JPH0442750U - - Google Patents
Info
- Publication number
- JPH0442750U JPH0442750U JP8484090U JP8484090U JPH0442750U JP H0442750 U JPH0442750 U JP H0442750U JP 8484090 U JP8484090 U JP 8484090U JP 8484090 U JP8484090 U JP 8484090U JP H0442750 U JPH0442750 U JP H0442750U
- Authority
- JP
- Japan
- Prior art keywords
- view
- semiconductor device
- electrode lead
- power semiconductor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000000605 extraction Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Description
第１図は本考案の一実施例による電極取出し用
端子の斜視図、第２図ａ及びｂはそれぞれ第１図
の電極取出し用端子を形成するための金属板の正
面図及び側面図、第３図ａ及びｂは、それぞれ第
１図の電極取出し用端子を形成するための他の金
属板の正面図及び側面図、第４図ａ及びｂは、そ
れぞれ第１図の電極取出し用端子を使用した電力
半導体装置の平面図及び側面図、第５図は本考案
の他の実施例による電極取出し用端子の斜視図、
第６図は本考案のさらに他の実施例による電極取
出し用端子の斜視図、第７図は従来例による電極
取出し用端子の斜視図である。 １……電極取出し用端子、２……半田付部。
端子の斜視図、第２図ａ及びｂはそれぞれ第１図
の電極取出し用端子を形成するための金属板の正
面図及び側面図、第３図ａ及びｂは、それぞれ第
１図の電極取出し用端子を形成するための他の金
属板の正面図及び側面図、第４図ａ及びｂは、そ
れぞれ第１図の電極取出し用端子を使用した電力
半導体装置の平面図及び側面図、第５図は本考案
の他の実施例による電極取出し用端子の斜視図、
第６図は本考案のさらに他の実施例による電極取
出し用端子の斜視図、第７図は従来例による電極
取出し用端子の斜視図である。 １……電極取出し用端子、２……半田付部。
Claims (1)
- 【実用新案登録請求の範囲】 基板と、該基板に半田付けされる電極取出し用
端子とを備えてなる電力半導体装置において、 前記電極取出し用端子の前記基板への半田付け
部をわく状に形成してなることを特徴とする電力
半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8484090U JPH0442750U (ja) | 1990-08-09 | 1990-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8484090U JPH0442750U (ja) | 1990-08-09 | 1990-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442750U true JPH0442750U (ja) | 1992-04-10 |
Family
ID=31633589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8484090U Pending JPH0442750U (ja) | 1990-08-09 | 1990-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442750U (ja) |
-
1990
- 1990-08-09 JP JP8484090U patent/JPH0442750U/ja active Pending