ES2002282A6 - Un metodo de fabricacion de circuitos de pelicula gruesa. - Google Patents

Un metodo de fabricacion de circuitos de pelicula gruesa.

Info

Publication number
ES2002282A6
ES2002282A6 ES8601641A ES8601641A ES2002282A6 ES 2002282 A6 ES2002282 A6 ES 2002282A6 ES 8601641 A ES8601641 A ES 8601641A ES 8601641 A ES8601641 A ES 8601641A ES 2002282 A6 ES2002282 A6 ES 2002282A6
Authority
ES
Spain
Prior art keywords
electrical components
film electrical
manufacturing thick
thick
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8601641A
Other languages
English (en)
Spanish (es)
Inventor
Walter Francis Yext
Edward Andrew Hayduk
Clark Kenneth Fisher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Products and Chemicals Inc
Original Assignee
Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Products and Chemicals Inc filed Critical Air Products and Chemicals Inc
Publication of ES2002282A6 publication Critical patent/ES2002282A6/es
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Capacitors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inorganic Insulating Materials (AREA)
  • Conductive Materials (AREA)
ES8601641A 1985-11-12 1986-09-04 Un metodo de fabricacion de circuitos de pelicula gruesa. Expired ES2002282A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/797,092 US4622240A (en) 1985-11-12 1985-11-12 Process for manufacturing thick-film electrical components

Publications (1)

Publication Number Publication Date
ES2002282A6 true ES2002282A6 (es) 1988-08-01

Family

ID=25169878

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8601641A Expired ES2002282A6 (es) 1985-11-12 1986-09-04 Un metodo de fabricacion de circuitos de pelicula gruesa.

Country Status (9)

Country Link
US (1) US4622240A (show.php)
EP (1) EP0222075B1 (show.php)
JP (1) JPS62114205A (show.php)
KR (1) KR900001799B1 (show.php)
BR (1) BR8604444A (show.php)
CA (1) CA1250054A (show.php)
DE (1) DE3682568D1 (show.php)
ES (1) ES2002282A6 (show.php)
ZA (1) ZA866245B (show.php)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0308851A3 (en) * 1987-09-24 1990-03-21 Air Products And Chemicals, Inc. A process for the manufacture of copper thick-film conductors using an infrared furnace
CA2007199C (en) * 1989-02-03 1993-05-18 Satish S. Tamhankar Single atmosphere for firing copper compatible thick film materials
US5302412A (en) * 1989-02-03 1994-04-12 The Boc Group, Inc. Single atmosphere for firing compatible thick film material
US5194294A (en) * 1989-02-20 1993-03-16 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits
US4994436A (en) * 1989-03-10 1991-02-19 American Air Liquide Process for safely destroying organic binders in ceramic components during the firing process
FR2644665B1 (fr) * 1989-03-16 1996-05-03 Air Liquide Procede d'elaboration de moyens de connexions electriques, en particulier de substrats d'interconnexion pour circuits hybrides
US5102990A (en) * 1989-08-09 1992-04-07 Rhomed Incorporated Direct radiolabeling of antibodies and other proteins with technetium or rhenium
US5601684A (en) * 1992-09-03 1997-02-11 Olympus Optical Co., Ltd. Method for manufacturing an ion flow electrostatic recording head
US5916401A (en) * 1994-04-05 1999-06-29 The University Of Queensland Coating of substrates
US6395206B1 (en) 2000-06-05 2002-05-28 Praxair Technology, Inc. Method of removing an organic binder from a green ceramic form
JP2004050223A (ja) * 2002-07-19 2004-02-19 Denso Corp アルミニウム製品のろう付け方法とその炉
DE102009002664A1 (de) * 2009-04-27 2010-10-28 Sintertechnik Gmbh Kommutatoranordnung für einen Elektrokleinmotor
JP5826656B2 (ja) * 2012-02-06 2015-12-02 日東電工株式会社 導電性フィルムロールの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3914517A (en) * 1971-02-23 1975-10-21 Owens Illinois Inc Method of forming a conductively coated crystalline glass article and product produced thereby
US3726006A (en) * 1971-04-28 1973-04-10 Us Army Method for sintering thick-film oxidizable silk-screened circuitry
US3914514A (en) * 1973-08-16 1975-10-21 Trw Inc Termination for resistor and method of making the same
US4122232A (en) * 1975-04-21 1978-10-24 Engelhard Minerals & Chemicals Corporation Air firable base metal conductors
GB2050327B (en) * 1979-03-21 1983-05-25 Plessey Inc Thick film circuits
US4296272A (en) * 1979-11-30 1981-10-20 Rca Corporation Composite substrate
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
DE3004606A1 (de) * 1980-02-08 1981-08-13 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum einbrennen von dickschicht-nichtedelmetall-pasten und vorrichtung zur durchfuehrung des verfahrens
US4517155A (en) * 1982-05-18 1985-05-14 Union Carbide Corporation Copper base metal termination for multilayer ceramic capacitors
US4567111A (en) * 1982-11-04 1986-01-28 Uop Inc. Conductive pigment-coated surfaces
JPS6021888A (ja) * 1983-07-18 1985-02-04 工業技術院長 セラミツクスのメタライズ法
US4540604A (en) * 1983-08-25 1985-09-10 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法

Also Published As

Publication number Publication date
EP0222075A2 (en) 1987-05-20
EP0222075A3 (en) 1989-02-08
KR870004737A (ko) 1987-06-01
KR900001799B1 (ko) 1990-03-24
BR8604444A (pt) 1987-11-17
EP0222075B1 (en) 1991-11-21
DE3682568D1 (de) 1992-01-02
ZA866245B (en) 1988-04-27
CA1250054A (en) 1989-02-14
JPS62114205A (ja) 1987-05-26
JPH0451043B2 (show.php) 1992-08-18
US4622240A (en) 1986-11-11

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Legal Events

Date Code Title Description
SA6 Expiration date (snapshot 920101)

Free format text: 2006-09-04