JPH0450145Y2 - - Google Patents
Info
- Publication number
- JPH0450145Y2 JPH0450145Y2 JP1985158064U JP15806485U JPH0450145Y2 JP H0450145 Y2 JPH0450145 Y2 JP H0450145Y2 JP 1985158064 U JP1985158064 U JP 1985158064U JP 15806485 U JP15806485 U JP 15806485U JP H0450145 Y2 JPH0450145 Y2 JP H0450145Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- bonding pad
- die pad
- substrate
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158064U JPH0450145Y2 (US07847105-20101207-C00016.png) | 1985-10-16 | 1985-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158064U JPH0450145Y2 (US07847105-20101207-C00016.png) | 1985-10-16 | 1985-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6265276U JPS6265276U (US07847105-20101207-C00016.png) | 1987-04-23 |
| JPH0450145Y2 true JPH0450145Y2 (US07847105-20101207-C00016.png) | 1992-11-26 |
Family
ID=31081197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985158064U Expired JPH0450145Y2 (US07847105-20101207-C00016.png) | 1985-10-16 | 1985-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0450145Y2 (US07847105-20101207-C00016.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58218164A (ja) * | 1982-05-31 | 1983-12-19 | Nec Home Electronics Ltd | 厚膜印刷基板 |
| JPS59193596A (ja) * | 1983-04-18 | 1984-11-02 | Kyodo Printing Co Ltd | Ｉｃカ−ド用ｉｃモジユ−ル |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158443U (ja) * | 1982-04-14 | 1983-10-22 | ニチコン株式会社 | 混成集積回路基板 |
-
1985
- 1985-10-16 JP JP1985158064U patent/JPH0450145Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58218164A (ja) * | 1982-05-31 | 1983-12-19 | Nec Home Electronics Ltd | 厚膜印刷基板 |
| JPS59193596A (ja) * | 1983-04-18 | 1984-11-02 | Kyodo Printing Co Ltd | Ｉｃカ−ド用ｉｃモジユ−ル |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6265276U (US07847105-20101207-C00016.png) | 1987-04-23 |
