JPH0452393U - - Google Patents

Info

Publication number
JPH0452393U
JPH0452393U JP9441290U JP9441290U JPH0452393U JP H0452393 U JPH0452393 U JP H0452393U JP 9441290 U JP9441290 U JP 9441290U JP 9441290 U JP9441290 U JP 9441290U JP H0452393 U JPH0452393 U JP H0452393U
Authority
JP
Japan
Prior art keywords
socket
cover
chip part
pad
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9441290U
Other languages
Japanese (ja)
Other versions
JPH088553Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9441290U priority Critical patent/JPH088553Y2/en
Publication of JPH0452393U publication Critical patent/JPH0452393U/ja
Application granted granted Critical
Publication of JPH088553Y2 publication Critical patent/JPH088553Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のICソケツトの一実施例によ
る中央縦断面図、第2図は本考案の上記ICソケ
ツトの内部構造を示す縦断面図、第3図は本考案
に係るヒートシンク及び押え手段の構成例を示す
要部縦断面図、第4図は本考案のICソケツトを
適用すべきTABタイプのICパツケージの概略
構成を示す平面図、第5図は本考案に係るカム板
及びノブの組立分解斜視図、第6図は本考案に係
る上記カム板の平面図、第7図は本考案に係る上
記ノブのロツド部及び止め具の組立分解斜視図、
第8図及び第9図は本考案に係る押え部材のため
の支持枠の縦断面図及び平面図である。 1……ソケツト本体、2……カバー、3……コ
ンタクトピン、4,6,6′……ガイドピン、5
……メインガイドピン、7……ストツパ、8……
ヒートシンク、9……押さえ手段、10……放熱
棒、11……放熱板、12……カム板、13……
ノブ、14……止め具、15……支持枠、16…
…押さえ部材、17……圧縮コイルスプリング。
FIG. 1 is a central vertical cross-sectional view of an embodiment of the IC socket of the present invention, FIG. 2 is a vertical cross-sectional view showing the internal structure of the IC socket of the present invention, and FIG. 3 is a heat sink and holding means according to the present invention. FIG. 4 is a plan view showing a schematic configuration of a TAB type IC package to which the IC socket of the present invention is applied, and FIG. 5 is a diagram of a cam plate and knob according to the present invention. FIG. 6 is a plan view of the cam plate according to the present invention; FIG. 7 is an exploded perspective view of the rod portion and stopper of the knob according to the present invention;
8 and 9 are a longitudinal sectional view and a plan view of a support frame for a presser member according to the present invention. 1...Socket body, 2...Cover, 3...Contact pin, 4, 6, 6'...Guide pin, 5
...Main guide pin, 7...Stopper, 8...
Heat sink, 9... Pressing means, 10... Heat radiation rod, 11... Heat radiation plate, 12... Cam plate, 13...
Knob, 14... Stopper, 15... Support frame, 16...
...Press member, 17...Compression coil spring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数のコンタクトピンを列設したソケツト本体
とパツド付きカバーとを有していて、チツプ部及
びその周囲のリード部から成るICデイバイスを
装着して上記パツド部の押圧によつて上記リード
部を上記コンタクトピンに接触せしめると共に、
ヒートシンクを付設して上記チツプ部の放熱を図
るようにしたICソケツトにおいて、上記ソケツ
ト本体側で上記チツプ部の下側にヒートシンクを
設置すると共に、上記カバーに上記チツプ部に対
する押さえ手段を設け、上記カバーに閉蓋の際に
上記押さえ手段が上記パツド部よりも遅れて上記
チツプ部を押圧するようにしたことを特徴とする
ICソケツト。
It has a socket main body with a large number of contact pins arranged in a row, and a cover with a pad, and an IC device consisting of a chip part and a lead part around it is attached, and the lead part is moved above by pressing the pad part. While contacting the contact pin,
In an IC socket that is provided with a heat sink to dissipate heat from the chip part, the heat sink is installed below the chip part on the side of the socket body, and a pressing means for the chip part is provided on the cover, An IC socket characterized in that the pressing means presses the tip portion later than the pad portion when the cover is closed.
JP9441290U 1990-09-07 1990-09-07 IC socket Expired - Lifetime JPH088553Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9441290U JPH088553Y2 (en) 1990-09-07 1990-09-07 IC socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9441290U JPH088553Y2 (en) 1990-09-07 1990-09-07 IC socket

Publications (2)

Publication Number Publication Date
JPH0452393U true JPH0452393U (en) 1992-05-01
JPH088553Y2 JPH088553Y2 (en) 1996-03-06

Family

ID=31832327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9441290U Expired - Lifetime JPH088553Y2 (en) 1990-09-07 1990-09-07 IC socket

Country Status (1)

Country Link
JP (1) JPH088553Y2 (en)

Also Published As

Publication number Publication date
JPH088553Y2 (en) 1996-03-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term