JPH0452990Y2 - - Google Patents
Info
- Publication number
- JPH0452990Y2 JPH0452990Y2 JP1987189068U JP18906887U JPH0452990Y2 JP H0452990 Y2 JPH0452990 Y2 JP H0452990Y2 JP 1987189068 U JP1987189068 U JP 1987189068U JP 18906887 U JP18906887 U JP 18906887U JP H0452990 Y2 JPH0452990 Y2 JP H0452990Y2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- workpiece
- arm
- transfer
- standby position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987189068U JPH0452990Y2 (enExample) | 1987-12-11 | 1987-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987189068U JPH0452990Y2 (enExample) | 1987-12-11 | 1987-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0193725U JPH0193725U (enExample) | 1989-06-20 |
| JPH0452990Y2 true JPH0452990Y2 (enExample) | 1992-12-14 |
Family
ID=31480125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987189068U Expired JPH0452990Y2 (enExample) | 1987-12-11 | 1987-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452990Y2 (enExample) |
-
1987
- 1987-12-11 JP JP1987189068U patent/JPH0452990Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0193725U (enExample) | 1989-06-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4531474A (en) | Rotary board treating apparatus | |
| US6159291A (en) | Substrate treating apparatus | |
| JPH04363022A (ja) | 貼付板洗浄装置 | |
| JP3583883B2 (ja) | 自動ウェーハめっき装置 | |
| JP2001291692A (ja) | 単一ウエーハ処理装置 | |
| CN109760437A (zh) | 一种自动化水转印加工方法 | |
| CN111069169A (zh) | 轨道式晶圆清洗干燥整机流水线 | |
| KR100205334B1 (ko) | 도포 장치 | |
| JP2928576B2 (ja) | 五軸可動スプレーガン | |
| JP2000070875A (ja) | 基板洗浄装置および基板洗浄方法 | |
| CN215885422U (zh) | 一种适用于振子装配线的振子构件上料计数设备 | |
| JP3570866B2 (ja) | 基板処理装置 | |
| US12159794B2 (en) | Wafer processing method and carrier | |
| JP2005072429A (ja) | 両面洗浄処理方法及び装置 | |
| CN214982592U (zh) | 电子产品外壳去毛刺设备 | |
| CN217432085U (zh) | 一种带有烘干功能的喷涂装置 | |
| CN112756153A (zh) | 珐琅制品静电喷涂工艺及喷涂设备 | |
| EP0564096B1 (en) | Soldering apparatus | |
| JPS63270574A (ja) | 接着剤塗布装置 | |
| JP2002233832A (ja) | 処理装置 | |
| CN216263369U (zh) | 一种砂型铸造冒口模型的浸涂装置 | |
| CN221948018U (zh) | 自动刷漆装置 | |
| JP2638477B2 (ja) | 保護膜剥離方法および装置 | |
| CN215031571U (zh) | 一种带传输结构的电路板清洗装置 | |
| KR100275135B1 (ko) | 반도체 패키지의 제조공정용 세척장치 및 그를 이용한 세척방법 |