JPH0452996Y2 - - Google Patents

Info

Publication number
JPH0452996Y2
JPH0452996Y2 JP9641687U JP9641687U JPH0452996Y2 JP H0452996 Y2 JPH0452996 Y2 JP H0452996Y2 JP 9641687 U JP9641687 U JP 9641687U JP 9641687 U JP9641687 U JP 9641687U JP H0452996 Y2 JPH0452996 Y2 JP H0452996Y2
Authority
JP
Japan
Prior art keywords
carrier body
bonding land
cavity
stepped
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9641687U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6413139U (it
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9641687U priority Critical patent/JPH0452996Y2/ja
Publication of JPS6413139U publication Critical patent/JPS6413139U/ja
Application granted granted Critical
Publication of JPH0452996Y2 publication Critical patent/JPH0452996Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP9641687U 1987-06-23 1987-06-23 Expired JPH0452996Y2 (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9641687U JPH0452996Y2 (it) 1987-06-23 1987-06-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9641687U JPH0452996Y2 (it) 1987-06-23 1987-06-23

Publications (2)

Publication Number Publication Date
JPS6413139U JPS6413139U (it) 1989-01-24
JPH0452996Y2 true JPH0452996Y2 (it) 1992-12-14

Family

ID=31321319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9641687U Expired JPH0452996Y2 (it) 1987-06-23 1987-06-23

Country Status (1)

Country Link
JP (1) JPH0452996Y2 (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3718518B2 (ja) 2003-10-03 2005-11-24 日東電工株式会社 光屈折率変調重合体、光屈折率変調重合体組成物および屈折率制御方法

Also Published As

Publication number Publication date
JPS6413139U (it) 1989-01-24

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