JPH0448638U - - Google Patents
Info
- Publication number
- JPH0448638U JPH0448638U JP9232590U JP9232590U JPH0448638U JP H0448638 U JPH0448638 U JP H0448638U JP 9232590 U JP9232590 U JP 9232590U JP 9232590 U JP9232590 U JP 9232590U JP H0448638 U JPH0448638 U JP H0448638U
- Authority
- JP
- Japan
- Prior art keywords
- heat spreader
- hole
- base substrate
- power semiconductor
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000605 extraction Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の一実施例によるヒートスプレ
ツダー及び端子の斜視図、第２図ａ及びｂはそれ
ぞれ第１図のヒートスプレツダー及び端子を用い
た電力半導体装置の平面図及び断面図、第３図は
本考案の他の実施例によるヒートスプレツダー及
び端子の斜視図、第４図は従来例によるヒートス
プレツダー及び端子の斜視図である。 ２……電極取出用端子、２′……底部、３……
ヒートスプレツダー、４……孔部、５……金属ベ
ース基板。
ツダー及び端子の斜視図、第２図ａ及びｂはそれ
ぞれ第１図のヒートスプレツダー及び端子を用い
た電力半導体装置の平面図及び断面図、第３図は
本考案の他の実施例によるヒートスプレツダー及
び端子の斜視図、第４図は従来例によるヒートス
プレツダー及び端子の斜視図である。 ２……電極取出用端子、２′……底部、３……
ヒートスプレツダー、４……孔部、５……金属ベ
ース基板。
Claims (1)
- 【実用新案登録請求の範囲】 金属ベース基板と、該金属ベース基板上に搭載
されたヒートスプレツダーと、該ヒートスプレツ
ダーにハンダ付けされる電極取出用端子とを有し
てなる電力半導体装置において、 前記ヒートスプレツダーに孔部を設け、該孔部
内において前記電極取出用端子の底部を前記ヒー
トスプレツダーにハンダ付けしてなることを特徴
とする電力半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9232590U JPH0448638U (ja) | 1990-08-30 | 1990-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9232590U JPH0448638U (ja) | 1990-08-30 | 1990-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448638U true JPH0448638U (ja) | 1992-04-24 |
Family
ID=31828683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9232590U Pending JPH0448638U (ja) | 1990-08-30 | 1990-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448638U (ja) |
-
1990
- 1990-08-30 JP JP9232590U patent/JPH0448638U/ja active Pending