JPH0451043B2 - - Google Patents
Info
- Publication number
- JPH0451043B2 JPH0451043B2 JP61202608A JP20260886A JPH0451043B2 JP H0451043 B2 JPH0451043 B2 JP H0451043B2 JP 61202608 A JP61202608 A JP 61202608A JP 20260886 A JP20260886 A JP 20260886A JP H0451043 B2 JPH0451043 B2 JP H0451043B2
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- thick film
- atmosphere
- nitrous oxide
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Inorganic Insulating Materials (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US797092 | 1985-11-12 | ||
| US06/797,092 US4622240A (en) | 1985-11-12 | 1985-11-12 | Process for manufacturing thick-film electrical components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62114205A JPS62114205A (ja) | 1987-05-26 |
| JPH0451043B2 true JPH0451043B2 (show.php) | 1992-08-18 |
Family
ID=25169878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61202608A Granted JPS62114205A (ja) | 1985-11-12 | 1986-08-28 | 厚膜電気部品の製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4622240A (show.php) |
| EP (1) | EP0222075B1 (show.php) |
| JP (1) | JPS62114205A (show.php) |
| KR (1) | KR900001799B1 (show.php) |
| BR (1) | BR8604444A (show.php) |
| CA (1) | CA1250054A (show.php) |
| DE (1) | DE3682568D1 (show.php) |
| ES (1) | ES2002282A6 (show.php) |
| ZA (1) | ZA866245B (show.php) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0308851A3 (en) * | 1987-09-24 | 1990-03-21 | Air Products And Chemicals, Inc. | A process for the manufacture of copper thick-film conductors using an infrared furnace |
| CA2007199C (en) * | 1989-02-03 | 1993-05-18 | Satish S. Tamhankar | Single atmosphere for firing copper compatible thick film materials |
| US5302412A (en) * | 1989-02-03 | 1994-04-12 | The Boc Group, Inc. | Single atmosphere for firing compatible thick film material |
| US5194294A (en) * | 1989-02-20 | 1993-03-16 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits |
| US4994436A (en) * | 1989-03-10 | 1991-02-19 | American Air Liquide | Process for safely destroying organic binders in ceramic components during the firing process |
| FR2644665B1 (fr) * | 1989-03-16 | 1996-05-03 | Air Liquide | Procede d'elaboration de moyens de connexions electriques, en particulier de substrats d'interconnexion pour circuits hybrides |
| US5102990A (en) * | 1989-08-09 | 1992-04-07 | Rhomed Incorporated | Direct radiolabeling of antibodies and other proteins with technetium or rhenium |
| US5601684A (en) * | 1992-09-03 | 1997-02-11 | Olympus Optical Co., Ltd. | Method for manufacturing an ion flow electrostatic recording head |
| US5916401A (en) * | 1994-04-05 | 1999-06-29 | The University Of Queensland | Coating of substrates |
| US6395206B1 (en) | 2000-06-05 | 2002-05-28 | Praxair Technology, Inc. | Method of removing an organic binder from a green ceramic form |
| JP2004050223A (ja) * | 2002-07-19 | 2004-02-19 | Denso Corp | アルミニウム製品のろう付け方法とその炉 |
| DE102009002664A1 (de) * | 2009-04-27 | 2010-10-28 | Sintertechnik Gmbh | Kommutatoranordnung für einen Elektrokleinmotor |
| JP5826656B2 (ja) * | 2012-02-06 | 2015-12-02 | 日東電工株式会社 | 導電性フィルムロールの製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3914517A (en) * | 1971-02-23 | 1975-10-21 | Owens Illinois Inc | Method of forming a conductively coated crystalline glass article and product produced thereby |
| US3726006A (en) * | 1971-04-28 | 1973-04-10 | Us Army | Method for sintering thick-film oxidizable silk-screened circuitry |
| US3914514A (en) * | 1973-08-16 | 1975-10-21 | Trw Inc | Termination for resistor and method of making the same |
| US4122232A (en) * | 1975-04-21 | 1978-10-24 | Engelhard Minerals & Chemicals Corporation | Air firable base metal conductors |
| GB2050327B (en) * | 1979-03-21 | 1983-05-25 | Plessey Inc | Thick film circuits |
| US4296272A (en) * | 1979-11-30 | 1981-10-20 | Rca Corporation | Composite substrate |
| US4313262A (en) * | 1979-12-17 | 1982-02-02 | General Electric Company | Molybdenum substrate thick film circuit |
| US4409261A (en) * | 1980-02-07 | 1983-10-11 | Cts Corporation | Process for air firing oxidizable conductors |
| DE3004606A1 (de) * | 1980-02-08 | 1981-08-13 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zum einbrennen von dickschicht-nichtedelmetall-pasten und vorrichtung zur durchfuehrung des verfahrens |
| US4517155A (en) * | 1982-05-18 | 1985-05-14 | Union Carbide Corporation | Copper base metal termination for multilayer ceramic capacitors |
| US4567111A (en) * | 1982-11-04 | 1986-01-28 | Uop Inc. | Conductive pigment-coated surfaces |
| JPS6021888A (ja) * | 1983-07-18 | 1985-02-04 | 工業技術院長 | セラミツクスのメタライズ法 |
| US4540604A (en) * | 1983-08-25 | 1985-09-10 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions |
| JPS60250686A (ja) * | 1984-05-25 | 1985-12-11 | 日本碍子株式会社 | セラミツク配線基板の製造方法 |
-
1985
- 1985-11-12 US US06/797,092 patent/US4622240A/en not_active Expired - Fee Related
-
1986
- 1986-08-12 CA CA000515813A patent/CA1250054A/en not_active Expired
- 1986-08-13 DE DE8686111222T patent/DE3682568D1/de not_active Expired - Lifetime
- 1986-08-13 EP EP86111222A patent/EP0222075B1/en not_active Expired - Lifetime
- 1986-08-19 ZA ZA866245A patent/ZA866245B/xx unknown
- 1986-08-28 JP JP61202608A patent/JPS62114205A/ja active Granted
- 1986-09-04 ES ES8601641A patent/ES2002282A6/es not_active Expired
- 1986-09-09 KR KR1019860007525A patent/KR900001799B1/ko not_active Expired
- 1986-09-12 BR BR8604444A patent/BR8604444A/pt unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP0222075A2 (en) | 1987-05-20 |
| EP0222075A3 (en) | 1989-02-08 |
| ES2002282A6 (es) | 1988-08-01 |
| KR870004737A (ko) | 1987-06-01 |
| KR900001799B1 (ko) | 1990-03-24 |
| BR8604444A (pt) | 1987-11-17 |
| EP0222075B1 (en) | 1991-11-21 |
| DE3682568D1 (de) | 1992-01-02 |
| ZA866245B (en) | 1988-04-27 |
| CA1250054A (en) | 1989-02-14 |
| JPS62114205A (ja) | 1987-05-26 |
| US4622240A (en) | 1986-11-11 |
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