film paste for silicon nitride and other substrates | |
| JPH0455536B2 (enExample) | ||
| JPS6280907A (ja) | 導電ペ−スト | |
| JPH0737420A (ja) | 導体ペースト組成物及びそれを用いた回路基板 | |
| JPH0227832B2 (ja) | Seramitsukusukiban | |
| JP2733613B2 (ja) | 導電性ペーストおよび回路基板 | |
| JPS58130590A (ja) | セラミツク配線基板および該セラミツク配線基板を用いた厚膜ハイブリツドic | |
| JPS62237605A (ja) | 厚膜ペ−スト | |
| TW202548792A (zh) | 導電性糊、導電膜、陶瓷電路基板及電子零件 | |
| WO2025142516A1 (ja) | 導電性ペースト、導電膜、セラミックス回路基板及び電子部品 | |
| JPS62247589A (ja) | 厚膜回路の製造方法 | |
| JPH0572681B2 (enExample) | ||
| JPH022244B2 (enExample) |