JPH0455137U - - Google Patents
Info
- Publication number
- JPH0455137U JPH0455137U JP9778390U JP9778390U JPH0455137U JP H0455137 U JPH0455137 U JP H0455137U JP 9778390 U JP9778390 U JP 9778390U JP 9778390 U JP9778390 U JP 9778390U JP H0455137 U JPH0455137 U JP H0455137U
- Authority
- JP
- Japan
- Prior art keywords
- characteristic
- semiconductor
- wafer
- measuring instrument
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000005259 measurement Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図はこの考案の実施例１の半導体ウエーハ
の平面図、第２図は第１図のＡ−Ａ線に沿う縦断
面図、第３図は実施例２のウエーハの平面図であ
る。第４図は従来ウエーハの平面図、第５図は第
３図のＢ−Ｂ線に沿う縦断面図である。
１……ドレツシング材、２……半導体素子、３
……目合わせパターン、４……金属電極、５……
特性測定針。
1 is a plan view of a semiconductor wafer according to a first embodiment of this invention, FIG. 2 is a longitudinal sectional view taken along the line A--A in FIG. 1, and FIG. 3 is a plan view of a wafer according to a second embodiment. FIG. 4 is a plan view of a conventional wafer, and FIG. 5 is a longitudinal sectional view taken along line B--B in FIG. 3. 1... Dressing material, 2... Semiconductor element, 3
... Alignment pattern, 4... Metal electrode, 5...
Characteristic measuring needle.
Claims (1)
測定器の測定針を接触させて通電し特定測定を行
う半導体ウエーハにおいて、特性測定器の測定針
のドレツシング材をウエーハの一部分に形成した
ことを特徴とする半導体ウエーハ。 In a semiconductor wafer in which semiconductor elements are formed in a large number of micro-sections and a measuring needle of a characteristic measuring instrument is brought into contact with the semiconductor wafer to conduct a specific measurement, the dressing material for the measuring needle of the characteristic measuring instrument is formed on a part of the wafer. Characteristic semiconductor wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9778390U JPH0455137U (en) | 1990-09-18 | 1990-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9778390U JPH0455137U (en) | 1990-09-18 | 1990-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0455137U true JPH0455137U (en) | 1992-05-12 |
Family
ID=31838457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9778390U Pending JPH0455137U (en) | 1990-09-18 | 1990-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0455137U (en) |
-
1990
- 1990-09-18 JP JP9778390U patent/JPH0455137U/ja active Pending